公开(公告)号：US10423199B2

公开(公告)日：2019-09-24

申请号：US15665873

申请日：2017-08-01

Applicant: Intel Corporation

Inventor： Jeremy Burr ,  David W. Browning ,  Shawn S. McEuen ,  Mark MacDonald ,  Matthew D. Coakley

IPC: G06F1/16 ,  H05K5/00 ,  H05K7/00 ,  G06F1/20

Abstract: In one example a electronic device comprises a housing, at least one heat generating component disposed within the housing, at least one internal heat dissipation device positioned proximate the at least one heat generating component, and a thermal interface defined in at least a portion of the housing to allow direct thermal contact between the heat dissipation device and an external heat dissipation device. Other examples may be described.

公开(公告)号：US20190158958A1

公开(公告)日：2019-05-23

申请号：US16251340

申请日：2019-01-18

Applicant: Intel Corporation

Inventor： Rajesh Poornachandran ,  David Gottardo ,  Swarnendu Kar ,  Saurabh Dadu ,  Mark MacDonald

IPC: H04R5/04 ,  H04S7/00 ,  H04R1/10 ,  G10L25/30 ,  G10L25/51

CPC classification number: H04R5/04 ,  G10L25/30 ,  G10L25/51 ,  H04R1/1008 ,  H04R1/1041 ,  H04R2420/01 ,  H04S7/40

Abstract: A wearable device for binaural audio is described. The wearable device includes a feedback mechanism, a microphone, an always on binaural recorder (AOBR), and a processor. The AOBR is to capture ambient noise via the microphone and interpret the ambient noise. An alert is issued by the processor to the feedback mechanism based on a notification detected via the microphone in the ambient noise.

公开(公告)号：US20190040554A1

公开(公告)日：2019-02-07

申请号：US15860553

申请日：2018-01-02

Applicant: Intel Corporation

Inventor： David Pidwerbecki ,  Mark MacDonald

IPC: D03D1/00

Abstract: Heat spreading cloths, associated devices, systems, and methods can include a plurality of attached polymeric fibers that are thermally conductive and electrically insulative. The heat spreading cloth can be configured to couple an electronic component thereto in a heat spreading relationship.

公开(公告)号：US09980412B2

公开(公告)日：2018-05-22

申请号：US15280746

申请日：2016-09-29

Applicant: Intel Corporation

Inventor： Bo Qiu ,  Xi Guo ,  James C. Raupp ,  Michael Ahrens ,  David Pidwerbecki ,  Steven J. Lofland ,  George H. Daskalakis ,  Stacy L. Yee ,  Mark MacDonald

IPC: H05K7/20 ,  G06F1/16 ,  H05K5/00 ,  H05K5/02 ,  G06F1/20 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K7/20509 ,  G06F1/1681 ,  G06F1/203 ,  H05K1/0203 ,  H05K1/0204 ,  H05K1/0209 ,  H05K1/181 ,  H05K5/0017 ,  H05K5/0226 ,  H05K7/20409 ,  H05K7/20963 ,  H05K2201/066

Abstract: Apparatuses, systems and methods associated with flexible heat spreader design are disclosed herein. In embodiments, an electronic device may include a component, a heat dissipation member, and a flexible member. The heat dissipation member may be coupled to the component via a flexible portion of the electronic device, the component located on a first side of the flexible portion and the heat dissipation member located on a second side of the flexible portion. The flexible member may be thermally coupled to the component and the heat dissipation member, wherein the flexible member extends along the flexible portion from the first side to the second side and is to transfer heat from the component to the heat dissipation member. Other embodiments may be described and/or claimed.

公开(公告)号：US20180005522A1

公开(公告)日：2018-01-04

申请号：US15201545

申请日：2016-07-04

Applicant: Intel Corporation

Inventor： Saranga P. Pogula ,  Manoj Velayudha ,  Kishor G. Kulkarni ,  Yoshifumi Nishi ,  David W. Browning ,  Mark MacDonald

IPC: G08G1/087

CPC classification number: G08G1/087

Abstract: Methods and apparatus relating to IoT (Internet of Things) and/or cloud enabled faster ambulances are described. In an embodiment, an IoT device overrides an operating state of an illumination device based at least in part on a wireless signal that indicates approachment of a moving object. The IoT device then cancels the override of the operating state of the illumination device based at least in part on an indication that the moving object has crossed a location of the illumination device. In one embodiment, cloud-based logic determines whether and/or when the IoT device causes the override of the operating state of the illumination device. Other embodiments are also disclosed and claimed.

公开(公告)号：US20180001179A1

公开(公告)日：2018-01-04

申请号：US15201358

申请日：2016-07-01

Applicant: Intel Corporation

Inventor： Andrew Larson ,  Mark E. Sprenger ,  Ralph V. Miele ,  Eric D. McAfee ,  Mark MacDonald

IPC: A63B71/06

CPC classification number: A63B71/0605 ,  A63B63/004 ,  A63B63/008 ,  A63B69/0013 ,  A63B71/0622 ,  A63B2024/0028 ,  A63B2071/0625 ,  A63B2071/0666 ,  A63B2102/14 ,  A63B2102/18 ,  A63B2102/182 ,  A63B2207/02 ,  A63B2220/40 ,  A63B2220/62 ,  A63B2220/801 ,  A63B2220/806 ,  A63B2220/89 ,  A63B2225/20 ,  A63B2225/50 ,  A63B2243/0025 ,  A63B2243/007

Abstract: Briefly, in accordance with one or more embodiments, a smart base for a baseball system or a softball system comprises a sensor to detect a first time at which a runner has touched the smart base, a radio-frequency (RF) receiver to receive a signal from a smart baseball that indicates a second time at which the smart baseball was caught, timing circuitry to detect if the second time occurs before or after the first time; and indicator circuitry to indicate a force out if the second time occurs before the first time.

公开(公告)号：US09568972B2

公开(公告)日：2017-02-14

申请号：US14273613

申请日：2014-05-09

Applicant: Intel Corporation

Inventor： Mark Yarvis ,  Samuel Benn ,  Soethiha Soe ,  Mark MacDonald ,  Dominic Fulginiti

IPC: G06F1/26 ,  G06F1/32

CPC classification number: G06F1/3287 ,  G06F1/26 ,  G06F1/32 ,  G06F1/3209 ,  G06F1/3212 ,  G06F1/3293 ,  H04W52/0254 ,  H04W52/0277 ,  Y02D10/122 ,  Y02D10/171 ,  Y02D10/174 ,  Y02D70/00 ,  Y02D70/1262 ,  Y02D70/142 ,  Y02D70/144 ,  Y02D70/164 ,  Y02D70/168 ,  Y02D70/23 ,  Y02D70/26

Abstract: Techniques related to coordinating power management for multiple devices are discussed. Such techniques may include establishing communications between devices, inventorying the components of each device, and implementing a power management plan to eliminate any redundancy in the components and reduce the total power consumed by the devices.

Abstract translation: 讨论了与多个设备协调电源管理相关的技术。 这样的技术可以包括建立设备之间的通信，盘点每个设备的组件，以及实现电力管理计划以消除组件中的任何冗余并减少设备消耗的总功率。

公开(公告)号：US09551352B2

公开(公告)日：2017-01-24

申请号：US13930258

申请日：2013-06-28

Applicant: Intel Corporation

Inventor： Mark MacDonald ,  Douglas Heymann ,  Jered H. Wikander ,  Yoshifumi Nishi

IPC: F04D29/38 ,  F04D29/28 ,  F04D29/66 ,  G06F1/20 ,  F04D29/22 ,  F04D29/30 ,  B21D53/26 ,  F04D17/04 ,  F04D17/16 ,  F04D25/06

CPC classification number: F04D29/281 ,  B21D53/267 ,  F04D17/04 ,  F04D17/167 ,  F04D25/0613 ,  F04D29/023 ,  F04D29/2227 ,  F04D29/30 ,  F04D29/666 ,  F05D2250/191 ,  F05D2300/514 ,  G06F1/203 ,  Y10T29/49826

Abstract: Embodiments of an apparatus, system, method and techniques are described for an improved volumetric resistance blower and rotor. An apparatus may comprise, for example a motor, a casing having one or more inlets and one or more outlets, and a cylindrical rotor to create a volumetric resistance inside the casing, at least a portion of the rotor comprising a porous material. Other embodiments are described.

Abstract translation: 对改进的体积电阻鼓风机和转子描述了装置，系统，方法和技术的实施例。 装置可以包括例如电动机，具有一个或多个入口和一个或多个出口的壳体，以及在壳体内产生体积电阻的圆柱形转子，至少一部分转子包括多孔材料。 描述其他实施例。

公开(公告)号：US09436240B2

公开(公告)日：2016-09-06

申请号：US13728198

申请日：2012-12-27

Applicant: INTEL CORPORATION

Inventor： Mark MacDonald

IPC: G06F1/20 ,  G06F1/16

CPC classification number: G06F1/3262 ,  G06F1/1626 ,  G06F1/1632 ,  G06F1/203 ,  G06F1/206 ,  G06F1/3296

Abstract: An electronic device is provided that includes a base, a processor, and a tablet having a front surface, a rear surface and a bottom edge surface. A processor may operate at a first operating condition when the tablet is coupled to the base, and the processor may operate at a second operating condition when the tablet is not coupled to the base. The tablet may include a heat conducting device and an active edge. The heat conducting device may conduct heat from the processor to the active edge where the heat may be dissipated using supplemental cooling.

Abstract translation: 提供一种电子设备，其包括具有前表面，后表面和底边表面的基座，处理器和平板电脑。 当平板电脑耦合到基座时，处理器可以在第一操作条件下操作，并且当平板电脑未耦合到基座时，处理器可以在第二操作条件下操作。 片剂可以包括导热装置和活性边缘。 导热装置可以将热量从处理器传导到有源边缘，其中可以使用补充冷却来散热。

公开(公告)号：US09342107B2

公开(公告)日：2016-05-17

申请号：US14229840

申请日：2014-03-29

Applicant: Intel Corporation

Inventor： Mark MacDonald

IPC: G06F1/16

CPC classification number: G06F1/1654 ,  G01L19/00 ,  G06F1/1616 ,  G06F1/1626 ,  G06F1/1669 ,  G06F1/1679 ,  H04B5/0031

Abstract: Particular embodiments described herein provide for an electronic device that could include a keyboard portion, an attachment mechanism, and a pump located in the keyboard portion that creates a pressure differential in the attachment mechanism such that a display portion can be attached to the keyboard portion. Other particular embodiments described herein provide for an electronic device that could include a display portion, an attachment mechanism located on the display portion, and a pump located in the display portion that can create a pressure differential in the attachment mechanism such that the display portion can be attached to a surface or device.

Abstract translation: 本文所述的特定实施例提供了一种电子设备，其可以包括键盘部分，附接机构和位于键盘部分中的泵，其在附接机构中产生压差，使得显示部分可以附接到键盘部分。 本文所述的其它特定实施例提供了一种电子设备，其可以包括显示部分，位于显示部分上的附接机构以及位于显示部分中的泵，其能够在附接机构中产生压力差，使得显示部分可以 连接到表面或设备。