Abstract:
An arrangement for reducing the electric field strength on the face of an electrode, wherein the face of the electrode is surrounded by at least one electric barrier, and a shielding electrode having a defined voltage potential is disposed in the vicinity of the face of the electrode. By using a retaining element that can be connected directly to the face of the electrode, the shielding wires can be quickly and easily positioned and fixed relative to the face of the electrode and the shielding electrode relative to the face.
Abstract:
The invention relates to a device for identifying an object (1) having a surface that is at least partially metal and which comprises an identification tag (2) and an antenna (3) that is fixed at least indirectly to the metal surface. According to the invention, a surface electric contact or a tight capacitive coupling is arranged between the metal surface and the antenna (3).
Abstract:
The invention relates to a method for eliminating unwanted accompanying substances, particularly fragrance, flavor, and colour components, from vegetable proteins. Said method encompasses the following steps: (i) a vegetable raw material is extracted using an extracting agent such that, a vegetable protein extract is obtained; (ii) an inorganic adsorber material is added to the vegetable protein extract, a process in which unwanted accompanying substances, especially fragrance, flavor, and/or colour components, are bonded to the inorganic adsorber material.
Abstract:
A method for producing sausage products based on fish meat, wherein fish meat is processed with ice to provide a base meat. The ice is at a temperature below minus 10° C. and that at least part of the fish meat comes from a fresh water catfish of the genus Heterobranchia.
Abstract:
A solvent-free multilayer laminated material comprises a lower substrate layer comprising a thermoplastic polymer or a mixture of thermoplastic polymers, an intermediate layer arranged thereon and comprising a flexible material, a further fibrous intermediate layer comprising plastic, which is provided with an adhesive material and an upper layer comprising metal, comprising plastic or comprising wood or wood-like materials. It does surprisingly not show any deformation even under exposure to temperatures of about 80° C. over a period of up to 40 days and can be used for the production of articles of furniture, floor coverings, wall panels or shaped articles for the electrical, construction or automotive industry.
Abstract:
A method and a device for the optical distance measurement and for the optical detection of objects with an at least partially specular reflective surface (12) wherein light through the specular reflective surface (12) and a diffuse scattering at a reflector (4) is directed to light receiving means and detected there.
Abstract:
In a process for the production of a flame-resistant, pourable, latently reactive, phenolically curable epoxy resin molding material for the encapsulating of electronic components, a latently reactive prepolymer epoxy resin mixture in powder form which is free of isocyanate groups is produced at reaction temperatures up to 200° C. from a thermally polymerizable, filler-containing reaction resin mixture of polyepoxy resin consisting of a mixture of bi-functional and multi-functional epoxy resins and polyisocyanate resin having a molar ratio of the epoxy groups to the isocyanate groups of >1:1 with a substituted imidazole as reaction accelerator in a concentration of 0.5 to 2.5% by weight, relative to polyepoxy resin, and the prepolymer epoxy resin mixture is mixed with a powdered filler-containing phenolic resin mixture in a molar ratio of the epoxy groups to the phenolic hydroxyl groups of 1:0.4 to 1:1.1.
Abstract:
An optoelectronic component having an outer surface facing the environment of the optoelectronic component and which is formed by a hydrophobic layer applied at least partly on a surface of the optoelectronic component.
Abstract:
A method for producing luminous means proposes providing a carrier serving as a heat sink, said carrier comprising a planar chip mounting region. The planar chip mounting region is structured for the purpose of producing a first partial region and at least one second partial region. In this case, the first partial region has a solder-repellent property after structuring. Afterward, a solder is applied to the planar chip mounting region, such that said solder wets the at least one second partial region. At least one optoelectronic body is fixed into the at least one second partial region with the solder at the carrier. Finally, contact-connections are formed for the purpose of feeding electrical energy to the optoelectronic luminous body.