公开(公告)号：US5010232A

公开(公告)日：1991-04-23

申请号：US468914

申请日：1990-01-23

申请人： Kunio Arai ,  Yasuhiko Kanaya

发明人： Kunio Arai ,  Yasuhiko Kanaya

IPC分类号： B23B41/00 ,  B23K26/00 ,  B23K26/38 ,  B23P23/00 ,  H05K1/03 ,  H05K3/00 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46

CPC分类号： B23K26/0093 ,  B23K26/386 ,  B23K26/40 ,  B23K26/402 ,  B23P23/00 ,  H05K3/0035 ,  H05K3/0047 ,  B23K2201/35 ,  B23K2201/42 ,  B23K2203/12 ,  B23K2203/172 ,  B23K2203/42 ,  B23K2203/50 ,  H05K1/0366 ,  H05K2201/0394 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2203/0207 ,  H05K2203/0554 ,  H05K3/0044 ,  H05K3/4652

摘要： A method of perforating a printed circuit board having a copper foil layer on one side thereof, at least one intermediate resin layer and a layer on the other side thereof, so as to form a connection hole for providing an electrical connection between the copper foil layer and the layer on the other side of the printed circuit board. The method employs a printed circuit board perforation apparatus which has a laser processing head capable of processing the printed circuit board by means of a laser beam and a drill head capable of driling the printed circuit board. After the apparatus is suitably located with respect to the printed circuit board, the drilling head operates to conduct drilling into the resin layer through the copper foil layer by the drilling head so as to form a pilot hole. Then, the pilot hole is located with respect to the laser processing head and the laser processing head operates to irradiate a laser beam to the portion of the resin layer remaining at the bottom of the pilot hole so as to remove the resin, thereby forming the connection hole reaching the layer on the other side of the printed circuit board. An apparatus for carrying out this method is also disclosed.

摘要翻译： 一种在其一面上具有铜箔层的印刷电路板穿孔的方法，至少一个中间树脂层和另一侧的层，以形成用于在铜箔层之间提供电连接的连接孔 和印刷电路板另一侧的层。 该方法采用印刷电路板穿孔装置，其具有能够通过激光束处理印刷电路板的激光加工头和能够打印印刷电路板的钻头。 在装置相对于印刷电路板适当定位之后，钻头操作以通过钻头通过铜箔层进行树脂层的钻孔，从而形成引导孔。 然后，引导孔相对于激光加工头定位，激光加工头操作以将激光束照射到残留在导孔的底部的树脂层的部分，以除去树脂，从而形成 连接孔到达印刷电路板另一侧的层。 还公开了一种用于执行该方法的装置。

公开(公告)号：US08278594B2

公开(公告)日：2012-10-02

申请号：US12396584

申请日：2009-03-03

申请人： Kunio Arai ,  Hiroyuki Sugawara ,  Hiroaki Ashizawa ,  Hiromi Nishiyawa

发明人： Kunio Arai ,  Hiroyuki Sugawara ,  Hiroaki Ashizawa ,  Hiromi Nishiyawa

IPC分类号： B23K26/06 ,  B23K26/38

CPC分类号： H05K3/0038 ,  B23K26/03 ,  B23K26/032 ,  B23K26/06 ,  B23K26/082 ,  C23F4/02 ,  H01L21/31116 ,  H01L21/32131 ,  H05K3/0035 ,  H05K2203/163

摘要： A method and an apparatus for perforating a printed circuit board are provided so that the processing efficiency and the board densification can be improved. In test processing, a conductor layer 50i is irradiated with a pulsed laser beam 4a whose energy density is set at a value high enough to process the conductor layer 50i while emission 23a from a processed portion is monitored. Thus, the number of pulses of irradiation required for processing a window in the conductor layer 50i is obtained. An insulating layer 51i is irradiated with a pulsed laser beam 5a whose energy density is set at a value high enough to process the insulating layer 51i but low enough not to process a conductor layer 50i+1 under the insulating layer 51i. Thus, the number of pulses of irradiation required for processing a window in the insulating layer 51i is obtained. The conductor layer 50i is irradiated with the laser beam 4a the obtained number of pulses of irradiation, and the insulating layer 51i is irradiated with the laser beam 5a the obtained number of pulses of irradiation. Thus, a hole is processed in the printed circuit board.

摘要翻译： 提供了一种用于穿孔印刷电路板的方法和装置，从而可以提高处理效率和电路板致密化。 在测试处理中，用脉冲激光束4a照射导体层50i，脉冲激光束4a的能量密度设定为足够高的值来处理导体层50i，同时监视来自处理部分的发射23a。 因此，获得了在导体层50i中处理窗口所需的照射脉冲数。 用脉冲激光束5a照射绝缘层51i，脉冲激光束5a的能量密度设定为足够高的值来处理绝缘层51i但足够低，不能在绝缘层51i下方处理导体层50i + 1。 因此，获得了在绝缘层51i中处理窗口所需的照射脉冲数。 导体层50i用激光束4a照射所获得的照射脉冲数，绝缘层51i用激光束5a照射获得的照射脉冲数。 因此，在印刷电路板中处理孔。

公开(公告)号：US20090166340A1

公开(公告)日：2009-07-02

申请号：US12396584

申请日：2009-03-03

申请人： Kunio Arai ,  Hiroyuki Sugawara ,  Hiroaki Ashizawa ,  Hiromi Nishiyawa

发明人： Kunio Arai ,  Hiroyuki Sugawara ,  Hiroaki Ashizawa ,  Hiromi Nishiyawa

IPC分类号： B23K26/38

CPC分类号： H05K3/0038 ,  B23K26/03 ,  B23K26/032 ,  B23K26/06 ,  B23K26/082 ,  C23F4/02 ,  H01L21/31116 ,  H01L21/32131 ,  H05K3/0035 ,  H05K2203/163

摘要： A method and an apparatus for perforating a printed circuit board are provided so that the processing efficiency and the board densification can be improved. In test processing, a conductor layer 50i is irradiated with a pulsed laser beam 4a whose energy density is set at a value high enough to process the conductor layer 50i while emission 23a from a processed portion is monitored. Thus, the number of pulses of irradiation required for processing a window in the conductor layer 50i is obtained. An insulating layer 51i is irradiated with a pulsed laser beam 5a whose energy density is set at a value high enough to process the insulating layer 51i but low enough not to process a conductor layer 50i+1 under the insulating layer 51i. Thus, the number of pulses of irradiation required for processing a window in the insulating layer 51i is obtained. The conductor layer 50i is irradiated with the laser beam 4a the obtained number of pulses of irradiation, and the insulating layer 51i is irradiated with the laser beam 5a the obtained number of pulses of irradiation. Thus, a hole is processed in the printed circuit board.

摘要翻译： 提供了一种用于穿孔印刷电路板的方法和装置，从而可以提高处理效率和电路板致密化。 在测试处理中，用脉冲激光束4a照射导体层50i，脉冲激光束4a的能量密度设定为足够高的值来处理导体层50i，同时监视来自处理部分的发射23a。 因此，获得了在导体层50i中处理窗口所需的照射脉冲数。 用脉冲激光束5a照射绝缘层51i，脉冲激光束5a的能量密度设定为足够高的值来处理绝缘层51i但足够低，不能在绝缘层51i下方处理导体层50i + 1。 因此，获得了在绝缘层51i中处理窗口所需的照射脉冲数。 导体层50i用激光束4a照射所获得的照射脉冲数，绝缘层51i用激光束5a照射获得的照射脉冲数。 因此，在印刷电路板中处理孔。

公开(公告)号：US07531767B2

公开(公告)日：2009-05-12

申请号：US11365657

申请日：2006-03-02

申请人： Kunio Arai ,  Hiroyuki Sugawara ,  Hiroaki Ashizawa ,  Hiromi Nishiyawa

发明人： Kunio Arai ,  Hiroyuki Sugawara ,  Hiroaki Ashizawa ,  Hiromi Nishiyawa

IPC分类号： B23K26/38 ,  G06F19/00

CPC分类号： H05K3/0038 ,  B23K26/03 ,  B23K26/032 ,  B23K26/06 ,  B23K26/082 ,  C23F4/02 ,  H01L21/31116 ,  H01L21/32131 ,  H05K3/0035 ,  H05K2203/163

摘要： A method and an apparatus for perforating a printed circuit board are provided so that the processing efficiency and the board densification can be improved. In test processing, a conductor layer 50i is irradiated with a pulsed laser beam 4a whose energy density is set at a value high enough to process the conductor layer 50i while emission 23a from a processed portion is monitored. Thus, the number of pulses of irradiation required for processing a window in the conductor layer 50i is obtained. An insulating layer 51i is irradiated with a pulsed laser beam 5a whose energy density is set at a value high enough to process the insulating layer 51i but low enough not to process a conductor layer 50i+1 under the insulating layer 51i. Thus, the number of pulses of irradiation required for processing a window in the insulating layer 51i is obtained. The conductor layer 50i is irradiated with the laser beam 4a the obtained number of pulses of irradiation, and the insulating layer 51i is irradiated with the laser beam 5a the obtained number of pulses of irradiation. Thus, a hole is processed in the printed circuit board.

摘要翻译： 提供了一种用于穿孔印刷电路板的方法和装置，从而可以提高处理效率和电路板致密化。 在测试处理中，用脉冲激光束4a照射导体层50i，脉冲激光束4a的能量密度设定为足够高的值来处理导体层50i，同时监视来自处理部分的发射23a。 因此，获得了在导体层50i中处理窗口所需的照射脉冲数。 用脉冲激光束5a照射绝缘层51i，脉冲激光束5a的能量密度设定为足够高的值来处理绝缘层51i但足够低，不能在绝缘层51i下方处理导体层50i + 1。 因此，获得了在绝缘层51i中处理窗口所需的照射脉冲数。 导体层50i用激光束4a照射所获得的照射脉冲数，绝缘层51i用激光束5a照射获得的照射脉冲数。 因此，在印刷电路板中处理孔。

公开(公告)号：US06849824B2

公开(公告)日：2005-02-01

申请号：US10740817

申请日：2003-12-22

申请人： Kunio Arai ,  Kenji Suzuki

发明人： Kunio Arai ,  Kenji Suzuki

IPC分类号： G02B26/10 ,  B23K26/00 ,  B23K26/04 ,  B23K26/06 ,  B23K26/067 ,  B23K101/42 ,  H05K3/00 ,  B23K26/38

CPC分类号： B23K26/0673 ,  B23K26/064 ,  B23K26/0643 ,  B23K26/0648 ,  B23K26/067 ,  B23K26/082 ,  B23K26/382 ,  B23K2103/50 ,  H05K3/0026

摘要： Provided is a multi-beam laser drilling apparatus for drilling a workpiece, simultaneously at two positions while telecentric errors are suppressed, in which a conventional optical system in which galvanometer mirrors are used for a first laser beam, and a galvanometer-mirror system is located close to an fθ lens in order to prevent occurrence of telecentric error. A second laser beam which has been deflected by a second galvanometer-mirror system, transmits through a polarized beam mixers and is incident upon the first galvanometer-mirror system and the fθ lens, and accordingly, the workpiece is drilled simultaneously at two positions with the use of both first and second laser beams.

摘要翻译： 本发明提供一种多光束激光钻孔装置，用于在远心误差被抑制的同时位于两个位置的同时进行钻孔，其中将检流计镜用于第一激光束的常规光学系统和电流计镜系统位于 靠近ftheta镜头，以防止发生远心错误。 已经被第二电流计反射镜系统偏转的第二激光束透射通过偏振光束混合器并且入射到第一电流计反射镜系统和透镜上，因此在两个位置上同时钻出工件 使用第一和第二激光束。

公开(公告)号：US06818053B2

公开(公告)日：2004-11-16

申请号：US10380176

申请日：2003-03-13

申请人： Hitoshi Kasai ,  Hachiro Nakanishi ,  Kunio Arai

发明人： Hitoshi Kasai ,  Hachiro Nakanishi ,  Kunio Arai

IPC分类号： C09B6752

CPC分类号： C09B67/0027 ,  C09B67/0096 ,  Y02P20/544

摘要： The method for preparation quinacridone pigment nanocrystals with sub micrometer to nanometer in average size comprising, supplying supercritical or semi-critical liquid, which dissolves quinacridone pigment, into a specimen tube (ST) composing a reactor possessing a filter of desired opening to the upper stream side and to the down stream side in which quinacridone pigment is set up, flowing out the supercritical or semi-critical liquid in which quinacridone pigment is dissolved from said reactor to a mixing apparatus to which coolant is supplied, and by selecting the kind of supercritical of semi-critical liquid and combination of conditions e.g. supplying speed of each liquids, temperature of the liquid and the reacting pressure.

摘要翻译： 制备具有亚微米至纳米平均尺寸的喹吖啶酮颜料纳米晶体的方法，其包括将构成具有所需开口的过滤器的反应器的标准管（ST）供应至超临界或半临界液体，所述超临界或半临界液体将喹吖啶酮颜料溶解到上流 侧面和下游侧，其中形成喹吖啶酮颜料，将其中将喹吖啶酮颜料溶解的超临界或半临界液体从所述反应器流出到供应冷却剂的混合装置，并通过选择超临界的种类 的半临界液体和条件的组合例如 提供液体的速度，液体的温度和反应压力。

公开(公告)号：US06521866B1

公开(公告)日：2003-02-18

申请号：US09623809

申请日：2000-09-08

申请人： Kunio Arai ,  Humio Watanabe

发明人： Kunio Arai ,  Humio Watanabe

IPC分类号： B23K2638

CPC分类号： B23K26/0626 ,  B23K26/0622 ,  B23K26/067 ,  B23K26/0673 ,  H05K3/0026

摘要： Beam distributing/shaping units 21a and 21b the number of which is the same as the number of heads 7a and 7b are disposed in series with each other on an optical path of a laser beam 2 radiated from a laser oscillator 1. Then, the beam distributing/shaping units 21a and 21b are operated so that a laser pulse is supplied to one of the heads which has been positioned. By selecting the timing for operating the beam distributing/shaping units 21a and 21b, the laser beam 2 having energy the magnitude of which is substantially fixed is supplied to a portion to be machined. Thus, the laser oscillator is used effectively, and the machining energy is controlled accurately so that a high-quality hole can be machined.

摘要翻译： 光束分配/成形单元21a和21b的数量与头7a和7b的数量相同，在从激光振荡器1辐射的激光束2的光路上彼此串联设置。然后，光束 分配/整形单元21a和21b被操作，使得激光脉冲被提供给已定位的一个头部。 通过选择用于操作光束分配/成形单元21a和21b的定时，将具有其大小基本固定的能量的激光束2提供给待加工的部分。 因此，激光振荡器被有效地使用，并且精确地控制加工能量，从而可以加工高质量的孔。

公开(公告)号：US06464797B1

公开(公告)日：2002-10-15

申请号：US09628738

申请日：2000-07-28

申请人： Kunitoshi Sugiyama ,  Yoshihiko Itoh ,  Hideyuki Santoh ,  Kunio Arai ,  Tadafumi Ajiri

发明人： Kunitoshi Sugiyama ,  Yoshihiko Itoh ,  Hideyuki Santoh ,  Kunio Arai ,  Tadafumi Ajiri

IPC分类号： B08B704

CPC分类号： B08B7/0021 ,  G03G9/113 ,  G03G9/1131

摘要： A method for use in two-components electrostatic image developers is disclosed, in which secure separation of a carrier coating resinous materials from a core magnetic material is achieved without affecting the properties of the core materials through process steps benign to the environment in super- or sub-critical water compositions under the conditions of a temperature of 300° C. or more and a pressure of 20 MPa. The core magnetic material is subsequently recycled for forming carrier. This method may also be useful for processing waste including magnetic materials with silicone resin coating.

摘要翻译： 公开了一种用于双组分静电图像显影剂的方法，其中，通过在超级或超纯度静电图像显影剂的环境中良好的处理步骤，可以在不影响芯材料的性能的情况下实现载体涂覆树脂材料与芯磁性材料的固定分离 亚临界水组合物在温度为300℃以上，压力为20MPa的条件下进行。 核心磁性材料随后被再循环用于形成载体。 该方法也可用于处理包括具有硅树脂涂层的磁性材料的废物。

公开(公告)号：US06331320B1

公开(公告)日：2001-12-18

申请号：US09445408

申请日：2000-01-12

申请人： Koichi Nakahara ,  Takahisa Fujii ,  Wataru Miki ,  Kenzoh Nagami ,  Kunio Arai

发明人： Koichi Nakahara ,  Takahisa Fujii ,  Wataru Miki ,  Kenzoh Nagami ,  Kunio Arai

IPC分类号： A61K3578

CPC分类号： C07B61/00 ,  C07C45/78 ,  Y02P20/544

摘要： The present invention provides a process for producing aromatic compounds or polymers thereof from a plant material in a short period of time and by a simple procedure. Concretely, the process treats the plant material with supercritical water or subcritical water to liberate aromatic compounds, which are contained in the plant material, and/or aromatic compounds, which have been generated upon decomposition of components of the plant material, to the outside of the plant material, and isolates the liberated aromatic compounds to produce aromatic compounds or polymers thereof.

摘要翻译： 本发明提供一种在短时间内通过简单的方法从植物材料制备芳香族化合物或其聚合物的方法。 具体地，该方法用超临界水或亚临界水处理植物材料，以释放植物材料中所含的芳族化合物和/或在植物材料成分分解时产生的芳族化合物， 植物材料，并分离释放的芳族化合物以产生芳族化合物或其聚合物。

公开(公告)号：US5635154A

公开(公告)日：1997-06-03

申请号：US448025

申请日：1995-05-23

申请人： Kunio Arai ,  Tadafumi Ajiri

发明人： Kunio Arai ,  Tadafumi Ajiri

IPC分类号： C01G49/00 ,  C01B13/18 ,  C01B13/32 ,  C01F1/00 ,  C01F7/34 ,  C01G49/06 ,  C01G49/08 ,  C01G51/04 ,  C01G53/04 ,  C01B13/14 ,  C01F11/00 ,  C01G3/02 ,  C01G49/02

CPC分类号： B82Y30/00 ,  C01F7/34 ,  C01G49/06 ,  C01G51/04 ,  C01G53/04 ,  C01P2004/03 ,  C01P2004/04 ,  C01P2004/10 ,  C01P2004/20 ,  C01P2004/22 ,  C01P2004/30 ,  C01P2004/32 ,  C01P2004/41 ,  C01P2004/45 ,  C01P2004/50 ,  C01P2004/61 ,  C01P2004/62 ,  C01P2004/64 ,  Y02P20/544

摘要： Disclosed herein is a process for producing fine metal oxide particles comprising the step of heat-treating an aqueous solution of a metal salt at a temperature of not lower than 200.degree. C. under a pressure of not less than 160 kg/cm.sup.2 for 1 second to 1 hour so as to bring into the decomposition reaction of said metal salt.

摘要翻译： 本文公开了一种金属氧化物微粒的制造方法，其特征在于，在不低于160℃/ cm2的压力下，在不低于200℃的温度下对金属盐水溶液进行1秒钟的热处理， 至1小时，以进入所述金属盐的分解反应。