公开(公告)号：US20140048902A1

公开(公告)日：2014-02-20

申请号：US13585121

申请日：2012-08-14

申请人： Madhan M. Raj ,  Brian Alvarez ,  David P. Bour ,  Andrew P. Edward ,  Hui Nie ,  Isik C. Kizilyalli

发明人： Madhan M. Raj ,  Brian Alvarez ,  David P. Bour ,  Andrew P. Edward ,  Hui Nie ,  Isik C. Kizilyalli

IPC分类号： H01L21/329 ,  H01L29/872

CPC分类号： H01L29/66143 ,  H01L21/0254 ,  H01L21/02664 ,  H01L29/0619 ,  H01L29/2003 ,  H01L29/66121 ,  H01L29/66212 ,  H01L29/872

摘要： An MPS diode includes a III-nitride substrate characterized by a first conductivity type and a first dopant concentration and having a first side and a second side. The MPS diode also includes a III-nitride epitaxial structure comprising a first III-nitride epitaxial layer coupled to the first side of the substrate, wherein a region of the first III-nitride epitaxial layer comprises an array of protrusions. The III-nitride epitaxial structure also includes a plurality of III-nitride regions of a second conductivity type, each partially disposed between adjacent protrusions. Each of the plurality of III-nitride regions of the second conductivity type comprises a first section laterally positioned between adjacent protrusions and a second section extending in a direction normal to the first side of the substrate. The MPS diode further includes a first metallic structure electrically coupled to one or more of the protrusions and to one or more of the second sections.

摘要翻译： MPS二极管包括以第一导电类型和第一掺杂剂浓度为特征的III族氮化物衬底，其具有第一侧和第二侧。 MPS二极管还包括III族氮化物外延结构，其包括耦合到衬底的第一侧的第一III族氮化物外延层，其中第一III族氮化物外延层的区域包括突起阵列。 III族氮化物外延结构还包括多个第二导电类型的III族氮化物区域，每个部分设置在相邻的突起之间。 第二导电类型的多个III族氮化物区域中的每一个包括横向位于相邻突起之间的第一部分和沿着垂直于衬底的第一侧的方向延伸的第二部分。 MPS二极管还包括电耦合到一个或多个突起和一个或多个第二部分的第一金属结构。

公开(公告)号：US08866147B2

公开(公告)日：2014-10-21

申请号：US13335572

申请日：2011-12-22

申请人： Richard J. Brown ,  Isik C. Kizilyalli ,  Hui Nie ,  Andrew P. Edwards ,  David P. Bour

发明人： Richard J. Brown ,  Isik C. Kizilyalli ,  Hui Nie ,  Andrew P. Edwards ,  David P. Bour

IPC分类号： H01L29/20 ,  H01L21/20 ,  H01L29/808 ,  H01L29/812 ,  H01L29/10 ,  H01L29/16

CPC分类号： H01L29/66856 ,  H01L21/0254 ,  H01L21/02647 ,  H01L21/32 ,  H01L29/1066 ,  H01L29/1608 ,  H01L29/2003 ,  H01L29/36 ,  H01L29/475 ,  H01L29/8083 ,  H01L29/812 ,  H01L29/8122

摘要： A semiconductor structure includes a III-nitride substrate and a drift region coupled to the III-nitride substrate along a growth direction. The semiconductor substrate also includes a channel region coupled to the drift region. The channel region is defined by a channel sidewall disposed substantially along the growth direction. The semiconductor substrate further includes a gate region disposed laterally with respect to the channel region.

摘要翻译： 半导体结构包括III族氮化物衬底和沿生长方向耦合到III族氮化物衬底的漂移区域。 半导体衬底还包括耦合到漂移区的沟道区。 通道区域由基本沿着生长方向设置的通道侧壁限定。 半导体衬底还包括相对于沟道区域侧向设置的栅极区域。

公开(公告)号：US20130161635A1

公开(公告)日：2013-06-27

申请号：US13335572

申请日：2011-12-22

申请人： Richard J. Brown ,  Isik C. Kizilyalli ,  Hui Nie ,  Andrew P. Edwards ,  David P. Bour

发明人： Richard J. Brown ,  Isik C. Kizilyalli ,  Hui Nie ,  Andrew P. Edwards ,  David P. Bour

IPC分类号： H01L29/78 ,  H01L21/338

CPC分类号： H01L29/66856 ,  H01L21/0254 ,  H01L21/02647 ,  H01L21/32 ,  H01L29/1066 ,  H01L29/1608 ,  H01L29/2003 ,  H01L29/36 ,  H01L29/475 ,  H01L29/8083 ,  H01L29/812 ,  H01L29/8122

摘要： A semiconductor structure includes a III-nitride substrate and a drift region coupled to the III-nitride substrate along a growth direction. The semiconductor substrate also includes a channel region coupled to the drift region. The channel region is defined by a channel sidewall disposed substantially along the growth direction. The semiconductor substrate further includes a gate region disposed laterally with respect to the channel region.

摘要翻译： 半导体结构包括III族氮化物衬底和沿生长方向耦合到III族氮化物衬底的漂移区域。 半导体衬底还包括耦合到漂移区的沟道区。 通道区域由基本沿着生长方向设置的通道侧壁限定。 半导体衬底还包括相对于沟道区域侧向设置的栅极区域。

公开(公告)号：US20140045306A1

公开(公告)日：2014-02-13

申请号：US13571743

申请日：2012-08-10

申请人： David P. Bour ,  Thomas R. Prunty ,  Hui Nie ,  Madhan M. Raj

发明人： David P. Bour ,  Thomas R. Prunty ,  Hui Nie ,  Madhan M. Raj

IPC分类号： H01L21/337 ,  H01L21/329

CPC分类号： H01L29/66143 ,  H01L21/02389 ,  H01L21/02458 ,  H01L21/0254 ,  H01L21/0262 ,  H01L21/02634 ,  H01L21/02639 ,  H01L21/02642 ,  H01L21/02647 ,  H01L21/30612 ,  H01L21/3086 ,  H01L29/0619 ,  H01L29/2003 ,  H01L29/66121 ,  H01L29/66446 ,  H01L29/66462 ,  H01L29/868 ,  H01L29/872

摘要： A method of regrowing material includes providing a III-nitride structure including a masking layer and patterning the masking layer to form an etch mask. The method also includes removing, using an in-situ etch, a portion of the III-nitride structure to expose a regrowth region and regrowing a III-nitride material in the regrowth region.

摘要翻译： 再生材料的方法包括提供包括掩模层的III族氮化物结构，并且图案化掩模层以形成蚀刻掩模。 该方法还包括使用原位蚀刻去除III族氮化物结构的一部分以暴露再生区域并在再生长区域中再生长III族氮化物材料。

公开(公告)号：US20130127006A1

公开(公告)日：2013-05-23

申请号：US13300028

申请日：2011-11-18

申请人： Madhan Raj ,  Richard J. Brown ,  Thomas R. Prunty ,  David P. Bour ,  lsik C. Kizilyalli ,  Hui Nie ,  Andrew P. Edwards ,  Linda Romano

发明人： Madhan Raj ,  Richard J. Brown ,  Thomas R. Prunty ,  David P. Bour ,  lsik C. Kizilyalli ,  Hui Nie ,  Andrew P. Edwards ,  Linda Romano

IPC分类号： H01L29/47 ,  H01L21/20

CPC分类号： H01L29/66143 ,  H01L29/0661 ,  H01L29/2003 ,  H01L29/402 ,  H01L29/66212 ,  H01L29/872

摘要： A method for fabricating a III-nitride semiconductor device includes providing a III-nitride substrate having a first surface and a second surface opposing the first surface, forming a III-nitride epitaxial layer coupled to the first surface of the III-nitride substrate, and removing at least a portion of the III-nitride epitaxial layer to form a first exposed surface. The method further includes forming a dielectric layer coupled to the first exposed surface, removing at least a portion of the dielectric layer, and forming a metallic layer coupled to a remaining portion of the dielectric layer such that the remaining portion of the dielectric layer is disposed between the III-nitride epitaxial layer and the metallic layer.

摘要翻译： 一种制造III族氮化物半导体器件的方法包括提供具有第一表面和与第一表面相对的第二表面的III族氮化物衬底，形成耦合到III族氮化物衬底的第一表面的III族氮化物外延层，以及 去除所述III族氮化物外延层的至少一部分以形成第一暴露表面。 该方法还包括形成耦合到第一暴露表面的电介质层，去除电介质层的至少一部分，以及形成耦合到电介质层的剩余部分的金属层，使得电介质层的剩余部分被布置 在III族氮化物外延层和金属层之间。

公开(公告)号：US09123533B2

公开(公告)日：2015-09-01

申请号：US13571743

申请日：2012-08-10

申请人： David P. Bour ,  Thomas R. Prunty ,  Hui Nie ,  Madhan M. Raj

发明人： David P. Bour ,  Thomas R. Prunty ,  Hui Nie ,  Madhan M. Raj

IPC分类号： H01L29/66 ,  H01L21/02 ,  H01L29/20

CPC分类号： H01L29/66143 ,  H01L21/02389 ,  H01L21/02458 ,  H01L21/0254 ,  H01L21/0262 ,  H01L21/02634 ,  H01L21/02639 ,  H01L21/02642 ,  H01L21/02647 ,  H01L21/30612 ,  H01L21/3086 ,  H01L29/0619 ,  H01L29/2003 ,  H01L29/66121 ,  H01L29/66446 ,  H01L29/66462 ,  H01L29/868 ,  H01L29/872

摘要： A method of regrowing material includes providing a III-nitride structure including a masking layer and patterning the masking layer to form an etch mask. The method also includes removing, using an in-situ etch, a portion of the III-nitride structure to expose a regrowth region and regrowing a III-nitride material in the regrowth region.

摘要翻译： 再生材料的方法包括提供包括掩模层的III族氮化物结构，并且图案化掩模层以形成蚀刻掩模。 该方法还包括使用原位蚀刻去除III族氮化物结构的一部分以暴露再生区域并在再生长区域中再生长III族氮化物材料。

公开(公告)号：US09716196B2

公开(公告)日：2017-07-25

申请号：US13023733

申请日：2011-02-09

申请人： Hui Nie ,  Brendan M. Kayes ,  Isik C. Kizilyalli

发明人： Hui Nie ,  Brendan M. Kayes ,  Isik C. Kizilyalli

IPC分类号： H01L31/0304 ,  H01L27/142 ,  H01L31/0735 ,  H01L31/0443

CPC分类号： H01L31/03046 ,  H01L27/142 ,  H01L31/0304 ,  H01L31/0443 ,  H01L31/0735 ,  Y02E10/544 ,  Y02P70/521

摘要： Embodiments of the invention generally relate to photovoltaic devices. In one embodiment, a method for forming a gallium arsenide based photovoltaic device includes providing a semiconductor structure, the structure including an absorber layer comprising gallium arsenide. A bypass function is provided in a p-n junction of the semiconductor structure, where under reverse-bias conditions the p-n junction breaks down in a controlled manner by a Zener breakdown effect.

公开(公告)号：US08698164B2

公开(公告)日：2014-04-15

申请号：US13315720

申请日：2011-12-09

申请人： Donald R. Disney ,  Hui Nie ,  Isik C. Kizilyalli ,  Richard J. Brown

发明人： Donald R. Disney ,  Hui Nie ,  Isik C. Kizilyalli ,  Richard J. Brown

IPC分类号： H01L29/808 ,  H01L21/335

CPC分类号： H01L29/8083 ,  H01L29/0623 ,  H01L29/2003 ,  H01L29/402 ,  H01L29/66446 ,  H01L29/66462 ,  H01L29/66909 ,  H01L29/66924

摘要： A semiconductor structure includes a GaN substrate with a first surface and a second surface. The GaN substrate is characterized by a first conductivity type and a first dopant concentration. A first electrode is electrically coupled to the second surface of the GaN substrate. The semiconductor structure further includes a first GaN epitaxial layer of the first conductivity type coupled to the first surface of the GaN substrate and a second GaN layer of a second conductivity type coupled to the first GaN epitaxial layer. The first GaN epitaxial layer comprises a channel region. The second GaN epitaxial layer comprises a gate region and an edge termination structure. A second electrode coupled to the gate region and a third electrode coupled to the channel region are both disposed within the edge termination structure.

摘要翻译： 半导体结构包括具有第一表面和第二表面的GaN衬底。 GaN衬底的特征在于第一导电类型和第一掺杂剂浓度。 第一电极电耦合到GaN衬底的第二表面。 半导体结构还包括耦合到GaN衬底的第一表面的第一导电类型的第一GaN外延层和耦合到第一GaN外延层的第二导电类型的第二GaN层。 第一GaN外延层包括沟道区。 第二GaN外延层包括栅极区域和边缘端接结构。 耦合到栅极区域的第二电极和耦合到沟道区域的第三电极都设置在边缘端接结构内。

公开(公告)号：US09093591B2

公开(公告)日：2015-07-28

申请号：US13451455

申请日：2012-04-19

申请人： Hui Nie ,  Brendan M. Kayes ,  Isik C. Kizilyalli

发明人： Hui Nie ,  Brendan M. Kayes ,  Isik C. Kizilyalli

IPC分类号： H01L21/04 ,  H01L31/0735 ,  H01L31/0224 ,  H01L31/18

摘要： Embodiments generally relate to optoelectronic semiconductor devices such as solar cells. In one aspect, a device includes an absorber layer made of gallium arsenide (GaAs) and having only one type of doping. An emitter layer is located closer than the absorber layer to a back side of the device and is made of a different material and having a higher bandgap than the absorber layer. A heterojunction is formed between the emitter layer and the absorber layer, and a p-n junction is formed between the emitter layer and the absorber layer and at least partially within the different material at a location offset from the heterojunction. An intermediate layer is located between the absorber layer and the emitter layer and provides the offset of the p-n junction from the heterojunction, and includes a graded layer and an ungraded back window layer.

公开(公告)号：US08829574B2

公开(公告)日：2014-09-09

申请号：US13334514

申请日：2011-12-22

申请人： Donald R. Disney ,  Isik C. Kizilyalli ,  Hui Nie ,  Linda Romano ,  Richard J. Brown ,  Madhan Raj

发明人： Donald R. Disney ,  Isik C. Kizilyalli ,  Hui Nie ,  Linda Romano ,  Richard J. Brown ,  Madhan Raj

IPC分类号： H01L29/808 ,  H01L21/335 ,  H01L29/66 ,  H01L29/78

CPC分类号： H01L29/66924 ,  H01L21/027 ,  H01L21/283 ,  H01L21/308 ,  H01L29/1095 ,  H01L29/2003 ,  H01L29/402 ,  H01L29/66446 ,  H01L29/66893 ,  H01L29/66909 ,  H01L29/66916 ,  H01L29/7832 ,  H01L29/808 ,  H01L29/8083 ,  H01L29/8086

摘要： A semiconductor device includes a III-nitride substrate, a first III-nitride epitaxial layer coupled to the III-nitride substrate and having a mesa, and a second III-nitride epitaxial layer coupled to a top surface of the mesa. The semiconductor device further includes a III-nitride gate structure coupled to a side surface of the mesa, and a spacer configured to provide electrical insulation between the second III-nitride epitaxial layer and the III-nitride gate structure.

摘要翻译： 半导体器件包括III族氮化物衬底，耦合到III族氮化物衬底并具有台面的第一III族氮化物外延层和耦合到台面的顶表面的第二III族氮化物外延层。 半导体器件还包括耦合到台面的侧表面的III族氮化物栅极结构，以及被配置为在第二III族氮化物外延层和III族氮化物栅极结构之间提供电绝缘的间隔物。