公开(公告)号：US20090000931A1

公开(公告)日：2009-01-01

申请号：US11824191

申请日：2007-06-28

申请人： Adam Duckworth Mittleman ,  Tang Yew Tan ,  Erik L. Wang ,  Richard Hung Minh Dinh ,  Philip Michael Hobson ,  Kenneth A. Jenks

发明人： Adam Duckworth Mittleman ,  Tang Yew Tan ,  Erik L. Wang ,  Richard Hung Minh Dinh ,  Philip Michael Hobson ,  Kenneth A. Jenks

IPC分类号： H01H13/14 ,  H01H11/00

CPC分类号： H01H13/48 ,  H01H13/78 ,  H01H13/88 ,  H01H2205/026 ,  H01H2213/002 ,  H01H2213/016 ,  H01H2215/004 ,  H01H2221/002 ,  H01H2221/05 ,  H01H2221/064 ,  H01H2221/084 ,  H01H2225/002 ,  H01H2227/036 ,  H01H2229/028 ,  H01H2229/046 ,  Y10T29/49105

摘要： Electronic devices are provided with switch assembly input components that can have adhesives adhered to the side and/or bottom surfaces of support plates for retaining switches between the adhesives and the tops of the support plates. The switch assembly input components can include buttons with one or more absorption elements for receiving impact energy, reducing the impact energy, and transferring the reduced impact energy onto the switches.

摘要翻译： 电子设备设置有开关组件输入部件，其可以具有粘附到支撑板的侧面和/或底表面上的粘合剂，用于将粘合剂和支撑板的顶部之间保持开关。 开关组件输入部件可以包括具有一个或多个吸收元件的按钮，用于接收冲击能量，减少冲击能量，并将减少的冲击能量传递到开关上。

公开(公告)号：US09232670B2

公开(公告)日：2016-01-05

申请号：US12794617

申请日：2010-06-04

申请人： David Pakula ,  Richard Hung Minh Dinh ,  Tang Yew Tan

发明人： David Pakula ,  Richard Hung Minh Dinh ,  Tang Yew Tan

IPC分类号： H05K5/03 ,  H04M1/02 ,  G06F1/16

CPC分类号： H05K7/14 ,  B29L2031/3481 ,  G02B7/02 ,  G02B13/001 ,  G06F1/1626 ,  G06F1/1637 ,  G06F1/1656 ,  G06F1/1658 ,  H04M1/0202 ,  H04M1/0266 ,  H04N5/2252 ,  H04N5/2254 ,  H05K5/0086 ,  H05K5/03 ,  Y10T29/49002 ,  Y10T156/10

摘要： Improved housings for electronic devices are disclosed. An electronic device housing can make use of at least one outer member (e.g., cover) that can be aligned, protected and/or secured with respect to other portions of the housing for the electronic device. In one embodiment, an electronic device housing can have one or more outer members (e.g., exposed major surfaces), such as front or back surfaces, that are formed of glass. Protective sides can be provided in some embodiments to protect the edges of the one or more glass surfaces so as to dissipate impact forces and thus reduce damage to the electronic device housing. The one or more glass surfaces can be part of outer member assemblies that can be secured to other portions of the electronic device housing. The electronic device can be portable and in some cases handheld.

摘要翻译： 公开了改进的电子设备外壳。 电子设备壳体可以利用至少一个外部构件（例如，盖子），该外部构件可相对于用于电子设备的壳体的其它部分对准，保护和/或固定。 在一个实施例中，电子设备外壳可以具有由玻璃形成的一个或多个外部构件（例如，暴露的主表面），例如前表面或后表面。 在一些实施例中可以提供保护侧以保护一个或多个玻璃表面的边缘，以便消散冲击力，从而减少对电子设备外壳的损坏。 一个或多个玻璃表面可以是可以固定到电子设备外壳的其它部分的外部构件组件的一部分。 电子设备可以是便携式的，并且在某些情况下是手持的。

公开(公告)号：US08912480B2

公开(公告)日：2014-12-16

申请号：US13222387

申请日：2011-08-31

申请人： Benjamin J. Pope ,  Kelvin Kwong ,  Richard P. Howarth ,  Richard Hung Minh Dinh ,  Tang Yew Tan ,  Richard Ruh ,  Matt Waldon ,  Daniel W. Jarvis ,  Brian R. Land ,  Steven P. Hotelling

发明人： Benjamin J. Pope ,  Kelvin Kwong ,  Richard P. Howarth ,  Richard Hung Minh Dinh ,  Tang Yew Tan ,  Richard Ruh ,  Matt Waldon ,  Daniel W. Jarvis ,  Brian R. Land ,  Steven P. Hotelling

IPC分类号： G01J1/02 ,  H04M1/02 ,  G01J1/42 ,  G01J1/04

CPC分类号： G01J1/0233 ,  G01J1/0407 ,  G01J1/0422 ,  G01J1/0425 ,  G01J1/0474 ,  G01J1/0488 ,  G01J1/4204 ,  H04M1/026 ,  H04M2250/12

摘要： The underside of an inactive portion of a display cover layer in an electronic device may be covered with an opaque masking material. Openings in the opaque masking material may be form ambient light sensor and proximity sensor windows. An ambient light sensor window may be filled with a material that transmits at least some visible light. A proximity sensor window may be filled with a material that transmits more infrared light relative to visible light than the material in the ambient light sensor window. The materials in the ambient light sensor window and proximity sensor window may include one or more layers of ink, patterns of holes, layers of material that are shared with the opaque masking layer, and materials that are black, white, or other colors. A light guide structure may be used to route light received from a sensor window to an associated sensor.

摘要翻译： 电子设备中的显示覆盖层的不活动部分的下侧可以用不透明的掩模材料覆盖。 不透明掩模材料中的开口可以形成环境光传感器和接近传感器窗口。 环境光传感器窗口可以填充有透射至少一些可见光的材料。 接近传感器窗口可以填充相对于可见光透射比环境光传感器窗口中的材料更多的红外光的材料。 环境光传感器窗口和接近传感器窗口中的材料可以包括与不透明掩模层共享的一层或多层墨水，孔图案，材料层，以及黑色，白色或其它颜色的材料。 光导结构可以用于将从传感器窗口接收的光路由到相关传感器。

公开(公告)号：USD714294S1

公开(公告)日：2014-09-30

申请号：US29429885

申请日：2012-08-17

申请人： Richard Hung Minh Dinh ,  Richard P. Howarth ,  Scott A. Myers ,  David A. Pakula ,  Tang Yew Tan

设计人： Richard Hung Minh Dinh ,  Richard P. Howarth ,  Scott A. Myers ,  David A. Pakula ,  Tang Yew Tan

公开(公告)号：US08776358B2

公开(公告)日：2014-07-15

申请号：US12186990

申请日：2008-08-06

申请人： Todd F. Gotham ,  Andrew David Lauder ,  Tang Yew Tan ,  Erik L. Wang ,  Phillip Michael Hobson ,  Richard Hung Minh Dinh ,  Christopher Stringer ,  Richard Howarth ,  John Ternus ,  Rico Zorkendorfer

发明人： Todd F. Gotham ,  Andrew David Lauder ,  Tang Yew Tan ,  Erik L. Wang ,  Phillip Michael Hobson ,  Richard Hung Minh Dinh ,  Christopher Stringer ,  Richard Howarth ,  John Ternus ,  Rico Zorkendorfer

IPC分类号： H05K5/02 ,  H05K5/04

CPC分类号： G06F1/181 ,  G06F1/1601 ,  G06F1/1684 ,  H04R1/08 ,  H04R3/00 ,  H05K5/02 ,  H05K5/0243 ,  Y10T29/49002 ,  Y10T29/5116

摘要： Electronic devices are provided with a protective housing having one or more housing components. A housing component can be formed from a single sheet of material to appear as if the housing component had been formed from a hollowed out solid block of material. The sheet of material may be deep drawn, forged, and machined to form the housing component. One or more holes may be formed through a portion of the housing component to provide an I/O interface.

摘要翻译： 电子设备设置有具有一个或多个壳体部件的保护壳体。 壳体部件可以由单张材料形成，看起来好像壳体部件是由中空的固体块形成的。 材料片可以被深拉，锻造和加工以形成壳体部件。 可以通过壳体部件的一部分形成一个或多个孔，以提供I / O接口。

公开(公告)号：USD697068S1

公开(公告)日：2014-01-07

申请号：US29380128

申请日：2010-11-30

申请人： Bartley K. Andre ,  Daniel J. Coster ,  Daniele De Iuliis ,  Richard Hung Minh Dinh ,  Phillip M. Hobson ,  Richard P. Howarth ,  Jonathan P. Ive ,  Kenneth Arthur Jenks ,  Duncan Robert Kerr ,  Adam Duckworth Mittleman ,  Shin Nishibori ,  Matthew Dean Rohrbach ,  Douglas B. Satzger ,  Christopher J. Stringer ,  Tang Yew Tan ,  Erik Li Wang ,  Eugene Antony Whang ,  Rico Zörkendörfer ,  Vincent Keane Seid

设计人： Bartley K. Andre ,  Daniel J. Coster ,  Daniele De Iuliis ,  Richard Hung Minh Dinh ,  Phillip M. Hobson ,  Richard P. Howarth ,  Jonathan P. Ive ,  Kenneth Arthur Jenks ,  Steve Jobs ,  Duncan Robert Kerr ,  Adam Duckworth Mittleman ,  Shin Nishibori ,  Matthew Dean Rohrbach ,  Douglas B. Satzger ,  Calvin Q. Seid ,  Christopher J. Stringer ,  Tang Yew Tan ,  Erik Li Wang ,  Eugene Antony Whang ,  Rico Zörkendörfer

CPC分类号： H04M1/0202 ,  H01Q1/243 ,  H01Q9/0421 ,  H04M1/0266 ,  H05K5/0247

摘要： A handheld electronic device may be provided that contains a conductive housing and other conductive elements. The conductive elements may form an antenna ground plane. One or more antennas for the handheld electronic device may be formed from the ground plane and one or more associated antenna resonating elements. Transceiver circuitry may be connected to the resonating elements by transmission lines such as coaxial cables. Ferrules may be crimped to the coaxial cables. A bracket with extending members may be crimped over the ferrules to ground the coaxial cables to the housing and other conductive elements in the ground plane. The ground plane may contain an antenna slot. A dock connector and flex circuit may overlap the slot in a way that does not affect the resonant frequency of the slot. Electrical components may be isolated from the antenna using isolation elements such as inductors and resistors.

公开(公告)号：US20120128189A1

公开(公告)日：2012-05-24

申请号：US13364405

申请日：2012-02-02

申请人： Richard Hung Minh Dinh ,  Tang Yew Tan ,  Derek Boyd Barrentine

发明人： Richard Hung Minh Dinh ,  Tang Yew Tan ,  Derek Boyd Barrentine

IPC分类号： H04R1/02

CPC分类号： H04R1/02 ,  H04M1/0254 ,  H04M1/03 ,  H04M1/72558 ,  H04R1/2842 ,  H04R2499/11

摘要： Systems and methods are provided for media devices including a housing, a frame disposed adjacent to the housing, and an acoustic source that is integrated with the frame for emitting sound from the media device.

摘要翻译： 提供了用于媒体设备的系统和方法，包括壳体，邻近壳体设置的框架以及与框架集成用于从介质设备发出声音的声源。

公开(公告)号：US20110255850A1

公开(公告)日：2011-10-20

申请号：US12794601

申请日：2010-06-04

申请人： Richard Hung Minh Dinh ,  Tang Yew Tan ,  Jason Sloey ,  Shayan Malek ,  Scott Myers ,  Dennis R. Pyper ,  Douglas P. Kidd ,  Ronald W. Dimpflmaier ,  Andrew B. Just ,  Trent Weber ,  Daniel W. Jarvis

发明人： Richard Hung Minh Dinh ,  Tang Yew Tan ,  Jason Sloey ,  Shayan Malek ,  Scott Myers ,  Dennis R. Pyper ,  Douglas P. Kidd ,  Ronald W. Dimpflmaier ,  Andrew B. Just ,  Trent Weber ,  Daniel W. Jarvis

IPC分类号： G03B15/03 ,  H01R13/648 ,  H05K9/00 ,  H01R13/516

CPC分类号： H05K9/0024 ,  B32B17/061 ,  B41F17/00 ,  G03B15/03 ,  G06F1/1626 ,  G06F1/1656 ,  H01L23/24 ,  H01L23/296 ,  H01L23/3737 ,  H01L23/552 ,  H01L23/66 ,  H01L2223/6644 ,  H01M2/026 ,  H01M2/0292 ,  H01M2220/30 ,  H03F3/195 ,  H03F3/213 ,  H03F2200/451 ,  H04M1/0277 ,  H05K1/0203 ,  H05K1/0215 ,  H05K1/181 ,  H05K1/189 ,  H05K3/341 ,  H05K3/3447 ,  H05K3/363 ,  H05K2201/0116 ,  H05K2201/0162 ,  H05K2201/056 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10371 ,  H05K2201/10409 ,  H05K2201/2009 ,  H05K2203/1316 ,  Y02P70/613 ,  Y10T29/4911

摘要： Electronic devices may be provided that include mechanical and electronic components. Connectors may be used to interconnect printed circuits and devices mounted to printed circuits. Printed circuits may include rigid printed circuit boards and flexible printed circuit boards. Heat sinks and other thermally conductive structures may be used to remove excess component heat. Structures may also be provided in an electronic device to detect moisture. Integrated circuits and other circuitry may be mounted on a printed circuit board under a radio-frequency shielding can.

摘要翻译： 可以提供包括机械和电子部件的电子设备。 连接器可用于连接安装到印刷电路的印刷电路和器件。 印刷电路可以包括刚性印刷电路板和柔性印刷电路板。 散热片和其他导热结构可用于去除多余的部件热量。 也可以在电子设备中提供结构以检测湿气。 集成电路和其他电路可以安装在射频屏蔽罐下的印刷电路板上。

公开(公告)号：US20110255250A1

公开(公告)日：2011-10-20

申请号：US12794599

申请日：2010-06-04

申请人： Richard Hung Minh Dinh ,  Tang Yew Tan ,  Nicholaus Ian Lubinski ,  Jason Sloey ,  Shayan Malek ,  Scott Myers ,  Wyeman Chen ,  Dennis R. Pyper ,  Douglas P. Kidd ,  Joshua G. Wurzel ,  David A. Pakula

发明人： Richard Hung Minh Dinh ,  Tang Yew Tan ,  Nicholaus Ian Lubinski ,  Jason Sloey ,  Shayan Malek ,  Scott Myers ,  Wyeman Chen ,  Dennis R. Pyper ,  Douglas P. Kidd ,  Joshua G. Wurzel ,  David A. Pakula

IPC分类号： H05K1/14 ,  F16B37/00 ,  F16B39/02 ,  H05K1/00 ,  H05K1/11

CPC分类号： H05K9/0024 ,  B32B17/061 ,  B41F17/00 ,  G03B15/03 ,  G06F1/1626 ,  G06F1/1656 ,  H01L23/24 ,  H01L23/296 ,  H01L23/3737 ,  H01L23/552 ,  H01L23/66 ,  H01L2223/6644 ,  H01M2/026 ,  H01M2/0292 ,  H01M2220/30 ,  H03F3/195 ,  H03F3/213 ,  H03F2200/451 ,  H04M1/0277 ,  H05K1/0203 ,  H05K1/0215 ,  H05K1/181 ,  H05K1/189 ,  H05K3/341 ,  H05K3/3447 ,  H05K3/363 ,  H05K2201/0116 ,  H05K2201/0162 ,  H05K2201/056 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10371 ,  H05K2201/10409 ,  H05K2201/2009 ,  H05K2203/1316 ,  Y02P70/613 ,  Y10T29/4911

摘要： Electronic devices may be provided that include mechanical and electronic components. Connectors may be used to interconnect printed circuits and devices mounted to printed circuits. Printed circuits may include rigid printed circuit boards and flexible printed circuit boards. Cosmetic structures such as cowlings may be used to improve device aesthetics. Bumpers may be mounted over rough edges of printed circuit boards to protect flex circuits that are routed over the printed circuit boards. Fasteners may be soldered to solder pad structures on printed circuit boards.

摘要翻译： 可以提供包括机械和电子部件的电子设备。 连接器可用于连接安装到印刷电路的印刷电路和器件。 印刷电路可以包括刚性印刷电路板和柔性印刷电路板。 可以使用诸如整流罩的化妆结构来改善设备的美观性。 缓冲器可以安装在印刷电路板的粗糙边缘上，以保护布线在印刷电路板上的柔性电路。 紧固件可以焊接到印刷电路板上的焊盘结构上。

公开(公告)号：US20110120850A1

公开(公告)日：2011-05-26

申请号：US12975552

申请日：2010-12-22

申请人： Adam Duckworth Mittleman ,  Tang Yew Tan ,  Erik L. Wang ,  Richard Hung Minh Dinh ,  Philip Michael Hobson ,  Kenneth A. Jenks

发明人： Adam Duckworth Mittleman ,  Tang Yew Tan ,  Erik L. Wang ,  Richard Hung Minh Dinh ,  Philip Michael Hobson ,  Kenneth A. Jenks

IPC分类号： H01H1/10 ,  H01H9/02 ,  H01H11/00

CPC分类号： H01H13/48 ,  H01H13/78 ,  H01H13/88 ,  H01H2205/026 ,  H01H2213/002 ,  H01H2213/016 ,  H01H2215/004 ,  H01H2221/002 ,  H01H2221/05 ,  H01H2221/064 ,  H01H2221/084 ,  H01H2225/002 ,  H01H2227/036 ,  H01H2229/028 ,  H01H2229/046 ,  Y10T29/49105

摘要： Electronic devices are provided with switch assembly input components that can have adhesives adhered to the side and/or bottom surfaces of support plates for retaining switches between the adhesives and the tops of the support plates. The switch assembly input components can include buttons with one or more absorption elements for receiving impact energy, reducing the impact energy, and transferring the reduced impact energy onto the switches.

摘要翻译： 电子设备设置有开关组件输入部件，其可以具有粘附到支撑板的侧面和/或底表面上的粘合剂，用于将粘合剂和支撑板的顶部之间保持开关。 开关组件输入部件可以包括具有一个或多个吸收元件的按钮，用于接收冲击能量，减少冲击能量，并将减少的冲击能量传递到开关上。