-
公开(公告)号：US08306806B2
公开(公告)日：2012-11-06
申请号：US12326168
申请日：2008-12-02
CPC分类号： G06F17/2845 , G06F17/2735
摘要： Embodiments for the adaptive mining of bilingual lexicon are disclosed. In accordance with one embodiment, the adaptive mining of bilingual lexicon includes retrieving one or more bilingual web pages, wherein each of the bilingual web page including a search term and one or more additional terms. The adaptive mining also includes forming a plurality of candidate translation pairs for each of the terms and extracting one or more translation layout patterns from the plurality of candidate translation pairs. The adaptive mining further includes deriving a term translation in a second language for the search term. The term translation being derived based on a hidden conditional random field (HCRF) model that includes the one or more candidate translations, the one or more translation layout patterns, and one or more additional features. The term translation is further stored in a lexicon repository.
摘要翻译： 披露了双语词典适应性挖掘的实施例。 根据一个实施例，双语词汇的自适应挖掘包括检索一个或多个双语网页，其中双语网页中的每一个包括搜索词和一个或多个附加词。 自适应挖掘还包括为每个术语形成多个候选翻译对，并从多个候选翻译对提取一个或多个翻译布局模式。 自适应挖掘还包括为搜索项导出第二语言的术语翻译。 基于包括一个或多个候选翻译，一个或多个翻译布局模式和一个或多个附加特征的隐藏条件随机字段（HCRF）模型导出术语翻译。 术语翻译进一步存储在词典存储库中。
-
公开(公告)号：US20120235873A1
公开(公告)日：2012-09-20
申请号：US13419140
申请日：2012-03-13
申请人： Zhonglin Wu , Lei Shi , Gang Cheng , Mulin Liu , Zhuofeng Gao
发明人： Zhonglin Wu , Lei Shi , Gang Cheng , Mulin Liu , Zhuofeng Gao
摘要： A radiating element includes a supporting element and a plurality of radiating units formed at one end of the supporting element. Each of the radiating units has a lower surface facing towards the supporting element and an upper surface facing away from the supporting element. The radiating element further includes a first and second dividing pieces symmetrically disposed on each of the radiating units. The radiating element also includes a loading element formed on the lower surface of each of the plurality of radiating units, wherein the loading element extends outward from the supporting element and along an edge of the radiating unit. Moreover, the radiating element includes an electrical connecting element for connecting the radiating units to a feeding cable, the electrical connecting element being lower than the upper surfaces of the radiating units.
摘要翻译： 辐射元件包括支撑元件和形成在支撑元件的一端的多个辐射单元。 每个辐射单元具有面向支撑元件的下表面和背离支撑元件的上表面。 辐射元件还包括对称地设置在每个辐射单元上的第一和第二分割片。 辐射元件还包括形成在多个辐射单元中的每一个的下表面上的加载元件，其中加载元件从支撑元件向外延伸并沿着辐射单元的边缘延伸。 此外，辐射元件包括用于将辐射单元连接到馈电电缆的电连接元件，电连接元件低于辐射单元的上表面。
-
43.发明授权Protein tyrosine phosphatase 1B inhibitor, preparation methods and uses thereof 失效蛋白酪氨酸磷酸酶1B抑制剂，其制备方法和用途公开(公告)号：US08183383B2
公开(公告)日：2012-05-22
申请号：US12530281
申请日：2008-02-26
IPC分类号： C07D277/30 , C07D263/34 , C07D233/00 , C07D233/61 , C07D417/10 , C07D413/10 , C07D401/10 , A61K31/445 , A61K31/44 , A61K31/425 , A61K31/42 , A61K31/415
CPC分类号： C07D277/30 , C07D417/12
摘要： PTP1B inhibitors with the following structure (formula I). Experiments indicate that these inhibitors can effectively inhibit the activity of protein tyrosine phosphatase 1B (PTP1B). They can be used as insulin sensitisers. They can be used to prevent, delay or treat diseases which are related to insulin antagonism mediated by PTP1B, especially diabetes type II and obesity. The invention also provides methods for preparing these inhibitors.
摘要翻译： 具有以下结构的PTP1B抑制剂（式I）。 实验表明，这些抑制剂能有效抑制蛋白酪氨酸磷酸酶1B（PTP1B）的活性。 它们可以用作胰岛素敏化剂。 它们可用于预防，延迟或治疗与PTP1B介导的胰岛素拮抗相关的疾病，特别是II型糖尿病和肥胖症。 本发明还提供了制备这些抑制剂的方法。
-
公开(公告)号：US08147138B2
公开(公告)日：2012-04-03
申请号：US12185134
申请日：2008-08-04
申请人： Lei Shi
发明人： Lei Shi
IPC分类号： G06F1/26
CPC分类号： G06F1/26 , Y10T307/76
摘要： An exemplary power supply circuit for a motherboard includes a control circuit, a self-locking circuit, and an unlocking circuit. The control circuit is configured for receiving a working mode signal. The self-locking circuit is arranged to receive a power ok signal and a power supply on signal from a power supply, and is connected to the control circuit and a standby power. The unlocking circuit is connected to the control circuit, the self-locking circuit and the standby power, and is also arranged to receive the power ok signal. When the motherboard is placed in an energy-saving mode, the unlocking circuit unlocks the standby power from the motherboard when the computer is turned off to achieve energy savings.
摘要翻译： 用于母板的示例性电源电路包括控制电路，自锁电路和解锁电路。 控制电路被配置为接收工作模式信号。 自锁电路被布置成从电源接收电源ok信号和电源接通信号，并且连接到控制电路和备用电源。 解锁电路连接到控制电路，自锁电路和备用电源，并且还被布置成接收电源ok信号。 当主板处于节能模式时，解锁电路在计算机关闭时解除主板上的备用电源以实现节能。
-
公开(公告)号：US20120049336A1
公开(公告)日：2012-03-01
申请号：US13289918
申请日：2011-11-04
申请人： Yan Xun Xue , Jun Lu , Lei Shi , Liang Zhao
发明人： Yan Xun Xue , Jun Lu , Lei Shi , Liang Zhao
IPC分类号： H01L23/495
CPC分类号： H01L24/73 , H01L21/4842 , H01L23/3107 , H01L23/49541 , H01L23/49551 , H01L24/29 , H01L24/37 , H01L24/40 , H01L24/48 , H01L24/83 , H01L24/84 , H01L24/85 , H01L24/92 , H01L24/97 , H01L2224/0603 , H01L2224/29339 , H01L2224/371 , H01L2224/37599 , H01L2224/48247 , H01L2224/73221 , H01L2224/83101 , H01L2224/83801 , H01L2224/8385 , H01L2224/85 , H01L2224/92 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01057 , H01L2924/01082 , H01L2924/014 , H01L2924/13091 , H01L2924/30107 , H01L2924/3011 , H01L2224/83 , H01L2224/84 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method is disclosed for attaching an interconnection plate to semiconductor die within leadframe package. A base leadframe is provided with die pad for attaching semiconductor die. An interconnection plate is provided for attachment to the base leadframe and semiconductor die. Add a base registration feature onto base leadframe and a plate registration feature onto interconnection plate with the registration features designed to match each other such that, upon approach of the interconnection plate to base leadframe, the two registration features would engage and guide each other causing concomitant self-aligned attachment of the interconnection plate to base leadframe. Next, the interconnection plate is brought into close approach to base leadframe to engage and lock plate registration feature to base registration feature hence completing attachment of the interconnection plate to semiconductor die and forming a leadframe package.
摘要翻译： 公开了一种将引线框封装内的互连板连接到半导体管芯的方法。 基座引线框架设置有用于附接半导体管芯的管芯焊盘。 提供互连板，用于附接到基底引线框架和半导体管芯。 将基准注册功能添加到基准引线框架和板对准特征到互连板上，其中配准特征被设计成彼此匹配，使得在互连板到基底引线框架的接近时，两个配准特征将相互接合并引导彼此引起伴随 互连板与基座引线框架的自对准连接。 接下来，使互连板靠近基底引线框架以将板对准特征接合并锁定到基准对准特征，从而完成互连板连接到半导体管芯并形成引线框封装。
-
46.发明授权公开(公告)号：US08073679B2
公开(公告)日：2011-12-06
申请号：US12842177
申请日：2010-07-23
CPC分类号： G06F17/2827 , G06F17/30014 , G06F17/30882
摘要： A set of candidate parallel pages is identified based on trigger words in one or more pages downloaded from a given network location (such as a website). A set of document trees representing each of the candidate pages are aligned to identify translationally parallel content and hyperlinks. The parallel content is further fed into conventional sentence aligner for parallel sentences. And the parallel hyperlinks usually refer to other parallel documents, and lead to a recursive mining of parallel documents.
摘要翻译： 基于从给定网络位置（诸如网站）下载的一个或多个页面中的触发词来识别一组候选并行页面。 表示每个候选页面的一组文档树被对齐以识别平移的平行内容和超链接。 将并行内容进一步馈送到常规句子对齐器中用于并行句子。 并行超链接通常是指其他并行文档，并导致并行文档的递归挖掘。
-
公开(公告)号：US08053874B2
公开(公告)日：2011-11-08
申请号：US12321761
申请日：2009-01-23
IPC分类号： H01L23/495
CPC分类号： H01L23/49524 , H01L23/49562 , H01L24/37 , H01L24/40 , H01L24/41 , H01L2224/32245 , H01L2224/37011 , H01L2224/4007 , H01L2224/40095 , H01L2224/40245 , H01L2224/40249 , H01L2224/4103 , H01L2224/73265 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01047 , H01L2924/01055 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/30107 , H01L2924/00 , H01L2924/00012 , H01L2224/37099
摘要： A semiconductor package is disclosed. The package includes a leadframe having drain, source and gate leads, a semiconductor die coupled to the leadframe, the semiconductor die having a plurality of metalized source areas and a metalized gate area, a patterned source connection having a plurality of dimples formed thereon coupling the source lead to the semiconductor die metalized source areas, a patterned gate connection having a dimple formed thereon coupling the gate lead to the semiconductor die metalized gate area, a semiconductor die drain area coupled to the drain lead, and an encapsulant covering at least a portion of the semiconductor die and drain, source and gate leads.
摘要翻译： 公开了半导体封装。 该封装包括具有漏极，源极和栅极引线的引线框架，耦合到引线框架的半导体管芯，具有多个金属化源极区域和金属化栅极区域的半导体管芯，具有形成在其上的多个凹坑的图案化源极连接， 源极引导到半导体芯片金属化源极区域，具有形成在其上的凹坑的图案化栅极连接将栅极引线耦合到半导体管芯金属化栅极区域，耦合到漏极引线的半导体管芯漏极区域和覆盖至少一部分的密封剂 的半导体管芯和漏极，源极和栅极引线。
-
公开(公告)号：US20110268803A1
公开(公告)日：2011-11-03
申请号：US13080371
申请日：2011-04-05
申请人： Robert K. Prud'homme , Patrick J. Sinko , Howard A. Stone , Nathalie M. Pinkerton , Lei Shi , Jiandi Wan , Sherif Ibrahim , Dayuan Gao
发明人： Robert K. Prud'homme , Patrick J. Sinko , Howard A. Stone , Nathalie M. Pinkerton , Lei Shi , Jiandi Wan , Sherif Ibrahim , Dayuan Gao
IPC分类号： A61K9/107 , A61K47/32 , A61K31/437 , A61P35/00 , A61P11/06 , A61K9/00 , A61K47/36 , B82Y5/00
CPC分类号： A61K9/1641 , A61K9/0019 , A61K9/1635 , A61K9/1647 , A61K31/437 , A61K31/4745
摘要： The American Cancer Society estimated that in 2009, 1,479,350 new cancer cases would be diagnosed in the United States of which 219,440 would be lung and bronchus related. The standard treatments for NSCLC include surgery, chemotherapy, radiation, laser and photodynamic therapy, all with various success rates depending on the stage of the cancer. National Cancer Institute assesses, however, that results of standard treatment are generally poor with only a 15 percent 5-year survival rate for combined cancer stages. Challenges facing the current chemotherapy drugs include excessive toxicity to healthy tissues and limited ability to prevent metastases. A dual drug delivery system described herein selectively targets the lung to deliver anti-cancer drugs and inhibit the formation of metastases.
摘要翻译： 美国癌症协会估计，在2009年，美国将诊断出1,479,350例新的癌症病例，其中219,440例与肺和支气管有关。 NSCLC的标准治疗方法包括手术，化学疗法，放射线，激光和光动力疗法，均取决于癌症的各个阶段。 然而，国家癌症研究所评估标准治疗结果普遍较差，联合癌症阶段的5年生存率只有15％。 目前化疗药物面临的挑战包括对健康组织的过度毒性和预防转移的能力有限。 本文描述的双重药物递送系统选择性地靶向肺以递送抗癌药物并抑制转移的形成。
-
公开(公告)号：US20110233746A1
公开(公告)日：2011-09-29
申请号：US12749505
申请日：2010-03-29
申请人： Kai Liu , Lei Shi , Jun Lu , Anup Bhalla
发明人： Kai Liu , Lei Shi , Jun Lu , Anup Bhalla
CPC分类号： H01L23/49575 , H01L23/3107 , H01L23/49524 , H01L23/49537 , H01L23/49562 , H01L23/49589 , H01L24/29 , H01L24/32 , H01L24/34 , H01L24/37 , H01L24/40 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/92 , H01L2224/24247 , H01L2224/291 , H01L2224/2919 , H01L2224/32245 , H01L2224/37011 , H01L2224/40095 , H01L2224/40245 , H01L2224/40247 , H01L2224/48247 , H01L2224/48465 , H01L2224/49111 , H01L2224/73219 , H01L2224/73221 , H01L2224/73265 , H01L2224/83801 , H01L2224/8385 , H01L2224/92246 , H01L2924/00014 , H01L2924/01005 , H01L2924/01013 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/1306 , H01L2924/13091 , H01L2924/19041 , H01L2924/19105 , H01L2924/30107 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2224/37099
摘要： A dual-leadframe multi-chip package comprises a first leadframe with a first die pad, and a second leadframe with a second die pad; a first chip mounted on the first die pad functioning as a high-side MOSFET and second chip mounted on the second die pad functioning as a low-side MOSFET. The package may further comprises a bypass capacity configured as a third chip mounted on the first die pad or integrated with the first chip. The package may further comprise a three-dimensional connecting plate formed as an integrated structure as the second die pad for electrically connecting a top contact area of the first chip to a bottom contact area of the second chip. A top connecting plate connects a top contact area of the second chip and a top contact area of the third chip to an outer pin of the first leadframe.
摘要翻译： 双引线框多芯片封装包括具有第一管芯焊盘的第一引线框架和具有第二管芯焊盘的第二引线框架; 安装在用作高边MOSFET的第一芯片焊盘上的第一芯片和安装在用作低端MOSFET的第二芯片焊盘上的第二芯片。 封装还可以包括配置为安装在第一裸片焊盘上或与第一芯片集成的第三芯片的旁路容量。 封装还可以包括形成为一体结构的三维连接板作为第二芯片焊盘，用于将第一芯片的顶部接触区域电连接到第二芯片的底部接触区域。 顶部连接板将第二芯片的顶部接触区域和第三芯片的顶部接触区域连接到第一引线框架的外部引脚。
-
50.发明申请公开(公告)号：US20100286978A1
公开(公告)日：2010-11-11
申请号：US12842177
申请日：2010-07-23
IPC分类号： G06F17/28
CPC分类号： G06F17/2827 , G06F17/30014 , G06F17/30882
摘要： A set of candidate parallel pages is identified based on trigger words in one or more pages downloaded from a given network location (such as a website). A set of document trees representing each of the candidate pages are aligned to identify translationally parallel content and hyperlinks. The parallel content is further fed into conventional sentence aligner for parallel sentences. And the parallel hyperlinks usually refer to other parallel documents, and lead to a recursive mining of parallel documents.
摘要翻译： 基于从给定网络位置（诸如网站）下载的一个或多个页面中的触发词来识别一组候选并行页面。 表示每个候选页面的一组文档树被对齐以识别平移的平行内容和超链接。 将并行内容进一步馈送到常规句子对齐器中用于并行句子。 并行超链接通常是指其他并行文档，并导致并行文档的递归挖掘。
-
-
-
-
-
-
-
-
-
搜索结果
208 条记录 (耗时 0.06 秒)
