摘要:
The present invention is directed to methods to harvest, integrate and exploit nanomaterials, and particularly elongated nanowire materials. The invention provides methods for harvesting nanowires that include selectively etching a sacrificial layer placed on a nanowire growth substrate to remove nanowires. The invention also provides methods for integrating nanowires into electronic devices that include placing an outer surface of a cylinder in contact with a fluid suspension of nanowires and rolling the nanowire coated cylinder to deposit nanowires onto a surface. Methods are also provided to deposit nanowires using an ink-jet printer or an aperture to align nanowires. Additional aspects of the invention provide methods for preventing gate shorts in nanowire based transistors. Additional methods for harvesting and integrating nanowires are provided.
摘要:
A reflective light imaging system for use in high-throughput screening of samples disposed in multiple-well plates. The system can include a set of mirrors and lenses. The first mirror has a central aperture through which light from the object passes. The first mirror has a concave reflective surface that faces the image plane. The next element is a second mirror with a convex reflective surface. The system can include an aberration corrective system positioned between the second mirror and the image plane, and an optical sensor near the image plane. Light from an object passes through the central aperture of the first mirror and is reflected off the convex surface of the second mirror. The light then strikes the reflective surface of the first mirror. The light from the first mirror is then collected by the aberration correction system and transmitted toward the image plane.
摘要:
A broad-range light-detection system. In some embodiments, the system includes apparatus and methods for detecting light with high accuracy over a broad range of intensities. In other embodiments, the system includes apparatus and methods for automatically scaling the detection range to improve detection based on the intensity of the detected light. In yet other embodiments, the system includes apparatus and methods for detecting light with increased speed, particularly in applications involving analysis of successive samples.
摘要:
The present invention comprises a system and method for the control of the temperature of an article, particularly in a vacuum. The system is applicable to control of reticle temperature in a electron beam or ion beam lithography system. The system includes non-contacting radiation heat sources to selectively apply localized radiant heat to achieve and maintain temperature uniformity across the reticle. The method generally includes applying initial heat once after the reticle is initially loaded into the lithography system from an external environment, applying exposure heat when other reticles are being exposed and applying heat during the wafer load cycle when a new wafer is loaded and the electron or ion beam is blanked. The operating temperature of the reticle is uniformly maintained at a temperature slightly above the ambient temperature. The temperature uniformly of the reticle is important for fabricating defect-free wafers, resulting in high yields.
摘要:
The ion beam which performs the printing on the resist through the mask is also used to perform the alignment function. Alignment marks are initially provided on the wafer of a material which emits light when an ion beam impinges thereon, such as silicon dioxide. An ion mask, preferably of silicon, is then positioned over the wafer and alignment marks and ions are directed to the alignment marks through the mask. The degree of alignment is determined by the amount of light emitted by the alignment marks since more ions will strike the alignment marks with increased alignment. The emitted light is detected and +X, -X, +Y, -Y and +theta and -theta error signals are provided on a continuous basis for closed loop control of the mask relative to the wafer under proper alignment is achieved. The control is provided by scanning the emitted light from six appropriately positioned alignment marks on the wafer, comparing the intensity of the emitted light in terms of +X amd -X signals to provide an X error signal, doing the same with the Y and theta signals to provide Y and theta error signals and then digitizing each of the error signals in a digital to analog converter. The digitized signals are then applied to a central processing unit wherein they are analyzed in accordance with a predetermined program and provide signals to a motor controller. The motor controller proceeds to provide output signals to properly position the wafer in the X and Y directions as well as to rotate the mask to provide the desired alignment between the mask and wafer.
摘要:
Broad-range light-detection systems, including components and methods of use thereof. These systems may include apparatus and methods for detecting light with increased speed and/or detection efficiency, particularly in applications involving repeated analysis of the same sample and/or successive analysis of different samples, and particularly when the sample or samples have a wide range of light intensities. These systems also may include apparatus and methods for detecting light with increased accuracy over a broad range of intensities. These systems also may include vapparatus and methods for automatically scaling detection range to improve detection based on the intensity of the detected light.
摘要:
The invention provides an integrated sample-processing system and components thereof for preparing and/or analyzing samples. The components may include a transport module, a fluidics module, and an analysis module, among others.
摘要:
Apparatus and methods for optical detection with improved read speed and/or signal-to-noise ratio. These apparatus and methods may involve among others moving an sample substrate (108) while simulataneously detecting light transmitted from one or more sample sites (110) on the substrate (108) by sequentially tracking the sample sites (110) as they move. A stage (101), movable in a first direction, supports the substrate (108). A detector (118) detects light emanating from an examination region (102) delimited by a detection initiation position (106a) and a detection termination position (106b). An optical relay structure (122) transmit light from the examination region (102) to the detector (118). A scanning mechanism (120) simultaneously moves the optical relay structure (122) and the substrate in the first direction. The optical relay structure (122) tracks the substrate (108) between the detection initiation position (106a) and the detection termination position (106b).
摘要:
Electron-beam lithography systems used for transferring images from subfields in a reticle to a wafer. Deflection systems in the electronic lens system are controlled by control systems that include devices to correct misalignment of the electron beams from each of the subfields with the electronic optical axis. In a first embodiment, switches switch between sources to deflect the electron beams to the electronic optical axis and error DACs correct position errors in the sources that are input to the switches. In a second embodiment, the deflection systems deflect the electronic optical axis to coincide with the electron beams from the subfields. In other embodiments, the deflection systems in the electronic lens systems are made insensitive to position errors in deflection control systems by satisfying the condition: G.sub.1 /G.sub.2 =M, where G.sub.1 is the gain of first amplifier amplifying a signal from a DAC which is input to the deflection system deflecting the electron beams from the subfields, G.sub.2 is the gain of a second amplifier amplifying the signal from the DAC which is input to the deflection system deflecting the electron beams to the wafer and M is the magnification of the electronic lens system. Alternatively, the deflection systems deflect the electronic optical axis to coincide with the electron beams from the sub fields. A grillage error DAC supplies a position correction to account for grillage between the subfields. In still other embodiments, a ramp generator supplies a ramp that is input to the deflection systems that are insensitive to position errors in deflection control systems by satisfying the condition: G.sub.1 /G2=M.