摘要:
A quick heater for drinking water includes a helical water pipe defining a narrow space therebetween for fitting an electric heating tube and having a water inlet and a water outlet. The water pipe and the electric heating tube are wrapped up with a support base having its outer side bored with plural holes respectively for the opposite ends of the water pipe and two wire connecting terminals of the electric heating tube to extend out therethrough. The support base has plural lugs at the inner side for support a container with a water intake pipe and a water-releasing pipe, the water intake pipe connected with the water outlet of the water pipe. When cool water gets into the water pipe, it flows circularly therein and is heated by the electric heating tube, and then conveyed to the container for use through the water intake pipe.
摘要:
A food processor blade unit includes an upper blade and a lower blade and a shaft. The upper blade has two side sections respectively divided into a first stage, a second stage and a third stage all angled differently. The lower blade has two side sections divided into a level section and a sloped section with a bending-down end section. Both the upper and the lower blade further respectively have one lengthwise side formed with a blade edge. Then the three stages of the upper blade can cut food into minute bits, and the level section and the sloped section of the lower blade can cut, stir and churn cut food repeatedly again and again into juice, minute bits or powder.
摘要:
An integrated circuit device includes a semiconductor substrate and a first transistor and a second transistor constructed in the semiconductor substrate. The first transistor has a first operating voltage higher than a second operating voltage of a second transistor. The first transistor includes a first drain structure, a first source structure, an isolation structure and a first gate structure. The first source structure includes a high voltage first-polarity well region, a first-polarity body region, a heavily doped first-polarity region, a second-polarity grade region and a heavily doped second-polarity region. The heavily doped second-polarity region is surrounded by the second-polarity grade region. The second-polarity grade region is surrounded by the first-polarity body region. The second transistor includes a second drain structure, a second source structure, a second gate structure and a first-polarity drift region. The first-polarity drift region and the first-polarity body region have the same dopant concentration.
摘要:
A layout pattern of a high voltage metal-oxide-semiconductor transistor device includes a first doped region having a first conductivity type, a second doped region having the first conductivity type, and an non-continuous doped region formed in between the first doped region and the second doped region. The non-continuous doped region includes a plurality of gaps formed therein. The non-continuous doped region further includes a second conductivity type complementary to the first conductivity type.
摘要:
A layout pattern of a high voltage metal-oxide-semiconductor transistor device includes a first doped region having a first conductivity type, a second doped region having the first conductivity type, and an non-continuous doped region formed in between the first doped region and the second doped region. The non-continuous doped region includes a plurality of gaps formed therein. The non-continuous doped region further includes a second conductivity type complementary to the first conductivity type.
摘要:
An integrated circuit device including: a first die, a first die bonding pad formed on the first die, a gold bump electrode formed on the first bonding pad, and a copper wire having a first end portion stitch bonded to the gold bump electrode; and a method of forming the integrated circuit device.
摘要:
The present invention provides a high-voltage semiconductor device including a deep well, a first doped region disposed in the deep well, a high-voltage well, a second doped region disposed in the high-voltage well, a first gate structure disposed on the high-voltage well between the second doped region and the first doped region, a doped channel region disposed in the high-voltage region and in contact with the second doped region and the deep well, and a third doped region disposed in the high-voltage well. The high-voltage well has a first conductive type, and the deep well, the first doped region, the second doped region, the doped channel region, and the third doped region have a second conductive type different from the first conductive type.
摘要:
The present invention provides a high-voltage semiconductor device including a deep well, a first doped region disposed in the deep well, a high-voltage well, a second doped region disposed in the high-voltage well, a first gate structure disposed on the high-voltage well between the second doped region and the first doped region, a doped channel region disposed in the high-voltage region and in contact with the second doped region and the deep well, and a third doped region disposed in the high-voltage well. The high-voltage well has a first conductive type, and the deep well, the first doped region, the second doped region, the doped channel region, and the third doped region have a second conductive type different from the first conductive type.