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公开(公告)号：US10231342B2
公开(公告)日：2019-03-12
申请号：US15487547
申请日：2017-04-14
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Shigeru Tago , Hirofumi Shinagawa , Yuki Wakabayashi
IPC: H05K5/00 , H05K7/00 , H05K1/18 , H01L23/538 , H05K1/03 , H05K1/09 , H05K1/11 , H05K3/46 , H05K1/16 , H05K1/02
Abstract: A component built-in substrate incorporates a chip capacitor in a multilayer substrate including laminated base material layers made of thermoplastic resin. The chip capacitor includes an uneven portion including a recessed portion and a projected portion on one side in a laminated direction. On one side of the chip capacitor in the multilayer substrate, a density of low fluid member with a melting point higher than a fluidization temperature of the base material layers is higher in a region overlapping the recessed portion of the chip capacitor than in a region overlapping the projected portion of the chip capacitor when viewed in the lamination direction.
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公开(公告)号：US10158157B2
公开(公告)日：2018-12-18
申请号：US15364899
申请日：2016-11-30
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Nobuo Ikemoto , Yuki Wakabayashi , Shigeru Tago
IPC: H01P3/08 , H05K1/02 , H05K1/11 , H05K3/36 , H05K3/46 , H01P11/00 , H01R12/62 , H05K1/14 , H05K3/00 , H01R103/00 , H01R24/50
Abstract: In a high frequency signal line, a first signal line extends along a first dielectric element assembly, a first reference ground conductor extends along the first signal line, a second signal line is provided in or on the second dielectric element assembly and extends along the second dielectric element assembly, a second reference ground conductor is provided in or on the second dielectric element assembly and extends along the second signal line. A portion of a bottom surface at an end of the first dielectric element assembly and a portion of the top surface at an end of the second dielectric element assembly are joined together such that a joint portion of the first and second dielectric element assemblies includes a corner. The second signal line and the first signal line are electrically coupled together. The first and second reference ground conductors are electrically coupled together.
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公开(公告)号：US09854677B2
公开(公告)日：2017-12-26
申请号：US15214611
申请日：2016-07-20
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Shigeru Tago , Hirofumi Shinagawa , Masaki Kawata , Yuki Ito
CPC classification number: H05K1/181 , H05K1/0393 , H05K1/11 , H05K1/111 , H05K1/118 , H05K3/32 , H05K3/328 , H05K2201/0129 , H05K2201/0141 , H05K2201/0154 , H05K2201/05 , H05K2203/0285 , Y02P70/611
Abstract: A module component includes a substrate including a liquid crystal polymer resin sheet, and an electronic component mounted on the substrate by ultrasonic bonding, wherein the electronic component includes a plurality of first substrate connecting electrodes including respective planar conductors provided on a substrate mounting surface separately from each other, and connected at a same potential or substantially a same potential, and the substrate includes a first component connecting electrode including a planar conductor provided on a component loading surface, and bonded to the plurality of first substrate connecting electrodes.
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公开(公告)号：US09666925B2
公开(公告)日：2017-05-30
申请号：US14796027
申请日：2015-07-10
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Kuniaki Yosui , Nobuo Ikemoto , Shigeru Tago , Zhujun Yang , Jun Sasaki , Fumie Matsuda , Wataru Tamura
CPC classification number: H01P3/026 , H01P3/085 , H05K1/0225 , H05K1/0227 , H05K1/0242 , H05K1/025 , H05K1/028 , H05K1/147 , H05K1/18 , H05K2201/09618 , H05K2201/09727
Abstract: A main transmission line includes a substantially elongated dielectric body in which first and second substantially elongated signal conductors are disposed with a distance therebetween in a width direction. A first reference ground conductor and a first auxiliary ground conductor sandwich therebetween the first signal conductor in a thickness direction. A second reference ground conductor and a second auxiliary ground conductor sandwich therebetween the second signal conductor in the thickness direction. The second auxiliary ground conductor includes two substantially elongated conductors and a first bridge conductor, and the second auxiliary ground conductor includes two substantially elongated conductors and a second bridge conductor. The positions of the first and second bridge conductors in a lengthwise direction are different.
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公开(公告)号：US09629249B2
公开(公告)日：2017-04-18
申请号：US14939102
申请日：2015-11-12
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Shigeru Tago , Yuki Wakabayashi , Hirofumi Shinagawa
CPC classification number: H05K1/185 , H01L23/5389 , H01L24/19 , H01L2224/04105 , H05K1/0298 , H05K1/0313 , H05K1/11 , H05K1/186 , H05K3/4617 , H05K3/4632 , H05K2201/0141 , H05K2201/0154 , H05K2201/10515
Abstract: A component-embedded substrate includes a first embedded component positioned in a layer close to a mounting electrode and a second embedded component positioned in a layer farther away from the mounting electrode than the first embedded component. The first and second embedded components include electrically connected terminals. Each resin film of the substrate is formed of thermoplastic resin. The first embedded component has more terminals than the second embedded component. Many of the internal wires from the first and second embedded component extend towards a mounting surface where the mounting electrode is provided. However, since in plan view the area of the first embedded component is smaller than the second embedded component, and the first embedded component is disposed closer to the mounting surface than the second embedded component, there is space for routing the internal wires at the side of the mounting surface of the substrate.
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Patent Agency Ranking
公开(公告)号：US20160066428A1
公开(公告)日：2016-03-03
申请号：US14939102
申请日：2015-11-12
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Shigeru Tago , Yuki Wakabayashi , Hirofumi Shinagawa
CPC classification number: H05K1/185 , H01L23/5389 , H01L24/19 , H01L2224/04105 , H05K1/0298 , H05K1/0313 , H05K1/11 , H05K1/186 , H05K3/4617 , H05K3/4632 , H05K2201/0141 , H05K2201/0154 , H05K2201/10515
Abstract: A component-embedded substrate includes a first embedded component positioned in a layer close to a mounting electrode and a second embedded component positioned in a layer farther away from the mounting electrode than the first embedded component. The first and second embedded components include electrically connected terminals. Each resin film of the substrate is formed of thermoplastic resin. The first embedded component has more terminals than the second embedded component. Many of the internal wires from the first and second embedded component extend towards a mounting surface where the mounting electrode is provided. However, since in plan view the area of the first embedded component is smaller than the second embedded component, and the first embedded component is disposed closer to the mounting surface than the second embedded component, there is space for routing the internal wires at the side of the mounting surface of the substrate.
Abstract translation: 组件嵌入式基板包括位于靠近安装电极的层中的第一嵌入式部件和位于比第一嵌入式部件更远离安装电极的层中的第二嵌入式部件。 第一和第二嵌入式部件包括电连接端子。 基板的各树脂膜由热塑性树脂形成。 第一个嵌入式组件具有比第二个嵌入式组件更多的端子。 来自第一和第二嵌入式部件的许多内部电线朝向设置有安装电极的安装表面延伸。 然而，由于在平面图中，第一嵌入式部件的面积小于第二嵌入式部件，所以第一嵌入部件配置成比第二嵌入部件更靠近安装面，因此存在用于在侧面布线内部电线的空间 的基板的安装表面。
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公开(公告)号：US20160050766A1
公开(公告)日：2016-02-18
申请号：US14926316
申请日：2015-10-29
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hirofumi Shinagawa , Shigeru Tago , Masaki Kawata , Yuki Ito
CPC classification number: H05K3/32 , H01L2224/16225 , H01L2224/81 , H05K1/185 , H05K1/186 , H05K3/0073 , H05K3/306 , H05K3/4611 , H05K3/4632 , H05K3/4644 , H05K3/4697 , H05K2201/0129 , H05K2203/061 , H05K2203/063
Abstract: A method for manufacturing a resin multilayer board formed from a thermoplastic resin, which method allows for improvement in accuracy of the position of a component relative to the resin multilayer board, is provided. A method for manufacturing a resin multilayer board includes: a step of bonding a component to a pressure-sensitive adhesive layer of a pressure-sensitive adhesive sheet having the pressure-sensitive adhesive layer on a surface thereof; a step of opposing a thermoplastic resin sheet to the pressure-sensitive adhesive layer, and fixing the component bonded to the pressure-sensitive adhesive sheet and the thermoplastic resin sheet to each other by heating; a step of peeling the pressure-sensitive adhesive sheet from the component fixed to the thermoplastic resin sheet; and stacking and thermally welding a plurality of thermoplastic resin sheets including the thermoplastic resin sheet to which the component has been transferred.
Abstract translation: 提供一种制造由热塑性树脂形成的树脂多层板的方法，该方法允许提高部件相对于树脂多层板的位置的精度。 一种树脂多层板的制造方法，其特征在于，具有：将表面粘合有粘合剂层的压敏粘合剂片的粘合剂层的工序; 将热塑性树脂片与所述粘合剂层相对的步骤，通过加热使与所述粘合片和所述热塑性树脂片接合的成分相互固定; 将粘合片从固定在热塑性树脂片上的部件剥离的工序; 并且堆叠并热熔接多个热塑性树脂片，所述多个热塑性树脂片包括已经转移了所述部件的热塑性树脂片。
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公开(公告)号：US09185795B2
公开(公告)日：2015-11-10
申请号：US14103914
申请日：2013-12-12
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Noboru Kato , Shigeru Tago , Jun Sasaki , Satoshi Sasaki
IPC: H03H7/38 , H05K1/02 , H01P3/02 , H04B15/00 , H01P3/10 , H01P3/08 , H01P3/12 , H01P3/00 , H05K1/03 , H05K1/11 , H01P1/203
CPC classification number: H01P3/085 , H01L2224/16225 , H01L2924/19105 , H01P1/20363 , H01P3/003 , H01P3/026 , H01P3/08 , H01P3/10 , H01P3/121 , H03H7/38 , H04B15/00 , H05K1/0219 , H05K1/0225 , H05K1/0242 , H05K1/025 , H05K1/0253 , H05K1/028 , H05K1/0393 , H05K1/113 , H05K2201/09618 , H05K2201/0969 , H05K2201/09727
Abstract: Unwanted radiation is reduced in a high-frequency signal transmission line that includes a ground conductor provided with an opening that overlaps a signal line. A dielectric element assembly has a relative dielectric constant ∈1 and has a first principal surface and a second principal surface. A signal line is provided in the dielectric element assembly. A ground conductor is provided in the dielectric element assembly and on the first principal surface side with respect to the signal line, faces the signal line, and is provided with an opening that overlaps the signal line. A high dielectric constant layer has a relative dielectric constant ∈2 higher than the relative dielectric constant ∈1 and is provided on the first principal surface so as to overlap the opening.
Abstract translation: 在包括具有与信号线重叠的开口的接地导体的高频信号传输线中减少了不需要的辐射。 电介质元件组件具有相对介电常数ε1并且具有第一主表面和第二主表面。 信号线设置在电介质元件组件中。 接地导体设置在电介质元件组件中，并且相对于信号线在第一主表面侧面对信号线，并且设置有与信号线重叠的开口。 高介电常数层的相对介电常数ε2比相对介电常数ε1高，并且设置在第一主表面上以与开口重叠。
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公开(公告)号：US09007151B2
公开(公告)日：2015-04-14
申请号：US14151871
申请日：2014-01-10
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Noboru Kato , Shigeru Tago , Jun Sasaki , Junichi Kurita , Satoshi Sasaki
IPC: H01P3/08 , H05K1/02 , H01P3/02 , H04B15/00 , H01P3/10 , H03H7/38 , H01P3/12 , H01P3/00 , H05K1/03 , H05K1/11 , H01P1/203
CPC classification number: H01P3/085 , H01L2224/16225 , H01L2924/19105 , H01P1/20363 , H01P3/003 , H01P3/026 , H01P3/08 , H01P3/10 , H01P3/121 , H03H7/38 , H04B15/00 , H05K1/0219 , H05K1/0225 , H05K1/0242 , H05K1/025 , H05K1/0253 , H05K1/028 , H05K1/0393 , H05K1/113 , H05K2201/09618 , H05K2201/0969 , H05K2201/09727
Abstract: An easily bendable high-frequency signal transmission line includes a dielectric body including a protection layer and dielectric sheets laminated on each other, a surface and an undersurface. A signal line is a linear conductor disposed in the dielectric body. A ground conductor is disposed in the dielectric body, faces the signal line via the dielectric sheet, and continuously extends along the signal line. A ground conductor is disposed in the dielectric body, faces the ground conductor via the signal line sandwiched therebetween, and includes a plurality of openings arranged along the signal line. The surface of the dielectric body on the side of the ground conductor with respect to the signal line is in contact with a battery pack.
Abstract translation: 容易弯曲的高频信号传输线包括电介质体，其包括彼此层叠的保护层和电介质片，表面和下表面。 信号线是布置在电介质体中的线状导体。 接地导体设置在电介质体中，经由电介质片面对信号线，并沿信号线连续延伸。 接地导体设置在电介质体中，经由夹在其间的信号线面对接地导体，并且包括沿信号线布置的多个开口。 接地导体相对于信号线一侧的电介质体的表面与电池组接触。
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公开(公告)号：US08659370B2
公开(公告)日：2014-02-25
申请号：US13945947
申请日：2013-07-19
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Noboru Kato , Shigeru Tago , Jun Sasaki , Junichi Kurita , Satoshi Sasaki
IPC: H03H7/38
CPC classification number: H01P3/085 , H01L2224/16225 , H01L2924/19105 , H01P1/20363 , H01P3/003 , H01P3/026 , H01P3/08 , H01P3/10 , H01P3/121 , H03H7/38 , H04B15/00 , H05K1/0219 , H05K1/0225 , H05K1/0242 , H05K1/025 , H05K1/0253 , H05K1/028 , H05K1/0393 , H05K1/113 , H05K2201/09618 , H05K2201/0969 , H05K2201/09727
Abstract: An easily bendable high-frequency signal transmission line includes a dielectric body including a protection layer and dielectric sheets laminated on each other, a surface and an undersurface. A signal line is a linear conductor disposed in the dielectric body. A ground conductor is disposed in the dielectric body, faces the signal line via the dielectric sheet, and continuously extends along the signal line. A ground conductor is disposed in the dielectric body, faces the ground conductor via the signal line sandwiched therebetween, and includes a plurality of openings arranged along the signal line. The surface of the dielectric body on the side of the ground conductor with respect to the signal line is in contact with a battery pack.
Abstract translation: 容易弯曲的高频信号传输线包括电介质体，其包括彼此层叠的保护层和电介质片，表面和下表面。 信号线是布置在电介质体中的线状导体。 接地导体设置在电介质体中，经由电介质片面对信号线，并沿信号线连续延伸。 接地导体设置在电介质体中，经由夹在其间的信号线面对接地导体，并且包括沿信号线布置的多个开口。 接地导体相对于信号线一侧的电介质体的表面与电池组接触。
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