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公开(公告)号:US20220066088A1
公开(公告)日:2022-03-03
申请号:US17446505
申请日:2021-08-31
Applicant: NICHIA CORPORATION
Inventor: Keiji EMURA , Takuya NAKABAYASHI , Toru HASHIMOTO
IPC: F21V8/00
Abstract: A method of manufacturing a light emitting module includes: providing an intermediate that includes a light guide having a first principal face and a second principal face opposing the first principal face, a plurality of light sources disposed on the second principal face of the light guide, and a wiring layer disposed on the second principal face and electrically connected to the plurality of light sources; allowing the plurality of light sources to emit light and measuring optical characteristics of the emitted light; and forming an optical characteristic correcting element in the intermediate based on the measured optical characteristics.
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公开(公告)号:US20210167267A1
公开(公告)日:2021-06-03
申请号:US17174804
申请日:2021-02-12
Applicant: NICHIA CORPORATION
Inventor: Takuya NAKABAYASHI , Gensui TAMURA
Abstract: A light emitting device includes a substrate including a base member including a front surface, a rear surface opposite to the front surface, a bottom surface perpendicular to the front surface, and a top surface opposite to the bottom surface, a first wiring portion located on the front surface, and a second wiring portion located on the rear surface; a light emitting element electrically connected with the first wiring portion; and a first reflective member covering a lateral surface of the light emitting element and the front surface of the base member. The base member has a recessed portion opened on the rear surface and the bottom surface. The substrate includes a third wiring portion covering an inner wall of the recessed portion and electrically connected with the second wiring portion, and a via in contact with the first wiring portion, the second wiring portion and the third wiring portion.
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公开(公告)号:US20210050488A1
公开(公告)日:2021-02-18
申请号:US17086975
申请日:2020-11-02
Applicant: NICHIA CORPORATION
Inventor: Takuya NAKABAYASHI , Tadaaki IKEDA , Toru HASHIMOTO , Yukiko YOKOTE
Abstract: A light emitting device includes a first light emitting element including a rectangular first light extraction surface, a second light emitting element including a rectangular second light extraction surface and emitting light having an emission peak wavelength different from an emission peak wavelength of the first light emitting element, and a light-transmissive member covering the first light extraction surface and the second light extraction surface. The light-transmissive member includes a first light-transmissive layer facing the first light extraction surface and the second light extraction surface, a wavelength conversion layer located on the first light-transmissive layer, and a second light-transmissive layer located on the wavelength conversion layer. The first light-transmissive layer contains a first matrix and first diffusive particles. The wavelength conversion layer contains a second matrix and wavelength conversion particles. The second light-transmissive layer contains a third matrix and second diffusive particles.
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公开(公告)号:US20200303599A1
公开(公告)日:2020-09-24
申请号:US16898388
申请日:2020-06-10
Applicant: NICHIA CORPORATION
Inventor: Tadaaki IKEDA , Takuya NAKABAYASHI
Abstract: A light emitting device is provided. The light emitting device includes a light emitting element, which emits blue light, and a light transmissive member having a first principal face bonded to the light emitting element and a second principal face opposite the first principal face. The light transmissive member has a light transmissive base material and wavelength conversion substances, which are contained in the base material and which absorb the light from the light emitting element and emit light. The wavelength conversion substances are localized in the base material towards the first principal face, and include a first phosphor which emits green to yellow light and a second phosphor which emits red light. The first phosphor is more localized towards the first principal face than the second phosphor. The second phosphor is a manganese-activated fluoride phosphor.
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公开(公告)号:US20200091384A1
公开(公告)日:2020-03-19
申请号:US16693072
申请日:2019-11-22
Applicant: NICHIA CORPORATION
Inventor: Takuya NAKABAYASHI
Abstract: A method of manufacturing a light emitting device includes: providing a substrate including a pair of connection terminals, the connection terminals each having a protruding portion at least on a first main surface of the connection terminal; providing a light emitting element on the protruding portion, the light emitting element having a semiconductor laminate and a pair of electrodes on a same surface of the semiconductor laminate; bonding the pair of the electrodes of the light emitting element and the pair of the connection terminals, respectively, by a molten material; and embedding a surface of the protruding portion of the connection terminals, a surface of the molten material, and a space between the substrate and the light emitting element into a light reflecting member.
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公开(公告)号:US20190305193A1
公开(公告)日:2019-10-03
申请号:US16369046
申请日:2019-03-29
Applicant: NICHIA CORPORATION
Inventor: Kenichi AOYAGI , Takashi KAIDE , Takuya NAKABAYASHI , Tetsuya ISHIKAWA , Shoji HOSOKAWA
Abstract: A wavelength converting member comprising a first wavelength converting layer containing: a first fluorescent material having a light emission peak wavelength in a range of 620 nm or more and 660 nm or less; a second fluorescent material having a light emission peak wavelength in a range of 510 nm or more and 560 nm or less; and a resin, wherein the average particle diameter, as measured according to a Fisher Sub-Sieve Sizer method, of the first fluorescent material is in a range of 2 μm or more and 30 μm or less, wherein the second fluorescent material comprises a β-SiAlON fluorescent material, the circularity of the β-SiAlON fluorescent material is 0.7 or more, and the volume average particle diameter, as measured according to a laser diffraction scattering particle size distribution measuring method, of the β-SiAlON fluorescent material is in a range of 2 μm or more and 30 μm or less, and wherein the thickness of the first wavelength converting layer is in a range of 50 μm or more and 200 μm or less.
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公开(公告)号:US20190267530A1
公开(公告)日:2019-08-29
申请号:US16405651
申请日:2019-05-07
Applicant: NICHIA CORPORATION
Inventor: Takuya NAKABAYASHI , Akira HORI
Abstract: A light emitting device includes a substrate, a light emitting clement and a light transmissive member. The substrate has a first main surface, a second main surface, and a mounting surface. The substrate includes an insulating base material defining a concave component opening on the second main surface and the mounting surface, a pair of connection terminals disposed on the first main surface, a pair of external connection sections disposed on the second main surface, and a pair of vias arranged at positions that interpose therebetween a line passing through a center of the concave component when viewed along a direction normal to the second main surface. The light emitting element has a pair of electrodes which connect to element connection sections of the pair of connection terminals. The light transmissive member is disposed on an upper surface of the light emitting element.
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公开(公告)号:US20190198722A1
公开(公告)日:2019-06-27
申请号:US16229409
申请日:2018-12-21
Applicant: NICHIA CORPORATION
Inventor: Takuya NAKABAYASHI , Tadaaki IKEDA , Toru HASHIMOTO , Yukiko YOKOTE
CPC classification number: H01L33/502 , C09K11/617 , H01L25/0753 , H01L33/58 , H01L33/60 , H01L33/62 , H01L33/647 , H01L2933/0091
Abstract: A light emitting device includes a first light emitting element including a rectangular first light extraction surface, a second light emitting element including a rectangular second light extraction surface and emitting light having an emission peak wavelength different from an emission peak wavelength of the first light emitting element, and a light-transmissive member covering the first light extraction surface and the second light extraction surface. The light-transmissive member includes a first light-transmissive layer facing the first light extraction surface and the second light extraction surface, a wavelength conversion layer located on the first light-transmissive layer, and a second light-transmissive layer located on the wavelength conversion layer. The first light-transmissive layer contains a first matrix and first diffusive particles. The wavelength conversion layer contains a second matrix and wavelength conversion particles. The second light-transmissive layer contains a third matrix and second diffusive particles.
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公开(公告)号:US20190131505A1
公开(公告)日:2019-05-02
申请号:US16217365
申请日:2018-12-12
Applicant: NICHIA CORPORATION
Inventor: Takuya NAKABAYASHI , Akira HORI
CPC classification number: H01L33/647 , H01L25/0753 , H01L33/32 , H01L33/486 , H01L33/502 , H01L33/54 , H01L33/56 , H01L33/60 , H01L33/62 , H01L33/642 , H01L2224/16225
Abstract: A light emitting device includes a substrate, a light emitting element, a light transmissive member and a sealing member. The substrate has a first main surface, a second main surface that is opposite from the first main surface, and a mounting surface that is adjacent to at least the second main surface. The substrate includes an insulating base material, and a pair of connection terminals. The insulating base material defines a concave component opening on the second main surface and the mounting surface. The connection terminals are disposed on the first main surface, and respectively have element connection sections with convex shapes. The light emitting element has a pair of electrodes which connect to the element connection sections of the pair of connection terminals. The light transmissive member is disposed on an upper surface of the light emitting element. The sealing member is in contact with at least a part of a side surface of the light emitting element, covers a side surface of the light transmissive member, and is formed substantially in the same plane as the substrate on the mounting surface.
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公开(公告)号:US20190067542A1
公开(公告)日:2019-02-28
申请号:US16116494
申请日:2018-08-29
Applicant: NICHIA CORPORATION
Inventor: Takuya NAKABAYASHI
CPC classification number: H01L33/62 , H01L33/486 , H01L33/507 , H01L33/54 , H01L33/60 , H01L2933/0033 , H01L2933/0041 , H01L2933/005 , H01L2933/0058 , H01L2933/0066
Abstract: A method of manufacturing a substrate for a light emitting device includes: forming wiring to form a plurality of first wiring parts and second wiring parts on/above an upper surface of a base member; forming projection parts including a first projection part on each of the first wiring parts and a second projection part on each of the second wiring parts by forming a first metal film on a region including at least parts of the first wiring parts and the second wiring parts and etching the first metal film using a resist for forming projection part; and forming an alignment mark by forming a second metal film on the substrate and etching the second metal film using a resist, wherein the resist for forming the projection part and the resist for forming alignment mark are exposed to light in an identical step of exposing to light.
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