公开(公告)号：US20170005028A1

公开(公告)日：2017-01-05

申请号：US14788303

申请日：2015-06-30

Applicant: STMicroelectronics, Inc.

Inventor： Jefferson Talledo

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/29 ,  H01L23/31 ,  H01L21/56

CPC classification number: H01L23/49541 ,  H01L21/4828 ,  H01L21/568 ,  H01L23/293 ,  H01L23/296 ,  H01L23/3121 ,  H01L23/49503 ,  H01L23/49531 ,  H01L23/49548 ,  H01L24/17 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L2224/05599 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2224/83005 ,  H01L2224/85005 ,  H01L2224/85801 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/85399

Abstract: Embodiments of the present disclosure are directed to leadframes having the cantilevered extension that includes an integral support on the end of the lead nearest the die pad. A support integral to the leadframe allows the support to be built to the proper height to support the cantilevered lead in each package and reduces or eliminates the upward, downward, and side to side deflections caused or allowed by supports built-in to the tooling of the manufacturing equipment. Also, by building the support into the leadframe, the leadframes may be pretaped prior to the die attach and wire bonding steps of the manufacturing process.

Abstract translation: 本公开的实施例涉及具有悬臂延伸部的引线框架，其包括在最靠近管芯焊盘的引线的端部上的整体支撑。 与引线框一体化的支撑件允许将支撑件构建到适当的高度以支撑每个封装中的悬臂引线，并且减少或消除由内置在工具中的支撑件所引起或允许的向上，向下和侧向与偏移 制造设备。 此外，通过将引脚框架构建为支撑，引线框架可以在制造工艺的管芯附着和引线接合步骤之前进行预制。

公开(公告)号：US09490146B2

公开(公告)日：2016-11-08

申请号：US14293364

申请日：2014-06-02

Applicant: STMICROELECTRONICS, INC.

Inventor： Jefferson Talledo

IPC: H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L21/4825 ,  H01L23/3107 ,  H01L23/49517 ,  H01L23/4952 ,  H01L23/49537 ,  H01L23/49541 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48245 ,  H01L2224/73265 ,  H01L2224/83424 ,  H01L2224/83447 ,  H01L2224/8385 ,  H01L2224/85424 ,  H01L2224/85447 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: A semiconductor device may include an IC, and lead frame contact areas adjacent the IC. Each lead frame contact area may have a lead opening. The semiconductor device may include bond wires, each bond wire coupling a respective lead frame contact area with the IC. The semiconductor device may include encapsulation material surrounding the IC, the lead frame contact areas, and the bond wires, and leads. Each lead may extend through a respective lead opening and outwardly from the encapsulation material.

Abstract translation: 半导体器件可以包括IC，以及与IC相邻的引线框架接触区域。 每个引线框接触区域可以具有引线开口。 半导体器件可以包括接合线，每个接合线将相应的引线框架接触区域与IC耦合。 半导体器件可以包括围绕IC的封装材料，引线框架接触区域和接合线以及引线。 每个引线可以延伸通过相应的引线开口并且从封装材料向外延伸。

公开(公告)号：US20160190072A1

公开(公告)日：2016-06-30

申请号：US14721831

申请日：2015-05-26

Applicant: STMicroelectronics, Inc.

Inventor： Jefferson Talledo ,  Godfrey Dimayuga

IPC: H01L23/00 ,  H01L25/00 ,  H01L21/56 ,  H01L25/065

CPC classification number: H01L23/562 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/17 ,  H01L24/81 ,  H01L25/105 ,  H01L2224/16055 ,  H01L2224/16057 ,  H01L2224/16227 ,  H01L2224/81191 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/35 ,  H01L2924/3511

Abstract: One or more embodiments are directed to semiconductor packages, including stacked packages, with one or more cantilever pads. In one embodiment a recess is located in a substrate of the package facing the cantilever pad. The cantilever pad includes a conductive pad on which a conductive ball is formed. The cantilever pad is configured to absorb stresses acting on the package.

Abstract translation: 一个或多个实施例涉及具有一个或多个悬臂垫的半导体封装，包括堆叠封装。 在一个实施例中，凹部位于面向悬臂垫的封装的衬底中。 悬臂焊盘包括形成有导电球的导电焊盘。 悬臂垫被配置成吸收作用在包装上的应力。

公开(公告)号：US20160146692A1

公开(公告)日：2016-05-26

申请号：US14861648

申请日：2015-09-22

Applicant: STMICROELECTRONICS S.R.L. ,  STMICROELECTRONICS, INC.

Inventor： Fulvio Vittorio Fontana ,  Jefferson Talledo

IPC: G01L19/14

CPC classification number: G01L19/148 ,  B81B7/0045 ,  B81C1/00325 ,  H01L21/50 ,  H01L23/057 ,  H01L23/49575 ,  H01L23/49861 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/00014

Abstract: A surface mounting device has one body of semiconductor material such as an ASIC, and a package surrounding the body. The package has a base region carrying the body, a cap and contact terminals. The base region has a Young's modulus lower than 5 MPa. For forming the device, the body is attached to a supporting frame including contact terminals and a die pad, separated by cavities; bonding wires are soldered to the body and to the contact terminals; an elastic material is molded so as to surround at least in part lateral sides of the body, fill the cavities of the supporting frame and cover the ends of the bonding wires on the contact terminals; and a cap is fixed to the base region. The die pad is then etched away.

Abstract translation: 表面安装装置具有一个诸如ASIC的半导体材料，以及围绕该主体的封装。 该包装具有承载本体的基部区域，盖子和接触端子。 基部区域的杨氏模量低于5MPa。 为了形成装置，主体附接到支撑框架，该支撑框架包括由空腔分开的接触端子和模片垫; 接合线焊接到主体和接触端子; 将弹性材料模制成至少围绕主体的侧面，填充支撑框架的空腔并覆盖接触端子上的接合线的端部; 并且帽固定到基部区域。 然后蚀刻掉芯片焊盘。

公开(公告)号：US11848256B2

公开(公告)日：2023-12-19

申请号：US17510079

申请日：2021-10-25

Applicant: STMICROELECTRONICS, INC.

Inventor： Jefferson Talledo

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L23/49568 ,  H01L21/4828 ,  H01L21/4871 ,  H01L21/561 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/49513 ,  H01L23/49531 ,  H01L23/49541 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/92247

Abstract: Embodiments of the present disclosure are directed to leadframe semiconductor packages having die pads with cooling fins. In at least one embodiment, the leadframe semiconductor package includes leads and a semiconductor die (or chip) coupled to a die pad with cooling fins. The cooling fins are defined by recesses formed in the die pad. The recesses extend into the die pad at a bottom surface of the semiconductor package, such that the bottom surfaces of the cooling fins of the die pad are flush or coplanar with a surface of the package body, such as an encapsulation material. Furthermore, bottom surfaces of the cooling fins of the die pad are flush or coplanar with exposed bottom surfaces of the leads.

公开(公告)号：US11664239B2

公开(公告)日：2023-05-30

申请号：US17317818

申请日：2021-05-11

Applicant: STMicroelectronics, Inc.

Inventor： Rennier Rodriguez ,  Maiden Grace Maming ,  Jefferson Talledo

IPC: H01L21/48 ,  H01L23/495 ,  H01L23/00

CPC classification number: H01L21/4825 ,  H01L23/49503 ,  H01L23/49513 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/562 ,  H01L24/29

Abstract: The present disclosure is directed to a lead frame including a die pad with cavities, and methods for attaching a semiconductor die to the lead frame. The cavities allow for additional adhesive to be formed on the die pad at the corners of the semiconductor die, and prevent the additional adhesive from overflowing on to active areas of the semiconductor die.

公开(公告)号：US11552007B2

公开(公告)日：2023-01-10

申请号：US17185742

申请日：2021-02-25

Applicant: STMicroelectronics, Inc.

Inventor： Rennier Rodriguez ,  Aiza Marie Agudon ,  Jefferson Talledo ,  Moonlord Manalo ,  Ela Mia Cadag ,  Rammil Seguido

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/48 ,  H01L21/56

Abstract: The present disclosure is directed to a leadframe having a recess in a body of the leadframe to collect glue overflowing from the manufacturing process of coupling a semiconductor die to the leadframe. The recess extends beneath an edge of the semiconductor die so that any tendency of the glue to adhere to the semiconductor die is counteracted by a tendency of the glue to adhere to a wall of the recess and at least partially fill the volume of the recess. In addition, the recess for collecting adhesive may also form a mold lock on an edge of the leadframe, the mold lock providing a more durable connection between the leadframe and an encapsulant during physical and temperature stresses.

公开(公告)号：US20220102166A1

公开(公告)日：2022-03-31

申请号：US17546960

申请日：2021-12-09

Applicant: STMicroelectronics, Inc.

Inventor： Jefferson Talledo ,  Frederick Ray Gomez

IPC: H01L21/48 ,  H05K1/11 ,  H01L23/00 ,  H05K1/18 ,  H01L23/495 ,  H01L21/54 ,  H01L21/78

Abstract: Embodiments of the present disclosure are directed to a leadframe package with recesses formed in outer surface of the leads. The recesses are filled with a filler material, such as solder. The filler material in the recesses provides a wetable surface for filler material, such as solder, to adhere to during mounting of the package to another device, such as a printed circuit board (PCB). This enables strong solder joints between the leads of the package and the PCB. It also enables improved visual inspection of the solder joints after the package has been mounted.

公开(公告)号：US11227776B2

公开(公告)日：2022-01-18

申请号：US15392909

申请日：2016-12-28

Applicant: STMicroelectronics, Inc.

Inventor： Jefferson Talledo ,  Frederick Ray Gomez

IPC: H01L21/44 ,  H01L21/48 ,  H01L23/495 ,  H05K1/11 ,  H01L23/00 ,  H05K1/18 ,  H01L21/54 ,  H01L21/78 ,  H01L23/31 ,  H01L21/56

Abstract: Embodiments of the present disclosure are directed to a leadframe package with recesses formed in outer surface of the leads. The recesses are filled with a filler material, such as solder. The filler material in the recesses provides a wetable surface for filler material, such as solder, to adhere to during mounting of the package to another device, such as a printed circuit board (PCB). This enables strong solder joints between the leads of the package and the PCB. It also enables improved visual inspection of the solder joints after the package has been mounted.

公开(公告)号：US11037864B2

公开(公告)日：2021-06-15

申请号：US16264824

申请日：2019-02-01

Applicant: STMicroelectronics, Inc.

Inventor： Rennier Rodriguez ,  Maiden Grace Maming ,  Jefferson Talledo

IPC: H01L23/495 ,  H01L21/48 ,  H01L23/00

Abstract: The present disclosure is directed to a lead frame including a die pad with cavities, and methods for attaching a semiconductor die to the lead frame. The cavities allow for additional adhesive to be formed on the die pad at the corners of the semiconductor die, and prevent the additional adhesive from overflowing on to active areas of the semiconductor die.