公开(公告)号：US09735080B2

公开(公告)日：2017-08-15

申请号：US14876404

申请日：2015-10-06

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Shih-Chao Chiu ,  Chun-Hsien Lin ,  Yu-Cheng Pai ,  Wei-Chung Hsiao ,  Ming-Chen Sun ,  Tzu-Chieh Shen ,  Chia-Cheng Chen

IPC: H01L23/498 ,  H01L23/31 ,  H01L21/56 ,  H01L21/48

CPC classification number: H01L23/49861 ,  H01L21/4846 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49827 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/181 ,  H01L2924/00012

Abstract: A single-layer wiring package substrate and a method of fabricating the same are provided, the method including: forming on a carrier a wiring layer having a first surface and a second surface opposing the first surface and being in contact with the carrier; forming on the carrier and on the wiring layer a dielectric body that has a first side having a first opening, from which a portion of the wiring layer is exposed, and a second side opposing the first side and disposed at the same side as the second surface of the wiring layer; and removing the carrier, with the second side of the dielectric body and the second surface of the wiring layer exposed. Therefore, a coreless package substrate is fabricated, and the overall thickness and cost of the substrate are reduced.

公开(公告)号：US20170229319A1

公开(公告)日：2017-08-10

申请号：US15440390

申请日：2017-02-23

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Yu-Cheng Pai

IPC: H01L21/48 ,  H01L23/00 ,  H01L21/683 ,  H01L23/31 ,  H01L23/498 ,  H01L21/56

CPC classification number: H01L21/4853 ,  H01L21/4846 ,  H01L21/486 ,  H01L21/56 ,  H01L21/6835 ,  H01L23/3128 ,  H01L23/3178 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49894 ,  H01L24/11 ,  H01L24/17 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/1403 ,  H01L2224/16237 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2924/15311 ,  H01L2924/014 ,  H01L2924/00014

Abstract: A method for fabricating a package structure is provided, which includes the steps of: forming a first insulating layer on a carrier; forming a dielectric body on the first insulating layer, wherein the dielectric body has a first surface formed on the first insulating layer and a second surface opposite to the first surface, and a circuit layer and a plurality of conductive posts formed on the circuit layer are embedded in the dielectric body; forming a second insulating layer on the second surface of the dielectric body, wherein the glass transition temperature of the first insulating layer and/or the second insulating layer is greater than 250° C.; and removing the carrier. Since the glass transition temperature of the first or second insulating layer is greater than that of the dielectric body, the package structure has a preferred strength to avoid warping, thereby dispensing with a support member.

公开(公告)号：US09607860B2

公开(公告)日：2017-03-28

申请号：US14981043

申请日：2015-12-28

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Yu-Cheng Pai

IPC: H01L21/48 ,  H01L23/495 ,  H01L23/31 ,  H01L21/56

CPC classification number: H01L21/4832 ,  H01L21/4825 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49548 ,  H01L23/49568 ,  H01L23/49582 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/85464 ,  H01L2224/8549 ,  H01L2924/00014 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method for fabricating an electronic package structure is provided, which includes the steps of: forming a circuit layer on a conductor; disposing an electronic element on the circuit layer; forming an insulating layer on the conductor to encapsulate the electronic element and the circuit layer; and removing portions of the conductor so as to cause the remaining portions of the conductor to constitute a plurality of conductive bumps. As such, when the electronic package structure is disposed on a circuit board through an SMT (Surface Mount Technology) process, the conductive bumps are easily aligned with contacts of the circuit board, thereby effectively improving the yield of the SMT process.

公开(公告)号：US20160155716A1

公开(公告)日：2016-06-02

申请号：US14837245

申请日：2015-08-27

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Ming-Chen Sun ,  Chun-Hsien Lin ,  Tzu-Chieh Shen ,  Shih-Chao Chiu ,  Yu-Cheng Pai

IPC: H01L23/00 ,  H01L21/56 ,  H05K3/00 ,  H05K3/10 ,  H05K3/40 ,  H01L23/31 ,  H05K1/11

CPC classification number: H01L21/4853 ,  H01L21/486 ,  H01L21/563 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/16238 ,  H01L2224/81191 ,  H01L2224/81815 ,  H01L2224/8182 ,  H01L2924/15313 ,  H05K1/111 ,  H05K3/20 ,  H05K3/205 ,  H05K3/428 ,  H05K2201/0376 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2201/10674 ,  H01L2924/00014 ,  H01L2924/014

Abstract: A package substrate and a semiconductor package are provided. The package substrate includes an insulating layer having opposing first and second surfaces; a first wiring layer formed in the insulating layer, exposed from the first surface of the insulating layer, and having a plurality of first conductive pads; a second wiring layer formed in the insulating layer, exposed from the second surface, and having a plurality of second conductive pads; a third wiring layer formed on the first surface and electrically connected with the first wiring layer; a plurality of first metal bumps formed on the first conductive pads corresponding; and at least one conductive via vertically embedded in the insulating layer and electrically connected to the second and third wiring layers. Therefore, the surfaces of first conductive pads are reduced, and the non-wetting between the first conductive pads and the solder materials formed on conductive bumps is avoided.

Abstract translation: 提供封装基板和半导体封装。 封装衬底包括具有相对的第一和第二表面的绝缘层; 形成在绝缘层中的第一布线层，从绝缘层的第一表面露出并具有多个第一导电焊盘; 形成在所述绝缘层中的第二布线层，从所述第二表面露出并具有多个第二导电焊盘; 第三布线层，形成在第一表面上并与第一布线层电连接; 形成在所述第一导电焊盘上的多个第一金属凸块对应; 以及垂直嵌入绝缘层中并与第二和第三布线层电连接的至少一个导电通孔。 因此，第一导电焊盘的表面被减小，并且避免了第一导电焊盘和形成在导电凸块上的焊料材料之间的不润湿。

公开(公告)号：US20160093546A1

公开(公告)日：2016-03-31

申请号：US14833102

申请日：2015-08-23

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Yu-Cheng Pai ,  Shih-Chao Chiu ,  Chun-Hsien Lin ,  Chih-Wen Fan ,  Cheng-Chia Chen

IPC: H01L23/13 ,  H01L21/56 ,  H01L23/00 ,  H01L21/48

CPC classification number: H01L23/13 ,  H01L21/4857 ,  H01L23/3128 ,  H01L23/498 ,  H01L23/49822 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/92 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/1579 ,  H01L2924/37001 ,  H05K3/4682 ,  H05K2203/0152 ,  H05K2203/016 ,  H01L2924/014 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method of fabricating a package structure is provided. The method includes providing a carrier having two opposing surfaces, forming dielectric bodies on the two surfaces of the carrier, respectively, each of the dielectric bodies having a wiring layer embedded therein and a conductive layer formed on the wiring layer, and removing the carrier. Therefore, the wiring layers, the conductive layers and the dielectric bodies are formed on the two surfaces of the carrier, respectively, and the production yield is thus increased. The present invention further provides the package structure thus fabricated.

Abstract translation: 提供一种制造封装结构的方法。 该方法包括提供具有两个相对表面的载体，分别在载体的两个表面上形成介电体，每个绝缘体具有嵌入其中的布线层和形成在布线层上的导电层，并且去除载体。 因此，分别在载体的两个表面上形成布线层，导电层和介电体，从而提高了生产量。 本发明还提供如此制造的封装结构。

公开(公告)号：US20160086879A1

公开(公告)日：2016-03-24

申请号：US14805524

申请日：2015-07-22

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Ming-Chen Sun ,  Chun-Hsien Lin ,  Tzu-Chieh Shen ,  Shih-Chao Chiu ,  Yu-Cheng Pai

IPC: H01L23/498 ,  H01L21/48

CPC classification number: H01L23/49827 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/15 ,  H01L23/49822 ,  H01L2924/0002 ,  H05K1/0298 ,  H05K3/0038 ,  H01L2924/00

Abstract: A package substrate includes a substrate body having a first surface and a second surface opposite to the first surface; a first circuit layer formed on the first surface and having first conductive pads; a first dielectric layer formed on the first surface and the first circuit; a second circuit layer formed on the first dielectric layer and having second conductive pads; a third circuit layer formed on the second surface and having third conductive pads; a second dielectric layer formed on the second surface and the third circuit layer; a fourth circuit layer formed on the second dielectric layer and having fourth conductive pads; through holes penetrating through the first and second surfaces, and the first and second dielectric layers; and conductive vias penetrating through the through holes and electrically connected to the first, second, third and fourth conductive pads.

Abstract translation: 封装衬底包括具有第一表面和与第一表面相对的第二表面的衬底本体; 形成在第一表面上并具有第一导电焊盘的第一电路层; 形成在第一表面和第一电路上的第一电介质层; 形成在所述第一电介质层上并具有第二导电焊盘的第二电路层; 形成在所述第二表面上并具有第三导电焊盘的第三电路层; 形成在所述第二表面和所述第三电路层上的第二电介质层; 形成在所述第二电介质层上并具有第四导电焊盘的第四电路层; 穿透第一和第二表面的穿透孔以及第一和第二介电层; 以及穿过通孔并电连接到第一，第二，第三和第四导电焊盘的导电通孔。