公开(公告)号：US4198331A

公开(公告)日：1980-04-15

申请号：US937368

申请日：1978-08-28

申请人： Stephen L. Buchwalter ,  Robert D. Jerabek ,  Lee-Pei H. Chou ,  Roger M. Christenson

发明人： Stephen L. Buchwalter ,  Robert D. Jerabek ,  Lee-Pei H. Chou ,  Roger M. Christenson

IPC分类号： C08G59/40 ,  C08G59/50 ,  C08L63/00 ,  C09D5/44 ,  C09D133/14 ,  C09D133/26 ,  C09D201/02 ,  C08L63/10 ,  C08L77/06 ,  C08L79/00

CPC分类号： C09D133/14 ,  C08G59/4042 ,  C08G59/50 ,  C09D133/26 ,  C09D5/4453 ,  C08L63/00

摘要： Curable resinous compositions containing primary and/or secondary amine groups which are non-volatile under curing conditions and containing alpha, beta-ethylenically unsaturated moieties in conjugation with carbonyl moieties which are reacted with a primary and/or secondary amine which are volatile under curing conditions are disclosed. The compositions are depositable on a substrate to form films.

摘要翻译： 含有伯胺和/或仲胺基团的可固化的树脂组合物，其在固化条件下是非挥发性的，并且在与固化条件下挥发的伯胺和/或仲胺反应的羰基部分中含有α，β-烯属不饱和部分 被披露。 组合物可沉积在基底上以形成膜。

公开(公告)号：US4102863A

公开(公告)日：1978-07-25

申请号：US744533

申请日：1976-11-24

申请人： Stephen L. Buchwalter ,  Joseph F. Bosso ,  Roger M. Christenson

发明人： Stephen L. Buchwalter ,  Joseph F. Bosso ,  Roger M. Christenson

IPC分类号： C08G59/00 ,  C08G59/14 ,  C09D5/44 ,  C25D13/06 ,  C08G65/26

CPC分类号： C09D5/4434 ,  C09D5/4423

摘要： A method of cationic electrodeposition on an electroconductive substrate is disclosed. The method of the invention employs as the electrocoating vehicle an aqueous dispersion of a quaternary ammonium carbonate-containing resin. Electrodeposition of the resin is accomplished without generating harmful acid from the counter ion. The carbonate counter ion is continuously evolved from the electrodeposition bath at the anode as carbon dioxide.The quaternary ammonium carbonate-containing polymers are also useful as feed resins for controlling the pH of aqueous dispersions of acidified cationic resins used in electrodeposition. Upon electrodeposition, these resins generate acid which can build up to undesirable levels in the electrodeposition bath. The quaternary ammonium carbonate-containing polymers are relatively basic and when fed into the bath react with the acid to form the corresponding quaternary ammonium salt of the acid releasing carbon dioxide. This controls the pH of the bath and provides additional cationic resin for electrodeposition.Utilizing the polymeric quaternary ammonium carbonates in this manner minimizes the need for controlling acid build-up in the electrodeposition bath by conventional techniques such as by treating the bath with ultrafiltration or electrodialysis.

摘要翻译： 公开了一种阳离子电沉积在导电基底上的方法。 本发明的方法使用含有季铵碳酸盐树脂的水性分散体作为电泳载体。 实现树脂的电沉积而不从抗衡离子产生有害的酸。 碳酸盐反离子从阳极的电沉积池连续放出，作为二氧化碳。

公开(公告)号：US08404981B2

公开(公告)日：2013-03-26

申请号：US12176615

申请日：2008-07-21

申请人： Stephen L. Buchwalter ,  Russell Alan Budd

发明人： Stephen L. Buchwalter ,  Russell Alan Budd

IPC分类号： H05K1/11

CPC分类号： H05K1/0298 ,  H05K1/0237 ,  H05K1/181 ,  H05K3/027 ,  H05K3/32 ,  H05K3/429 ,  H05K2201/09845 ,  H05K2203/0242 ,  H05K2203/175 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T29/49167

摘要： A process of copper plating a through-hole in a printed circuit board, and the printed circuit board made from such process. The process comprises: providing a printed circuit board with at least two copper interconnect lines separated by an insulator in the vertical direction; providing a through-hole in the printed circuit board in the vertical direction such that the interconnect lines provide a copper land in the through-hole; applying a seed layer to an interior surface of the through-hole; removing an outermost portion of the seed layer from the interior surface of the through-hole with a laser; applying copper on the seed layer.

公开(公告)号：US07815968B2

公开(公告)日：2010-10-19

申请号：US12247894

申请日：2008-10-08

申请人： Gareth Hougham ,  Leena Paivikki Buchwalter ,  Stephen L. Buchwalter ,  Jon Casey ,  Claudius Feger ,  Matteo Flotta ,  Jeffrey D. Gelmore ,  Kathleen C. Hinge ,  Anurag Jain ,  Sung K. Kang ,  John U. Knickerbocker

发明人： Gareth Hougham ,  Leena Paivikki Buchwalter ,  Stephen L. Buchwalter ,  Jon Casey ,  Claudius Feger ,  Matteo Flotta ,  Jeffrey D. Gelmore ,  Kathleen C. Hinge ,  Anurag Jain ,  Sung K. Kang ,  John U. Knickerbocker

IPC分类号： B05D3/12

CPC分类号： H05K3/4053 ,  B05D1/002 ,  H01L21/486 ,  H01L21/76898 ,  H05K2201/09509 ,  H05K2203/1554

摘要： The present disclosure relates generally to semiconductor, integrated circuits, and particularly, but not by way of limitation, to centrifugal methods of filling high-aspect ratio vias and trenches with powders, pastes, suspensions of materials to act as any of a conducting, structural support, or protective member of an electronic component.

摘要翻译： 本公开一般涉及半导体，集成电路，特别是但不限于，用于填充高纵横比通孔和沟槽的离心方法，其具有粉末，糊料，材料悬浮液，用作导电，结构 支撑或电子部件的保护构件。

公开(公告)号：US20080277154A1

公开(公告)日：2008-11-13

申请号：US12176615

申请日：2008-07-21

申请人： Stephen L. Buchwalter ,  Russell A. Budd

发明人： Stephen L. Buchwalter ,  Russell A. Budd

IPC分类号： H01R12/04 ,  H05K3/30

CPC分类号： H05K1/0298 ,  H05K1/0237 ,  H05K1/181 ,  H05K3/027 ,  H05K3/32 ,  H05K3/429 ,  H05K2201/09845 ,  H05K2203/0242 ,  H05K2203/175 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T29/49167

摘要： A process of copper plating a through-hole in a printed circuit board, and the printed circuit board made from such process. The process comprises: providing a printed circuit board with at least two copper interconnect lines separated by an insulator in the vertical direction; providing a through-hole in the printed circuit board in the vertical direction such that the interconnect lines provide a copper land in the through-hole; applying a seed layer to an interior surface of the through-hole; removing an outermost portion of the seed layer from the interior surface of the through-hole with a laser; applying copper on the seed layer.

摘要翻译： 在印刷电路板中镀铜通孔的方法以及由该工艺制成的印刷电路板。 该方法包括：向印刷电路板提供在垂直方向上由绝缘体隔开的至少两根铜互连线; 在垂直方向上在印刷电路板上设置通孔，使得互连线在通孔中提供铜焊盘; 将种子层施加到通孔的内表面; 用激光从所述通孔的内表面去除种子层的最外部分; 在种子层上施加铜。

公开(公告)号：US07404251B2

公开(公告)日：2008-07-29

申请号：US11405405

申请日：2006-04-18

申请人： Stephen L. Buchwalter ,  Russell Alan Budd

发明人： Stephen L. Buchwalter ,  Russell Alan Budd

IPC分类号： H01K3/10

CPC分类号： H05K1/0298 ,  H05K1/0237 ,  H05K1/181 ,  H05K3/027 ,  H05K3/32 ,  H05K3/429 ,  H05K2201/09845 ,  H05K2203/0242 ,  H05K2203/175 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T29/49167

摘要： A process of copper plating a through-hole in a printed circuit board, and the printed circuit board made from such process. The process comprises: providing a printed circuit board with at least two copper interconnect lines separated by an insulator in the vertical direction; providing a through-hole in the printed circuit board in the vertical direction such that the interconnect lines provide a copper land in the through-hole; applying a seed layer to an interior surface of the through-hole; removing an outermost portion of the seed layer from the interior surface of the through-hole with a laser; applying copper on the seed layer.

摘要翻译： 在印刷电路板中镀铜通孔的方法以及由该工艺制成的印刷电路板。 该方法包括：向印刷电路板提供在垂直方向上由绝缘体隔开的至少两根铜互连线; 在垂直方向上在印刷电路板上设置通孔，使得互连线在通孔中提供铜焊盘; 将种子层施加到通孔的内表面; 用激光从所述通孔的内表面去除种子层的最外部分; 在种子层上施加铜。

公开(公告)号：US5512613A

公开(公告)日：1996-04-30

申请号：US210879

申请日：1994-03-18

申请人： Ali Afzali-Ardakani ,  Stephen L. Buchwalter ,  Jeffrey D. Gelorme ,  Laura L. Kosbar ,  Bert H. Newman ,  Frank L. Pompeo

发明人： Ali Afzali-Ardakani ,  Stephen L. Buchwalter ,  Jeffrey D. Gelorme ,  Laura L. Kosbar ,  Bert H. Newman ,  Frank L. Pompeo

IPC分类号： C08G59/02 ,  C07D303/24 ,  C08G59/00 ,  C08G59/18 ,  C08G59/22 ,  C08G59/24 ,  C08G59/42 ,  C08G59/50 ,  C08L63/00 ,  H01L23/29 ,  H01L23/31 ,  C08G63/00

CPC分类号： C08G59/24 ,  C07D303/24 ,  C08G59/18 ,  C08G59/22 ,  H01L23/293 ,  H01L2924/0002 ,  Y10S428/901 ,  Y10T428/12528 ,  Y10T428/12569 ,  Y10T428/2985 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31522 ,  Y10T428/31525

摘要： A cleavable epoxy resin composition suitable for encapsulating electronic chips comprising the cured reaction product of a diepoxide containing a cyclic anhydride curing agent and an amine promoter.

摘要翻译： 一种适用于包封电子芯片的可切割环氧树脂组合物，其包含含有环酐固化剂和胺促进剂的二环氧化物的固化反应产物。

公开(公告)号：US5357005A

公开(公告)日：1994-10-18

申请号：US805213

申请日：1991-12-11

申请人： Stephen L. Buchwalter ,  Charles R. Davis ,  Ronald D. Goldblatt ,  Richard R. Thomas

发明人： Stephen L. Buchwalter ,  Charles R. Davis ,  Ronald D. Goldblatt ,  Richard R. Thomas

IPC分类号： C08G18/40 ,  B05D3/14 ,  B29C59/14 ,  C08F8/00 ,  C08F255/00 ,  C08F283/00 ,  C08G59/18 ,  C08G64/40 ,  C08G65/00 ,  C08G83/00 ,  C08G85/00 ,  C08J7/18 ,  H01L23/02 ,  C08F20/00 ,  B05D3/04 ,  C08F283/04 ,  C08L77/06

CPC分类号： C08J7/123 ,  B05D3/144 ,  B29C59/14 ,  Y10T428/31721

摘要： Method for treating surface of dielectric polymer with water vapor plasma to form reactive sites and grafting a reactive polymer thereto to tailor the properties of the dielectric polymer surface.

摘要翻译： 用水蒸汽等离子体处理介电聚合物表面以形成反应位点并将反应性聚合物接枝到其上的方法来调节介电聚合物表面的性质。

公开(公告)号：US5340451A

公开(公告)日：1994-08-23

申请号：US61815

申请日：1993-05-13

申请人： Leena P. Buchwalter ,  Stephen L. Buchwalter ,  Charles R. Davis ,  Ronald D. Goldblatt ,  John E. Heidenreich, III ,  Sharon L. Nunes ,  Jae M. Park ,  Richard R. Thomas ,  Domenico Tortorella ,  Luis M. Ferreiro, deceased

发明人： Leena P. Buchwalter ,  Stephen L. Buchwalter ,  Charles R. Davis ,  Ronald D. Goldblatt ,  John E. Heidenreich, III ,  Sharon L. Nunes ,  Jae M. Park ,  Richard R. Thomas ,  Domenico Tortorella ,  Luis M. Ferreiro, deceased

IPC分类号： C23C18/22 ,  H05K1/03 ,  H05K3/18 ,  H05K3/38 ,  B01D3/00

CPC分类号： C23C18/22 ,  H05K1/034 ,  H05K1/0346 ,  H05K3/181 ,  H05K3/381

摘要： A process is disclosed for producing a metal-organic polymer combination by contacting the polymer with a plasma followed by an aqueous solution of a metal salt. In one embodiment a water or nitrous oxide plasma is used to treat a polyimide or a fluorinated polymer. The polymer is combined with a metal cation, the metal being a catalyst for a conventional electroless coating after which it is contacted with an electroless metal plating bath for the formation of electrical circuits and especially for plating high aspect ratio vias in microcircuits. Unlike the conventional electroless process, the cationic catalytic metal is not reduced to a zero valent metal catalyst prior to the application of the electroless metal coating solution.The process also improves the wettability of the polymer, especially the fluorinated polymer and is especially useful in improving the wettability of high aspect ratio vias.

摘要翻译： 公开了通过使聚合物与等离子体接触，然后与金属盐水溶液接触来制备金属 - 有机聚合物组合的方法。 在一个实施方案中，使用水或一氧化二氮等离子体来处理聚酰亚胺或含氟聚合物。 聚合物与金属阳离子结合，金属是用于常规化学镀的催化剂，之后与用于形成电路的无电金属电镀浴接触，特别是用于在微电路中电镀高纵横比通孔。 与常规的无电镀方法不同，在施加无电镀金属溶液之前，阳离子催化金属不会还原为零价金属催化剂。 该方法还提高聚合物，特别是氟化聚合物的润湿性，并且特别可用于改善高纵横比通孔的润湿性。

公开(公告)号：US4832808A

公开(公告)日：1989-05-23

申请号：US000278

申请日：1987-01-02

申请人： Stephen L. Buchwalter

发明人： Stephen L. Buchwalter

IPC分类号： C08G73/10 ,  C09D5/44 ,  H01L23/532

CPC分类号： C08G73/1003 ,  C09D5/4461 ,  H01L23/5329 ,  H01L2924/0002

摘要： Reaction product of a polyimide and a secondary/tertiary polyamine and/or primary/tertiary polyamine, and/or protected primary/tertiary polyamine, and use thereof in electrophoretic deposition.