公开(公告)号：US08404981B2

公开(公告)日：2013-03-26

申请号：US12176615

申请日：2008-07-21

申请人： Stephen L. Buchwalter ,  Russell Alan Budd

发明人： Stephen L. Buchwalter ,  Russell Alan Budd

IPC分类号： H05K1/11

CPC分类号： H05K1/0298 ,  H05K1/0237 ,  H05K1/181 ,  H05K3/027 ,  H05K3/32 ,  H05K3/429 ,  H05K2201/09845 ,  H05K2203/0242 ,  H05K2203/175 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T29/49167

摘要： A process of copper plating a through-hole in a printed circuit board, and the printed circuit board made from such process. The process comprises: providing a printed circuit board with at least two copper interconnect lines separated by an insulator in the vertical direction; providing a through-hole in the printed circuit board in the vertical direction such that the interconnect lines provide a copper land in the through-hole; applying a seed layer to an interior surface of the through-hole; removing an outermost portion of the seed layer from the interior surface of the through-hole with a laser; applying copper on the seed layer.

公开(公告)号：US07404251B2

公开(公告)日：2008-07-29

申请号：US11405405

申请日：2006-04-18

申请人： Stephen L. Buchwalter ,  Russell Alan Budd

发明人： Stephen L. Buchwalter ,  Russell Alan Budd

IPC分类号： H01K3/10

CPC分类号： H05K1/0298 ,  H05K1/0237 ,  H05K1/181 ,  H05K3/027 ,  H05K3/32 ,  H05K3/429 ,  H05K2201/09845 ,  H05K2203/0242 ,  H05K2203/175 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T29/49167

摘要： A process of copper plating a through-hole in a printed circuit board, and the printed circuit board made from such process. The process comprises: providing a printed circuit board with at least two copper interconnect lines separated by an insulator in the vertical direction; providing a through-hole in the printed circuit board in the vertical direction such that the interconnect lines provide a copper land in the through-hole; applying a seed layer to an interior surface of the through-hole; removing an outermost portion of the seed layer from the interior surface of the through-hole with a laser; applying copper on the seed layer.

摘要翻译： 在印刷电路板中镀铜通孔的方法以及由该工艺制成的印刷电路板。 该方法包括：向印刷电路板提供在垂直方向上由绝缘体隔开的至少两根铜互连线; 在垂直方向上在印刷电路板上设置通孔，使得互连线在通孔中提供铜焊盘; 将种子层施加到通孔的内表面; 用激光从所述通孔的内表面去除种子层的最外部分; 在种子层上施加铜。

公开(公告)号：US08227264B2

公开(公告)日：2012-07-24

申请号：US13071894

申请日：2011-03-25

申请人： Paul S. Andry ,  Stephen L. Buchwalter ,  George A. Katopis ,  John U. Knickerbocker ,  Stelios G. Tsapepas ,  Bucknell C. Webb

发明人： Paul S. Andry ,  Stephen L. Buchwalter ,  George A. Katopis ,  John U. Knickerbocker ,  Stelios G. Tsapepas ,  Bucknell C. Webb

IPC分类号： H01L21/30

CPC分类号： H01L23/49827 ,  H01L24/16 ,  H01L24/17 ,  H01L25/0657 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16146 ,  H01L2224/16235 ,  H01L2224/17181 ,  H01L2224/73204 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/00 ,  H01L2224/05552

摘要： An electronic device assembly is provided which includes a substrate, an interposer and an integrated circuit chip. The substrate is fabricated of a first material having a first thermal expansivity, and the interposer and integrated circuit chip are fabricated of a second material having a second thermal expansivity. The second thermal expansivity is different from the first thermal expansivity so that there is a coefficient of thermal expansion mismatch between the substrate and the interposer or chip. The interposer is coupled to the substrate via a first plurality of electrical contacts and an underfill adhesive at least partially surrounding the electrical contacts to bond the interposer to the substrate and thereby reduce strain on the first plurality of electrical contacts. The integrated circuit chip is coupled to the interposer via a second plurality of electrical contacts only, without use of an adhesive surrounding the second plurality of electrical contacts.

摘要翻译： 提供一种电子器件组件，其包括衬底，插入器和集成电路芯片。 衬底由具有第一热膨胀性的第一材料制成，并且插入器和集成电路芯片由具有第二热膨胀性的第二材料制成。 第二热膨胀性与第一热膨胀性不同，因此在衬底和插入件或芯片之间存在热膨胀失配系数。 插入器经由第一多个电触点和底部填充粘合剂耦合到基板，所述底部填充粘合剂至少部分地围绕电触点以将插入件结合到基板，从而减少第一多个电触点上的应变。 集成电路芯片仅通过第二多个电触点而耦合到插入器，而不使用围绕第二多个电触点的粘合剂。

公开(公告)号：US20110192887A1

公开(公告)日：2011-08-11

申请号：US13088727

申请日：2011-04-18

申请人： Stephen L. Buchwalter ,  Peter A. Gruber ,  Paul A. Lauro ,  Jae-Woong Nah

发明人： Stephen L. Buchwalter ,  Peter A. Gruber ,  Paul A. Lauro ,  Jae-Woong Nah

IPC分类号： B23K1/20

CPC分类号： B23K3/0638 ,  B23K3/08 ,  B23K2101/42 ,  H01L21/4853 ,  H01L24/11 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K1/111 ,  H05K3/3457 ,  H05K2201/09472 ,  H05K2203/0126 ,  Y10T29/49826 ,  Y10T156/1062 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A portion of compliant material includes four walls defining a slot. The slot has a relatively large cross-section end in fluid communication with a solder reservoir, and also has a relatively small cross-section end opposed to the relatively large cross-section end. The slot has a generally elongate rectangular shape when viewed in plan, with a length perpendicular to a scan direction, a width, parallel to the scan direction, associated with the relatively large cross section end, and a width, parallel to the scan direction, associated with the relatively small cross section end. The slot is configured in the portion of compliant material such that the relatively small cross-section end of the slot normally remains substantially closed, but locally opens sufficiently to dispense solder from the reservoir when under fluid pressure and locally unsupported by a workpiece. Methods of operation and fabrication are also disclosed.

公开(公告)号：US07936060B2

公开(公告)日：2011-05-03

申请号：US12431827

申请日：2009-04-29

申请人： Paul S. Andry ,  Stephen L. Buchwalter ,  George A. Katopis ,  John U. Knickerbocker ,  Stelios G. Tsapepas ,  Bucknell C. Webb

发明人： Paul S. Andry ,  Stephen L. Buchwalter ,  George A. Katopis ,  John U. Knickerbocker ,  Stelios G. Tsapepas ,  Bucknell C. Webb

IPC分类号： H01L23/52

CPC分类号： H01L23/49827 ,  H01L24/16 ,  H01L24/17 ,  H01L25/0657 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16146 ,  H01L2224/16235 ,  H01L2224/17181 ,  H01L2224/73204 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06589 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/00 ,  H01L2224/05552

摘要： An electronic device assembly is provided which includes a substrate, an interposer and an integrated circuit chip. The substrate is fabricated of a first material having a first thermal expansivity, and the interposer and integrated circuit chip are fabricated of a second material having a second thermal expansivity. The second thermal expansivity is different from the first thermal expansivity so that there is a coefficient of thermal expansion mismatch between the substrate and the interposer or chip. The interposer is coupled to the substrate via a first plurality of electrical contacts and an underfill adhesive at least partially surrounding the electrical contacts to bond the interposer to the substrate and thereby reduce strain on the first plurality of electrical contacts. The integrated circuit chip is coupled to the interposer via a second plurality of electrical contacts only, without use of an adhesive surrounding the second plurality of electrical contacts.

摘要翻译： 提供一种电子器件组件，其包括衬底，插入器和集成电路芯片。 衬底由具有第一热膨胀性的第一材料制成，并且插入器和集成电路芯片由具有第二热膨胀性的第二材料制成。 第二热膨胀性与第一热膨胀性不同，因此在衬底和插入件或芯片之间存在热膨胀失配系数。 插入器经由第一多个电触点和底部填充粘合剂耦合到基板，所述底部填充粘合剂至少部分地围绕电触点以将插入件结合到基板，从而减少第一多个电触点上的应变。 集成电路芯片仅通过第二多个电触点而耦合到插入器，而不使用围绕第二多个电触点的粘合剂。

公开(公告)号：US07928585B2

公开(公告)日：2011-04-19

申请号：US11869573

申请日：2007-10-09

申请人： Stephen L. Buchwalter ,  Peter A. Gruber ,  Jae-Woong Nah ,  Da-Yuan Shih

发明人： Stephen L. Buchwalter ,  Peter A. Gruber ,  Jae-Woong Nah ,  Da-Yuan Shih

IPC分类号： H01L23/488

CPC分类号： H01L24/11 ,  H01L24/13 ,  H01L24/742 ,  H01L2224/0401 ,  H01L2224/05571 ,  H01L2224/11003 ,  H01L2224/1111 ,  H01L2224/1131 ,  H01L2224/11849 ,  H01L2224/131 ,  H01L2924/0002 ,  H01L2924/14 ,  Y10T29/49149 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2224/05552

摘要： A process for aligning at least two layers in an abutting relationship with each other comprises forming a plurality of sprocket openings in each of the layers for receiving a sprocket of diminishing diameters as the sprocket extends outwardly from a base, with the center axes of the sprocket openings in each layer being substantially alignable with one another, the diameter of the sprocket openings in an abutting layer for first receiving the sprocket being greater than the diameter of the sprocket openings in an abutted layer. This is followed by forming a plurality of reservoir openings in each of at least two of the layers and positioning the sprocket openings in the layers to correspond with one another and the reservoir openings in the layers to correspond with one another so that substantial alignment of the center axes of the corresponding sprocket openings in the layers effects substantial alignment of the center axes of the corresponding reservoir openings in the layers. Engaging the sprocket openings with the sprocket by inserting the end of the sprocket having the smallest diameter into the sprocket openings having the largest diameter in the layers and continuing through to the sprocket opening having the smallest diameter in the layers effects substantial alignment of the center axes of the corresponding sprocket openings and substantial alignment of the center axes of the corresponding reservoir openings in the layers. The invention also comprises apparatus-for performing this process.

摘要翻译： 用于将至少两个彼此邻接的层对准的方法包括在每个层中形成多个链轮开口，用于当链轮从基座向外延伸时接收链轮直径减小的链轮，链轮的中心轴线 每个层中的开口基本上彼此对准，用于首先接收链轮的邻接层中的链轮开口的直径大于邻接层中链轮开口的直径。 随后在至少两个层中的每一个中形成多个储存器开口，并且将链轮开口定位在层中以彼此对应并且层中的储存器开口彼此对应，使得 层中对应的链轮开口的中心轴线对层中对应的储存器开口的中心轴进行实质上的对准。 通过将具有最小直径的链轮的端部插入到具有最大直径的链轮的链轮开口中并且连续到具有最小直径的链轮开口，使链轮开口与链轮接合，使得中心轴线 的对应的链轮开口和相应的储存器开口的中心轴线在层中的基本对准。 本发明还包括用于执行该过程的装置。

公开(公告)号：US07523852B2

公开(公告)日：2009-04-28

申请号：US11005557

申请日：2004-12-05

申请人： Stephen L. Buchwalter ,  Claudius Feger ,  Peter A. Gruber ,  Sung K. Kang ,  Paul A. Lauro ,  Da-Yuan Shih

发明人： Stephen L. Buchwalter ,  Claudius Feger ,  Peter A. Gruber ,  Sung K. Kang ,  Paul A. Lauro ,  Da-Yuan Shih

IPC分类号： B23K35/12

CPC分类号： H05K3/3436 ,  B23K35/26 ,  H01L24/11 ,  H01L24/12 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13176 ,  H01L2224/13181 ,  H01L2224/13184 ,  H01L2224/1357 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13655 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K3/3426 ,  H05K3/3468 ,  H05K2201/10287 ,  H05K2201/10992 ,  H05K2203/0113 ,  H05K2203/0415 ,  H05K2203/128 ,  Y02P70/613 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： Improved interconnects are produced by injection molded solder which fills mold arrays with molten solder so that columns that have much greater height to width aspect ratios greater than one are formed, rather than conventional flip chip bumps. The columns may have filler particles or reinforcing conductors therein. In the interconnect structures produced, the cost and time of a subsequent underfill step is reduced or avoided. The problem of incompatibility with optical interconnects between chips because underfills require high loading of silica fillers which scatter light, is solved, thus allowing flip chips to incorporate optical interconnects.

摘要翻译： 改进的互连通过注射成型的焊料生产，该焊料用熔融焊料填充模具阵列，使得形成具有大于1的高宽比宽高比的柱而不是传统的倒装芯片凸块。 该列可以在其中具有填料颗粒或增强导体。 在所生产的互连结构中，减少或避免了后续底部填充步骤的成本和时间。 与芯片之间的光学互连不兼容的问题，因为底部填充物需要高散射光的二氧化硅填料的高负载，因此可以使倒装芯片结合光学互连。

公开(公告)号：US07452568B2

公开(公告)日：2008-11-18

申请号：US11049846

申请日：2005-02-04

申请人： Gareth Hougham ,  Leena Paivikki Buchwalter ,  Stephen L. Buchwalter ,  Jon Casey ,  Claudius Feger ,  Matteo Flotta ,  Jeffrey D. Gelorme ,  Kathleen C. Hinge ,  Anurag Jain ,  Sung K. Kang ,  John U. Knickerbocker

发明人： Gareth Hougham ,  Leena Paivikki Buchwalter ,  Stephen L. Buchwalter ,  Jon Casey ,  Claudius Feger ,  Matteo Flotta ,  Jeffrey D. Gelorme ,  Kathleen C. Hinge ,  Anurag Jain ,  Sung K. Kang ,  John U. Knickerbocker

IPC分类号： B05D3/12 ,  B05D1/42

CPC分类号： H05K3/4053 ,  B05D1/002 ,  H01L21/486 ,  H01L21/76898 ,  H05K2201/09509 ,  H05K2203/1554

摘要： The present disclosure relates generally to semiconductor, integrated circuits, and particularly, but not by way of limitation, to centrifugal methods of filling high-aspect ratio vias and trenches with powders, pastes, suspensions of materials to act as any of a conducting, structural support, or protective member of an electronic component.

摘要翻译： 本公开总体上涉及半导体，集成电路，特别是但不限于，用于填充高纵横比通孔和沟槽的离心方法，其具有粉末，浆料，材料的悬浮液，以充当导电的结构 支撑或电子部件的保护构件。

公开(公告)号：US06890599B2

公开(公告)日：2005-05-10

申请号：US10461215

申请日：2003-06-13

申请人： Stephen L. Buchwalter ,  Gareth Geoffrey Hougham ,  Kang-Wook Lee ,  John J. Ritsko ,  Mary Elizabeth Rothwell ,  Peter M. Fryer

发明人： Stephen L. Buchwalter ,  Gareth Geoffrey Hougham ,  Kang-Wook Lee ,  John J. Ritsko ,  Mary Elizabeth Rothwell ,  Peter M. Fryer

IPC分类号： G02F1/1343 ,  B05D1/32 ,  B05D3/00 ,  B05D5/00

CPC分类号： B82Y30/00 ,  G02F1/13439 ,  Y10T428/31663

摘要： New etch barriers of indium-tin-oxide in the manufacturing process of thin film transistor-liquid crystal display are self-assembled monolayers, such as n-alkylsilanes. A typical process of applying a self-assembled monolayer is to ink a hydrolyzed n-octadecyltrimethoxysilane solution on to a stamp and then to transfer the solution onto ITO. The surface of the stamp may be polar enough to be wet with polar self-assembled monolayer solutions of an akylsilane. A non-polar stamp surface may be treated with oxygen plasma to obtain a wettable polar surface.

摘要翻译： 在薄膜晶体管 - 液晶显示器的制造过程中，铟锡氧化物的新的蚀刻屏障是自组装单层，例如正烷基硅烷。 施加自组装单层的典型方法是将水解的正十八烷基三甲氧基硅烷溶液油墨印刷到印模上，然后将溶液转移到ITO上。 印模的表面可以足够极性以使其与烷基硅烷的极性自组装单层溶液一起润湿。 可以用氧等离子体处理非极性印模表面以获得可润湿的极性表面。

公开(公告)号：US06879098B2

公开(公告)日：2005-04-12

申请号：US10756037

申请日：2004-01-13

申请人： Stephen L. Buchwalter ,  Evan G. Colgan ,  Sung Kwon Kang ,  Robert L. Wisnieff

发明人： Stephen L. Buchwalter ,  Evan G. Colgan ,  Sung Kwon Kang ,  Robert L. Wisnieff

IPC分类号： G02F1/1362 ,  H01L27/32 ,  H01J1/62

CPC分类号： G02F1/1362 ,  H01L27/32 ,  H01L27/3255 ,  Y10T29/4913 ,  Y10T29/4981 ,  Y10T29/49895

摘要： A method for fabricating a display device patterns a conductive layer on a display substrate and forms pixel electrodes on the display substrate. A plate is employed for carrying separately fabricated active devices to the display substrate. The separately fabricated devices are connected to the conductive layers and the pixel electrode.

摘要翻译： 一种显示装置的制造方法，在显示基板上形成导电层，并在显示基板上形成像素电极。 采用板将单独制造的有源器件携带到显示器基板。 单独制造的器件连接到导电层和像素电极。