摘要:
Circuits and methods are provided for precharging pairs of many digit lines. The final precharge voltage of the digit lines is different from the average of the digit line voltages prior to precharging. The final precharge voltage can be set by appropriately selecting the size of a capacitor in the precharge circuit.
摘要:
A first level metal interconnection line in a layer below a third level metal interconnection line serving as a main word line MWL is used as a shunting interconnection line and electrically connected to a first level polysilicon interconnection line constituting a sub word line SWL at prescribed intervals. By applying a hierarchical word line structure and a word line shunting structure both, a word line is driven into a selected state at high speed without increasing an array occupancy area and manufacturing steps.
摘要:
In each of output buffer circuits arranged corresponding to respective output pads, a first output buffer having small current driving capability for a normal operation mode and a second output buffer having large current driving capability for a test operation mode are arranged in parallel with each other. One of the first and second output buffers is enabled and the other is set to an output high impedance state alternatively in accordance with a mode designating signal. Thus, an output buffer circuit capable of driving an output pad with optimal driving capabilities in a normal operation mode and in a test operation mode in a semiconductor device for use in a system in package is implemented.
摘要:
Obtainable are a semiconductor chip making it possible to perform a thoroughgoing test easily without imposing a burden on the circuit of its body; a semiconductor device on which the semiconductor chip is mounted; and a process for producing the semiconductor device. The semiconductor chip includes a first test terminal connected to a terminal line that extends from a body of the chip, the test terminal being a terminal for being jointed to a test device, and a circuit-constituting terminal branched from the terminal line and connected to the terminal line that is connected to the first test terminal, the circuit-constituting terminal being a terminal for being connected to any other circuit element.
摘要:
Level converter converts a word line group specifying signal, which is sent from a row decoder and has amplitude of a power supply potential Vcc and a ground potential GND, into mutually complementary logic signals WD and ZWD of a high voltage Vpp and a negative potential Vbb. An RX decoder decodes an address signal to output a signal of an amplitude of (Vpp−Vbb) specifying a word line in a word line group. A word driver provided corresponding to each word line transmits a word line specifying signal or a negative potential to the corresponding word line in accordance with signals WD and ZWD sent from a level converting circuit. The nonselected word line receives negative potential Vbb from a word driver. The selected word line receives high voltage Vpp from the word driver. It is possible to suppress a channel leak current at a memory transistor in the nonselected memory cell, which may be caused by the potential change of the word line and/or bit line, and a charge holding characteristic of the memory cell can be improved.
摘要:
In a signal potential conversion circuit of a DRAM, a first P channel MOS transistor for charging a first node is connected in parallel with a second P channel MOS transistor and the second P channel MOS transistor is turned on in a pulse manner in response to a rising edge of an input signal. Further, the first P channel MOS transistor has its current drive ability defined to be approximately one-tenth of that of an N channel MOS transistor for discharging the first node. Accordingly, each of the first node and a second node can be charged and discharged quickly to enable conversion of a signal potential to be accomplished speedily.
摘要:
An address signal is transmitted to each bank by a common address bus. A column pre-decoder, and a row pre-decoder detect a selection of a corresponding bank in response to a signal transmitted by the address bus, and receive an address signal in response to a command signal from a command data bus. Circuits closer to the side of the address data bus and command data bus than to the circuit which latches the received data have a hierarchical power supply configuration.
摘要:
The objective of the invention is to read and write data in synchronization with a high-speed clock signal. The pulse width of the timing control signal (FY signal), which determines the pulse width of the column select signal (YS signal), is enlarged in a data read operation and reduced in a data write operation. In this way, the activation pulse width of the column select signal is enlarged in a data read operation and reduced in a data write operation. Consequently, in a data read operation, the time for connecting a bit line pair to an input/output line pair becomes longer. The potential difference of the bit line pair can be completely transferred to the input/output line pair. Therefore, data can be read correctly in synchronization with a high-speed clock signal.
摘要:
A memory cell array in a semiconductor memory device according to the present invention is divided into a plurality of banks along the row-direction. Each bank is further divided into a plurality of sub blocks along the column-direction. Sub blocks belonging to the same group, in other words, sub blocks arranged adjacent to each other along the row-direction share the same row address. An accessing operation to an addressed memory cell is performed on the basis of a sub block. The activation of a sub block is performed by a control circuit provided for each of the sub blocks based on a signal activated for each of the banks and the same group based on an address signal.
摘要:
A redundant memory cell column region provided corresponding to respective regular memory cell column regions can have data read and written through a sub I/O line pair and a main I/O line pair independent to those of the regular memory cell column region. Also, one redundant memory cell column region can be connected to a corresponding global I/O line pair G-I/O of any of the regular memory cell column regions via a multiplexer to be replaceable of any of two regular memory cell column regions.