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59 条记录 (耗时 0.029 秒)

    Encapsulant dam standoff for shell-enclosed die assemblies
    48.
    发明授权
    Encapsulant dam standoff for shell-enclosed die assemblies 失效

    公开(公告)号：US5895222A

    公开(公告)日：1999-04-20

    申请号：US891279

    申请日：1997-07-10

    申请人： Walter L. Moden ,  John O. Jacobson

    发明人： Walter L. Moden ,  John O. Jacobson

    IPC分类号： H01L21/56 ,  H01L23/24 ,  H01L21/52 ,  H01L21/58 ,  H01L21/60

    CPC分类号： H01L23/24 ,  H01L21/56 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01L2924/07802 ,  H01L2924/181 ,  Y10S438/94 ,  Y10S438/977

    摘要： An electronic device includes at least one chip connected to a circuit board. The chip includes a die and an encapsulant which is applied in a liquid phase and dries to a solid phase. A shell may be positioned over the chip and in some embodiments of the invention extends over the entire device. A dam is connected to the circuit board adjacent the die in at least one direction so as to restrain flow of the encapsulant toward the dam when the encapsulant is in the liquid phase. The dam may include an upper end at an elevation higher than the uppermost portion of the chip (which would usually be encapsulated), the dam acting as a standoff between the shell and the chip. The upper end of the dam may be constantly in contact with the shell or, alternatively, the upper end of the dam may be ordinarily not in contact with the shell, but comes into contact with the shell if the shell is compressed or flexed toward the chip. A single dam may surround the die (and chip structure after the encapsulant dries). Alternatively, a single dam may be adjacent to a die in less than all directions. Two or more chips may be adjacent to different sections or sides of a single dam.

    Encapsulant dam standoff for shell-enclosed die assemblies
    49.
    发明授权
    Encapsulant dam standoff for shell-enclosed die assemblies 失效
    外壳密封模具组件的封装坝隔离

    公开(公告)号：US5894167A

    公开(公告)日：1999-04-13

    申请号：US646778

    申请日：1996-05-08

    申请人： Walter L. Moden ,  John O. Jacobson

    发明人： Walter L. Moden ,  John O. Jacobson

    IPC分类号： H01L21/56 ,  H01L23/24 ,  H01L23/02

    CPC分类号： H01L23/24 ,  H01L21/56 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01L2924/07802 ,  H01L2924/181 ,  Y10S438/94 ,  Y10S438/977

    摘要： An electronic device includes at least one chip connected to a circuit board. The chip includes a die and an encapsulant which is applied in a liquid phase and dries to a solid phase. A shell may be positioned over the chip and in some embodiments of the invention extends over the entire device. A dam is connected to the circuit board adjacent the die in at least one direction so as to restrain flow of the encapsulant toward the dam when the encapsulant is in the liquid phase. The dam may include an upper end at an elevation higher than the uppermost portion of the chip (which would usually be encapsulated), the dam acting as a standoff between the shell and the chip. The upper end of the dam may be constantly in contact with the shell or, alternatively, the upper end of the dam may be ordinarily not in contact with the shell, but comes into contact with the shell if the shell is compressed or flexed toward the chip. A single dam may surround the die (and chip structure after the encapsulant dries). Alternatively, a single dam may be adjacent to a die in less than all directions. Two or more chips may be adjacent to different sections or sides of a single dam.

    摘要翻译： 电子设备包括连接到电路板的至少一个芯片。 芯片包括芯片和密封剂，其被施加在液相中并干燥成固相。 壳可以定位在芯片上方，并且在本发明的一些实施例中，整个装置都延伸。 坝在至少一个方向上与模具相邻的电路板连接，以便当密封剂处于液相时，阻止密封剂朝向坝的流动。 大坝可以包括高于芯片的最上部（通常被封装）的高度的上端，坝作为壳和芯片之间的间隔。 坝的上端可能与壳体不断接触，或者，坝的上端可能通常不与壳体接触，但是如果壳体被压缩或弯曲朝向 芯片。 单个大坝可以围绕模具（以及密封剂干燥后的芯片结构）。 或者，单个大坝可以在小于所有方向上与模具相邻。 两个或更多个芯片可以与单个坝的不同部分或侧面相邻。

    Burn-in carrier for a semiconductor die
    50.
    发明授权
    Burn-in carrier for a semiconductor die 失效
    用于半导体管芯的老化载体

    公开(公告)号：US06894521B2

    公开(公告)日：2005-05-17

    申请号：US10395923

    申请日：2003-03-24

    申请人： Walter L. Moden ,  John O. Jacobson

    发明人： Walter L. Moden ,  John O. Jacobson

    IPC分类号： G01R1/04 ,  G01R31/26 ,  H01L21/44 ,  H01L21/66 ,  G01R31/28

    CPC分类号： G01R1/04 ,  G01R1/0483 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2224/49171 ,  H01L2924/01019 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A method of using adhesive tape to temporarily retain a die being temporarily held in a fixture during testing and burn-in. The method of the present invention uses a die cut piece of adhesively coated tape to hold a die in a test and burn-in fixture. Upon subsequent heating of the tape beyond the normal operating range of the adhesive coating on the tape, the die is removed from the tape, the tape is removed from the test and burn-in fixture, and the remaining adhesive, if any, is removed from the test and burn-in fixture.

    摘要翻译： 在测试和老化期间使用胶带临时保持模具临时保持在固定装置中的方法。 本发明的方法使用粘合涂覆带的模切片将模具保持在测试和老化固定装置中。 在随后将带加热超过胶带上的粘合剂涂层的正常操作范围之后，将模具从带上移除，将带从测试和老化固定装置中取出，并且剩余的粘合剂（如果有的话）被去除 从测试和老化装置。