公开(公告)号：US20060126677A1

公开(公告)日：2006-06-15

申请号：US11067299

申请日：2005-02-25

Applicant: Yunlong Sun ,  Richard Harris ,  William Jordens ,  Lei Sun

Inventor： Yunlong Sun ,  Richard Harris ,  William Jordens ,  Lei Sun

IPC: H01S3/13

CPC classification number: H01L23/5258 ,  B23K26/0604 ,  B23K26/0613 ,  B23K26/0622 ,  B23K26/067 ,  B23K26/361 ,  B23K26/40 ,  B23K2103/08 ,  B23K2103/10 ,  B23K2103/12 ,  B23K2103/14 ,  B23K2103/172 ,  B23K2103/26 ,  B23K2103/50 ,  H01L2924/0002 ,  H01S3/10046 ,  H01S3/2383 ,  Y10S438/94 ,  H01L2924/00

Abstract: A specially shaped laser pulse energy profile characterized by different laser wavelengths at different times of the profile provides reduced, controlled jitter to enable semiconductor device micromachining that achieves high quality processing and a smaller possible spot size.

Abstract translation: 在轮廓不同时刻，不同激光波长的特殊形状的激光脉冲能量分布提供了减少的受控抖动，从而能够实现高质量处理和较小可能光斑尺寸的半导体器件微机械加工。

公开(公告)号：US20050224469A1

公开(公告)日：2005-10-13

申请号：US11000333

申请日：2004-11-29

Applicant: Donald Cutler ,  Brian Baird ,  Richard Harris ,  David Hemenway ,  Ho Lo ,  Brady Nilsen ,  Yasu Osako ,  Lei Sun ,  Yunlong Sun ,  Mark Unrath

Inventor： Donald Cutler ,  Brian Baird ,  Richard Harris ,  David Hemenway ,  Ho Lo ,  Brady Nilsen ,  Yasu Osako ,  Lei Sun ,  Yunlong Sun ,  Mark Unrath

IPC: B23K26/06 ,  B23K26/00

CPC classification number: B23K26/06

Abstract: A laser beam switching system employs a laser coupled to a beam switching device that causes a laser beam to switch between first and second beam positioning heads such that while the first beam positioning head is directing the laser beam to process a workpiece target location, the second beam positioning head is moving to another target location and vice versa. A preferred beam switching device includes first and second AOMs positioned such that the laser beam passes through the AOMs without being deflected. When RF is applied to the first AOM, the laser beam is diffracted toward the first beam positioning head, and when RF is applied to the second AOM, the laser beam is diffracted toward the second beam positioning head.

Abstract translation: 激光束切换系统采用耦合到光束切换装置的激光器，其使激光束在第一和第二光束定位头之间切换，使得当第一光束定位头引导激光束来处理工件目标位置时，第二 光束定位头正在移动到另一个目标位置，反之亦然。 优选的光束切换装置包括第一和第二AOM，其被定位成使得激光束不经偏转地穿过AOM。 当RF施加到第一AOM时，激光束朝向第一光束定位头衍射，并且当RF施加到第二AOM时，激光束被朝向第二光束定位头衍射。

公开(公告)号：US6057180A

公开(公告)日：2000-05-02

申请号：US92490

申请日：1998-06-05

Applicant: Yunlong Sun ,  Edward J. Swenson

Inventor： Yunlong Sun ,  Edward J. Swenson

IPC: H01L21/3205 ,  H01L21/768 ,  H01L21/82 ,  H01L23/52 ,  H01L71/82

CPC classification number: H01L21/76894

Abstract: Ultraviolet (UV) laser output (88) exploits the absorption characteristics of the materials from which an electrically conductive link (42), an underlying semiconductor substrate (50), and passivation layers (48 and 54) are made to effectively remove the link (42) without damaging the substrate (50). The UV laser output (88) forms smaller than conventional IR laser link-blowing spot diameters (58) because of its shorter wavelength, thus permitting the implementation of greater circuit density. A passivation layer positioned between the link and the substrate can be formulated to be sufficiently absorptive to UV laser energy and sufficiently thick to attenuate the laser energy to prevent it from damaging the substrate (50) in the laser beam spot area (43) in both the off-link and link-overlapped portions. The UV laser output (88) can be employed to controllably ablate a depthwise portion of the passivation layer (54) underlying the link (42) to facilitate complete removal of the link (42). In addition, direct ablation of the passivation layer (48) with the UV laser output (88) facilitates predictable and consistent link severing profiles. The absorption characteristics of the passivation material also reduces the risk of damage to neighboring links or other active structures.

Abstract translation: 紫外线（UV）激光输出（88）利用材料的吸收特性，导电连接（42），下面的半导体衬底（50）和钝化层（48和54）被制成以有效地去除连接 42），而不损坏基板（50）。 紫外激光输出（88）由于其波长较短而小于传统的红外激光链接发射光点直径（58），因此允许实现更大的电路密度。 定位在连接件和衬底之间的钝化层可被配制为对UV激光能量具有足够的吸收性，并且足够厚以衰减激光能量，以防止激光能量损坏激光束光斑区域（43）中的衬底（50） 脱离链接和链接重叠部分。 可以使用UV激光输出（88）来​​可控制地消融链路（42）下面的钝化层（54）的深度方向部分，以便于完全去除链路（42）。 此外，用UV激光输出（88）直接消融钝化层（48）有助于可预测和一致的链路切断简档。 钝化材料的吸收特性也降低了损坏相邻链节或其他活性结构的风险。

公开(公告)号：US5808272A

公开(公告)日：1998-09-15

申请号：US959140

申请日：1997-10-28

Applicant: Yunlong Sun ,  Edward J. Swenson

Inventor： Yunlong Sun ,  Edward J. Swenson

IPC: B23K26/00 ,  B23K26/06

CPC classification number: B23K26/032 ,  B23K26/06 ,  B23K26/064 ,  B23K26/0643 ,  B23K26/0665 ,  B23K26/351

Abstract: A laser system (50) and processing method exploit a wavelength range (40) in which devices, including any semiconductor material-based devices (10) affected by conventional laser wavelengths and devices having light-sensitive or photo-electronic portions integrated into their circuits, can be effectively functionally trimmed without inducing performance drift or malfunctions in the processed devices. True measurement values of operational parameters of the devices can, therefore, be obtained without delay for device recovery, i.e., can be obtained substantially instantaneously with laser impingement. Accordingly, the present invention allows faster functional laser processing, eases geometric restrictions on circuit design, and facilitates production of denser and smaller devices.

Abstract translation: 激光系统（50）和处理方法利用波长范围（40），其中包括受常规激光波长影响的任何基于半导体材料的器件（10）的器件和具有集成到其电路中的光敏或光电子部分的器件 ，可以有效地进行功能修剪，而不会引起处理器件中的性能漂移或故障。 因此，可以无延迟地获得器件的操作参数的真实测量值，用于器件恢复，即可以通过激光冲击基本上即时获得。 因此，本发明允许更快的功能激光处理，简化了对电路设计的几何限制，并且便于生产更致密和更小的器件。

公开(公告)号：US5361268A

公开(公告)日：1994-11-01

申请号：US064515

申请日：1993-05-18

Applicant: Michael E. Fossey ,  Yunlong Sun

Inventor： Michael E. Fossey ,  Yunlong Sun

IPC: B23K26/00 ,  G02F1/35 ,  G02F1/37 ,  H01S3/107

CPC classification number: G02F1/3534 ,  G02F1/37 ,  H01S3/109 ,  H01S3/08054 ,  H01S3/107 ,  H01S3/1103

Abstract: A laser system and power control have a polarization state changer that produces in response to an incident beam with selected polarization state at a first wavelength .lambda..sub.1 a beam at .lambda..sub.1 with a desired polarization state. A frequency converter responds to the beam at .lambda..sub.1 with the desired polarization state to produce a frequency converted beam at a second, different wavelength .lambda..sub.2. When the polarization state changer and the frequency converter are located within a laser cavity, the laser system is operable in three different states and produces an output beam at .lambda..sub.1 or .lambda..sub.2, or no output beam, depending on the polarization state changer. In this intracavity configuration the polarization state changer is also operable as a Q-switch. When the polarization state changer and the frequency converter are located outside a laser cavity, the polarization state changer is operable in the whole range between its first and third states; the device thus produces an output beam at .lambda..sub.2, an output beam including components at .lambda..sub.1 and .lambda..sub.2, or an output beam having no component at .lambda..sub.2, again depending on the polarization state changer. In the extracavity configuration the power in the output at .lambda..sub.2 is continuously controllable between a maximum and zero.

Abstract translation: 激光系统和功率控制具有偏振状态变换器，其响应于具有选定的偏振态的入射光束，其以第一波长λ1具有λ1的具有期望偏振态的光束。 频率转换器以λ1响应所需的偏振状态的波束，以产生在第二不同波长λ2的频率转换波束。当偏振状态变换器和变频器位于激光腔内时，激光系统 可在三种不同状态下工作，并根据偏振状态变化器产生λ1或λ2的输出光束，或不输出光束。 在该腔内配置中，偏振状态变换器也可用作Q开关。 当偏振状态变换器和变频器位于激光腔外部时，偏振状态变换器可在其第一和第三状态之间的整个范围内操作; 因此该装置产生λ2的输出光束，包括λ1和λ2的分量的输出光束，或者不依赖于偏振状态变换器的，没有λ2分量的输出光束。 在腔外构造中，λ2处的输出功率在最大值和零之间是连续可控的。

公开(公告)号：US10307862B2

公开(公告)日：2019-06-04

申请号：US12413350

申请日：2009-03-27

Applicant: Yunlong Sun

Inventor： Yunlong Sun

IPC: H01S3/098 ,  H01S3/10 ,  B23K26/0622 ,  B23K26/40 ,  B23K103/10 ,  B23K103/12 ,  B23K103/16 ,  B23K103/00

Abstract: A series of laser pulse bundles or bursts are used for micromachining target structures. Each burst includes short laser pulses with temporal pulse widths that are less than approximately 1 nanosecond. A laser micromachining method includes generating a burst of laser pulses and adjusting an envelope of the burst of laser pulses for processing target locations. The method includes adjusting the burst envelope by selectively adjusting one or more first laser pulses within the burst to a first amplitude based on processing characteristics of a first feature at a target location, and selectively adjusting one or more second laser pulses within the burst to a second amplitude based on processing characteristics of a second feature at the target location. The method further includes directing the amplitude adjusted burst of laser pulses to the target location.

公开(公告)号：US08599890B2

公开(公告)日：2013-12-03

申请号：US12054811

申请日：2008-03-25

Applicant: Yunlong Sun ,  Feng Chang

Inventor： Yunlong Sun ,  Feng Chang

IPC: H01S3/13

CPC classification number: H01S3/0941 ,  H01S3/042 ,  H01S3/094076 ,  H01S3/10046 ,  H01S3/10069 ,  H01S3/1024 ,  H01S3/1068 ,  H01S3/117 ,  H01S3/1306

Abstract: Systems and methods provide laser pulse equalization at different pulse repetition frequencies (PRFs). After initially pumping a lasing medium from a first pumping level to a peak pumping level, a controller may cause a pump source to continue pumping the lasing medium according to a pulse equalization pumping curve. The equalization pumping curve may be determined based on testing laser pulse parameters at different PRFs to achieve an optimal equalization result of the pulse parameters. The optimization metric used to evaluate various equalization pumping curves may include a consistency of the pulse energy level, peak power level, and/or pulse width of the laser under different PRFs. The equalization pumping curve may be a descending curve from the peak pumping level to the first pumping level. The equalization pumping curve may be a linearly declining curve, a substantially exponentially declining curve, a parametrically declining curve, or any other curve type.

Abstract translation: 系统和方法提供不同脉冲重复频率（PRF）的激光脉冲均衡。 在初始将激光介质从第一泵浦电平泵送到峰值泵浦电平之后，控制器可以使泵浦源根据脉冲均衡泵送曲线继续泵浦激光介质。 可以基于在不同PRF下测试激光脉冲参数来确定均衡泵送曲线，以实现脉冲参数的最佳均衡结果。 用于评估各种均衡泵送曲线的优化度量可以包括不同PRF下的激光器的脉冲能级，峰值功率电平和/或脉冲宽度的一致性。 均衡泵送曲线可以是从峰值泵送电平到第一泵浦电平的下降曲线。 均衡泵送曲线可以是线性下降曲线，基本上呈指数下降曲线，参数下降曲线或任何其它曲线类型。

公开(公告)号：USRE43605E1

公开(公告)日：2012-08-28

申请号：US12351562

申请日：2009-01-09

Applicant: James N. O'Brien ,  Lian-Cheng Zou ,  Yunlong Sun ,  Kevin P. Fahey ,  Michael J. Wolfe ,  Brian W. Baird ,  Richard S. Harris

Inventor： James N. O'Brien ,  Lian-Cheng Zou ,  Yunlong Sun ,  Kevin P. Fahey ,  Michael J. Wolfe ,  Brian W. Baird ,  Richard S. Harris

IPC: B23K26/04 ,  C04B41/91

CPC classification number: B23K26/0622 ,  B23K26/032 ,  B23K26/066 ,  B23K26/073 ,  B23K26/083 ,  B23K26/0869 ,  B23K26/364 ,  B23K26/38 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/50

Abstract: UV laser cutting throughput through silicon and like materials is improved by dividing a long cut path (112) into short segments (122), from about 10 μm to 1 mm. The laser output (32) is scanned within a first short segment (122) for a predetermined number of passes before being moved to and scanned within a second short segment (122) for a predetermined number of passes. The bite size, segment size (126), and segment overlap (136) can be manipulated to minimize the amount and type of trench backfill. Real-time monitoring is employed to reduce rescanning portions of the cut path 112 (112) where the cut is already completed. Polarization direction of the laser output (32) is also correlated with the cutting direction to further enhance throughput. This technique can be employed to cut a variety of materials with a variety of different lasers and wavelengths. A multi-step process can optimize the laser processes for each individual layer.

Abstract translation: 通过将长切割路径（112）分割成约10微米至1mm的短段（122）来提高通过硅等材料的UV激光切割吞吐量。 激光输出（32）在第一短段（122）内扫描预定数量的通过，然后移动到第二短段（122）内并在第二短段（122）内扫描预定次数的通过次数。 可以操纵咬合尺寸，段尺寸（126）和段重叠（136）以最小化沟槽回填的数量和类型。 采用实时监测来减少已经完成切割的切割路径112（112）的重新扫描部分。 激光输出（32）的极化方向也与切割方向相关，以进一步提高吞吐量。 该技术可用于切割具有各种不同激光和波长的各种材料。 多步骤过程可以优化每个单独层的激光工艺。

公开(公告)号：USRE43400E1

公开(公告)日：2012-05-22

申请号：US11332815

申请日：2006-01-13

Applicant: James N. O'Brien ,  Lian-Cheng Zou ,  Yunlong Sun ,  Kevin P. Fahey ,  Michael J. Wolfe ,  Brian W. Baird ,  Richard S. Harris

Inventor： James N. O'Brien ,  Lian-Cheng Zou ,  Yunlong Sun ,  Kevin P. Fahey ,  Michael J. Wolfe ,  Brian W. Baird ,  Richard S. Harris

IPC: B23K26/04 ,  C04B41/91

CPC classification number: B23K26/0622 ,  B23K26/032 ,  B23K26/066 ,  B23K26/073 ,  B23K26/083 ,  B23K26/0869 ,  B23K26/364 ,  B23K26/38 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/50

Abstract: UV laser cutting throughput through silicon and like materials is improved by dividing a long cut path (112) into short segments (122), from about 10 μm to 1 mm. The laser output (32) is scanned within a first short segment (122) for a predetermined number of passes before being moved to and scanned within a second short segment (122) for a predetermined number of passes. The bite size, segment size (126), and segment overlap (136) can be manipulated to minimize the amount and type of trench backfill. Real-time monitoring is employed to reduce rescanning portions of the cut path 112 (112) where the cut is already completed. Polarization direction of the laser output (32) is also correlated with the cutting direction to further enhance throughput. This technique can be employed to cut a variety of materials with a variety of different lasers and wavelengths. A multi-step process can optimize the laser processes for each individual layer.

公开(公告)号：US07982161B2

公开(公告)日：2011-07-19

申请号：US12054115

申请日：2008-03-24

Applicant: Yunlong Sun ,  Weisheng Lei ,  Hisashi Matsumoto ,  Brian Johansen ,  Gregg Hardy ,  Brian Baird

Inventor： Yunlong Sun ,  Weisheng Lei ,  Hisashi Matsumoto ,  Brian Johansen ,  Gregg Hardy ,  Brian Baird

IPC: B23K26/38

CPC classification number: B23K26/0622 ,  B23K26/382 ,  B23K26/389 ,  B23K26/40 ,  B23K2103/10 ,  B23K2103/12 ,  B23K2103/172 ,  B23K2103/42 ,  B23K2103/50 ,  B23K2103/52 ,  B23K2103/54 ,  H05K3/0035

Abstract: An improved method and apparatus for drilling vias in electronic substrates with laser pulses is presented which uses one or more tailored pulses to reduce debris remaining in the via while maintaining system throughput and avoiding damage to the substrate. A tailored pulse is a laser pulse that features a power spike having a peak power 10% higher than the average power of the pulse and lasting less than 50% of the duration of the pulse. Methods and apparatuses for creating tailored pulses by slicing longer duration pulses are shown.

Abstract translation: 提出了一种用于在具有激光脉冲的电子衬底中钻通孔的改进方法和装置，其使用一个或多个定制脉冲来减少残留在通孔中的残留物，同时保持系统吞吐量并避免损坏衬底。 定制脉冲是一种激光脉冲，其特征在于具有比脉冲的平均功率高10％的峰值功率并持续小于脉冲持续时间的50％的功率尖峰。 示出了通过切片更长持续时间脉冲来创建裁剪脉冲的方法和装置。