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    Method for manufacturing a perpendicular magnetic write head with a wrap around shield
    43.
    发明授权
    Method for manufacturing a perpendicular magnetic write head with a wrap around shield 有权
    用于围绕屏蔽制造垂直磁写头的方法

    公开(公告)号：US08066892B2

    公开(公告)日：2011-11-29

    申请号：US12241751

    申请日：2008-09-30

    申请人： Hung-Chin Guthrie ,  Yimin Hsu ,  Ming Jiang ,  Sue Siyang Zhang

    发明人： Hung-Chin Guthrie ,  Yimin Hsu ,  Ming Jiang ,  Sue Siyang Zhang

    IPC分类号： B44C1/22

    CPC分类号： G11B5/3163 ,  G11B5/1278 ,  G11B5/3116 ,  G11B5/3146 ,  G11B5/315

    摘要： A method for manufacturing a write pole for a perpendicular magnetic write head. The method employs a damascene process to construct the write pole with a very accurately controlled track width. The method includes depositing a layer of material that can be readily removed by reactive ion etching. This material can be referred to as a RIEable material. A mask is formed over the RIEable material and a reactive ion etching is performed to form a tapered trench in the RIEAble material. A CMP stop layer can the be deposited, and a write pole plated into the trench. A CMP can then be performed to define the trailing edge of the write pole. Another masking, etching and plating step can be performed to form a trailing, wrap-around magnetic shield.

    摘要翻译： 一种用于制造用于垂直磁写头的写极的方法。 该方法采用镶嵌工艺构造具有非常精确控制的轨道宽度的写极点。 该方法包括沉积可以通过反应离子蚀刻容易地去除的材料层。 该材料可以称为可分级材料。 在RIEable材料上形成掩模，并执行反应离子蚀刻以在RIEAble材料中形成锥形沟槽。 可以将CMP停止层沉积，并将写入极电镀到沟槽中。 然后可以执行CMP以限定写入极的后沿。 可以执行另一掩模，蚀刻和电镀步骤以形成拖尾的环绕磁屏蔽。

    Method for manufacturing a perpendicular magnetic write head with wrap around magnetic trailing and side shields
    44.
    发明授权
    Method for manufacturing a perpendicular magnetic write head with wrap around magnetic trailing and side shields 有权
    用于制造垂直磁性写入头的方法，包括磁性尾部和侧面屏蔽

    公开(公告)号：US07788798B2

    公开(公告)日：2010-09-07

    申请号：US11944125

    申请日：2007-11-21

    申请人： Hung-Chin Guthrie ,  Ming Jiang ,  Changqing Shi ,  Sue Siyang Zhang

    发明人： Hung-Chin Guthrie ,  Ming Jiang ,  Changqing Shi ,  Sue Siyang Zhang

    IPC分类号： G11B5/127 ,  H04R31/00

    CPC分类号： G11B5/3116 ,  G11B5/1278 ,  Y10T29/49032 ,  Y10T29/49043 ,  Y10T29/49048 ,  Y10T29/49052 ,  Y10T29/49798

    摘要： A method for manufacturing a magnetic write head having a wrap around magnetic shield. The method allows a highly accurate short wavelength such as 193 mm photolithography to be used to accurately define the placement and critical dimension of wrap around magnetic shield. The method includes the formation of a magnetic write pole, top gap, and side gap and the deposition of a RIEable fill layer thereover, and CMP to planarization. A 193 nm photolithography and ion milling is used to form a mask over the RIEable layer and one or more reactive ion etching processes are performed to pattern the RIEable layer through 193 nm photolithography mask. A wrap around shield can then be electroplated into the opening formed in the RIEable layer.

    摘要翻译： 一种用于制造具有围绕磁屏蔽的磁性写入头的方法。 该方法允许使用高精度的短波长（例如193mm光刻）来精确地定义磁屏蔽环绕的放置和临界尺寸。 该方法包括形成磁性写入极，顶部间隙和侧面间隙以及在其上沉积RIEable填充层，并将CMP平坦化。 使用193nm光刻和离子研磨在RIEable层上形成掩模，并且执行一个或多个反应离子蚀刻工艺以通过193nm光刻掩模对RIEable层进行图案化。 然后可以将环绕的护罩电镀到形成在RIEable层中的开口中。

    METHOD FOR MANUFACTURING A PERPENDICULAR MAGNETIC WRITE HEAD WITH A WRAP AROUND SHIELD
    45.
    发明申请
    METHOD FOR MANUFACTURING A PERPENDICULAR MAGNETIC WRITE HEAD WITH A WRAP AROUND SHIELD 有权
    用于制造具有附着力的扁平磁头写入头的方法

    公开(公告)号：US20100078406A1

    公开(公告)日：2010-04-01

    申请号：US12241751

    申请日：2008-09-30

    申请人： Hung-Chin Guthrie ,  Yimin Hsu ,  Ming Jiang ,  Sue Siyang Zhang

    发明人： Hung-Chin Guthrie ,  Yimin Hsu ,  Ming Jiang ,  Sue Siyang Zhang

    IPC分类号： B44C1/22

    CPC分类号： G11B5/3163 ,  G11B5/1278 ,  G11B5/3116 ,  G11B5/3146 ,  G11B5/315

    摘要： A method for manufacturing a write pole for a perpendicular magnetic write head. The method employs a damascene process to construct the write pole with a very accurately controlled track width. The method includes depositing a layer of material that can be readily removed by reactive ion etching. This material can be referred to as a RIEable material. A mask is formed over the RIEable material and a reactive ion etching is performed to form a tapered trench in the RIEAble material. A CMP stop layer can the be deposited, and a write pole plated into the trench. A CMP can then be performed to define the trailing edge of the write pole. Another masking, etching and plating step can be performed to form a trailing, wrap-around magnetic shield.

    摘要翻译： 一种用于制造用于垂直磁写头的写极的方法。 该方法采用镶嵌工艺构造具有非常精确控制的轨道宽度的写极点。 该方法包括沉积可以通过反应离子蚀刻容易地去除的材料层。 该材料可以称为可分级材料。 在RIEable材料上形成掩模，并执行反应离子蚀刻以在RIEAble材料中形成锥形沟槽。 可以将CMP停止层沉积，并将写入极电镀到沟槽中。 然后可以执行CMP以限定写入极的后沿。 可以执行另一掩模，蚀刻和电镀步骤以形成拖尾的环绕磁屏蔽。

    Fabricating perpendicular write elements in perpendicular magnetic recording heads
    46.
    发明授权
    Fabricating perpendicular write elements in perpendicular magnetic recording heads 失效
    在垂直磁记录头中制造垂直写入元件

    公开(公告)号：US07648731B2

    公开(公告)日：2010-01-19

    申请号：US11380154

    申请日：2006-04-25

    申请人： Hung-Chin Guthrie ,  Ming Jiang ,  Yinshi Liu ,  Aron Pentek ,  John J. Yang ,  Sue Siyang Zhang

    发明人： Hung-Chin Guthrie ,  Ming Jiang ,  Yinshi Liu ,  Aron Pentek ,  John J. Yang ,  Sue Siyang Zhang

    IPC分类号： B05D5/12

    CPC分类号： G11B5/1278 ,  G11B5/3163

    摘要： Methods of fabricating perpendicular write elements for perpendicular magnetic recording heads are discussed. In write element fabrication, write poles are fabricated according to one of many desired methods. The write poles during fabrication are typically covered by a hard mask and a photolithographic soft mask. According to the methods described herein, the soft mask is removed such as by chemical etching. The hard mask is then removed, such as by CMP and ion etching, to expose the write poles. Shield gap material may then be deposited on the write poles to define the shield gap between the write poles and the trailing shields. Trailing shield material may then be deposited on the shield gap material to form the trailing shields corresponding with the write poles.

    摘要翻译： 讨论了制造垂直磁记录头垂直写入元件的方法。 在写入元件制造中，根据许多期望的方法之一制造写入极。 制造期间的写入极通常被硬掩模和光刻软掩模覆盖。 根据本文描述的方法，例如通过化学蚀刻去除软掩模。 然后去除硬掩模，例如通过CMP和离子蚀刻，以暴露写入极。 然后可以将屏蔽间隙材料沉积在写入极上以限定写入极和后部屏蔽之间的屏蔽间隙。 然后可以将后挡板材料沉积在屏蔽间隙材料上以形成对应于写入极的后挡板。

    FABRICATING PERPENDICULAR WRITE ELEMENTS IN PERPENDICULAR MAGNETIC RECORDING HEADS
    49.
    发明申请
    FABRICATING PERPENDICULAR WRITE ELEMENTS IN PERPENDICULAR MAGNETIC RECORDING HEADS 失效
    在完整的磁记录头中制作完整的写入元素

    公开(公告)号：US20080145524A1

    公开(公告)日：2008-06-19

    申请号：US11380154

    申请日：2006-04-25

    申请人： Hung-Chin Guthrie ,  Ming Jiang ,  Yinshi Liu ,  Aron Pentek ,  John J. Yang ,  Sue Siyang Zhang

    发明人： Hung-Chin Guthrie ,  Ming Jiang ,  Yinshi Liu ,  Aron Pentek ,  John J. Yang ,  Sue Siyang Zhang

    IPC分类号： B05D5/12

    CPC分类号： G11B5/1278 ,  G11B5/3163

    摘要： Methods of fabricating perpendicular write elements for perpendicular magnetic recording heads are discussed. In write element fabrication, write poles are fabricated according to one of many desired methods. The write poles during fabrication are typically covered by a hard mask and a photolithographic soft mask. According to the methods described herein, the soft mask is removed such as by chemical etching. The hard mask is then removed, such as by CMP and ion etching, to expose the write poles. Shield gap material may then be deposited on the write poles to define the shield gap between the write poles and the trailing shields. Trailing shield material may then be deposited on the shield gap material to form the trailing shields corresponding with the write poles.

    摘要翻译： 讨论了制造垂直磁记录头垂直写入元件的方法。 在写入元件制造中，根据许多期望的方法之一制造写入极。 制造期间的写入极通常被硬掩模和光刻软掩模覆盖。 根据本文描述的方法，例如通过化学蚀刻去除软掩模。 然后去除硬掩模，例如通过CMP和离子蚀刻，以暴露写入极。 然后可以将屏蔽间隙材料沉积在写入极上以限定写入极和后部屏蔽之间的屏蔽间隙。 然后可以将后挡板材料沉积在屏蔽间隙材料上以形成对应于写入极的后挡板。

    Copper damascene chemical mechanical polishing (CMP) for thin film head writer fabrication
    50.
    发明申请
    Copper damascene chemical mechanical polishing (CMP) for thin film head writer fabrication 失效
    铜大马士革化学机械抛光（CMP）用于薄膜头写入器制造

    公开(公告)号：US20080096389A1

    公开(公告)日：2008-04-24

    申请号：US11584027

    申请日：2006-10-20

    申请人： Jian-Huei Feng ,  Hung-Chin Guthrie ,  Ming Jiang ,  Sue Siyang Zhang

    发明人： Jian-Huei Feng ,  Hung-Chin Guthrie ,  Ming Jiang ,  Sue Siyang Zhang

    IPC分类号： H01L21/461 ,  H01L21/302 ,  C23F1/00

    CPC分类号： C23F3/06 ,  C09G1/02 ,  C23F3/04 ,  C25D5/02 ,  G11B5/3163 ,  G11B5/3169

    摘要： In one method and embodiment of the present invention, at least one coil layer is formed in a write head, using a two-slurry step of copper damascene chemical mechanical polishing method with a first slurry step removing the undesirable copper that is on top of the tantalum barrier layer and on top of the trenches and a second slurry step removing the remainder of the undesirable copper, the tantalum barrier layer, the silicon dioxide hard mask layer, the hard baked photoresist layer, the magnetic alloy such as NiFe, CoFe, or CoNiFe, and alumina insulating layer for better thin film magnetic head performances.

    摘要翻译： 在本发明的一个方法和实施例中，使用铜镶嵌化学机械抛光方法的双浆步骤，在写头中形成至少一个线圈层，其中第一浆料步骤除去位于 钽阻挡层并且在沟槽的顶部上，第二浆料步骤除去不需要的铜，钽阻挡层，二氧化硅硬掩模层，硬烘焙光致抗蚀剂层，磁性合金如NiFe，CoFe或 CoNiFe和氧化铝绝缘层，用于更好的薄膜磁头性能。