Abstract:
A surface-tensioned sapphire plate and a corresponding manufacturing process. The plate may include a planar sapphire substrate and at least one layer disposed on the surface of the substrate for tensing the substrate. The layer may include at least 50 wt.-% of aluminum oxide (Al2O3). The manufacturing process for producing of a sapphire plate may include providing a planar sapphire substrate, and coating at least one surface of the substrate with a layer tensing the substrate. The layer may include at least 50 wt.-% of aluminum oxide (Al2O3).
Abstract translation:表面张力蓝宝石板和相应的制造工艺。 板可以包括平面蓝宝石衬底和设置在衬底的表面上的用于张紧衬底的至少一层。 该层可以包括至少50重量%的氧化铝(Al 2 O 3)。 用于制造蓝宝石板的制造方法可以包括提供平面蓝宝石衬底,以及使衬底的至少一个表面涂覆有使衬底拉紧的层。 该层可以包括至少50重量%的氧化铝(Al 2 O 3)。
Abstract:
A flow diverter is described and fabricated using ultra-thin porous thin-film Nitinol, and is configured for implantation to a treatment site within a vessel for significant reduction in an intra-aneurismal flow velocity and vorticity. Using small size pores in a coverage area of only 10%, a 90% reduction in flow velocity into a pseudo-aneurysm can be achieved, with an almost immediate cessation of flow into an anatomical feature such as aneurysm sac in vivo. The size of the holes can be tailored to be any shape and range in size from 1-400 μm using photolithography and from 5-1000 nm using ebeam lithography.
Abstract:
Atomic layer deposition (ALD) type processes for producing metal containing thin films comprise feeding into a reaction space vapor phase pulses of metal containing cyclopentadienyl precursors as a metal source material. In preferred embodiments the metal containing cyclopentadienyl reactant comprises a metal atom that is not directly bonded to an oxygen or halide atom. In other embodiments the metal atom is bonded to a cyclopentadienyl compound and separately bonded to at least one ligand via a nitrogen atom. In still other embodiments the metal containing cyclopentadienyl compound comprises a nitrogen-bridged ligand.
Abstract:
The present invention relates to a method for applying a coating to a substrate using cold plasma, wherein particles provided with a polymer coating are fed into a cold plasma at less than 3,000 K and the particles activated by this are deposited on a substrate. The present invention furthermore relates to a substrate coating which can be obtained by the methods according to the invention. The present invention furthermore relates to the use of platelet-shaped particles with a polymer coating with an average thickness of less than 2 μm in the coating of a substrate using a cold plasma.
Abstract:
A recording medium surface property modifying apparatus is disclosed. The recording medium surface property modifying apparatus includes a conveying unit which conveys a recording medium in a predetermined direction; a discharging electrode which rotates and comes into contact with a face to be treated of the recording medium which is conveyed by the conveying unit to cause the face to be treated to be in contact with plasma to modify a surface property of the recording medium; and a hollow-shaped cover member which covers a plasma treatment unit which includes the discharging electrode, the recording medium surface property modifying apparatus further including a humidity control unit which controls, in advance, humidity of the plasma treatment unit in alignment with acidity of the recording medium which undergoes the surface property modifying treatment.
Abstract:
The invention relates to a plasma spray method which can serve as a starting point for a manufacture of metal nanopowder, nitride nanopowder or carbide nanopowder or metal films, nitride films or carbide films. To achieve an inexpensive manufacture of the nanopowder or of the film, in the plasma spray in accordance with the invention a starting material (P) which contains a metal or silicon oxide is introduced into a plasma jet (113) at a process pressure of at most 1000 Pa, in particular at most 400 Pa. The starting material (P) contains a metal or silicon oxide which vaporizes in the plasma jet (113) and is reduced in so doing. After the reduction, the metal or silicon which formed the metal or silicon oxide in the starting material is thus present in pure form or in almost pure form. The metal or silicon can be deposited in the form of nanopowder or of a film (124). Nitride nanoparticles or films or carbide nanoparticles or films can be generated inexpensively by addition of a reactant (R) containing nitrogen or carbon.
Abstract:
A deposition apparatus according to an exemplary embodiment of the present invention includes a plurality of reactors; a plurality of gas supply units connected to the plurality of reactors; and a plurality of plasma supply units connected to the plurality of reactors. Each of the plasma supply units includes: a plasma power supplier; a plurality of diodes connected to the plasma power supplier; and a reverse voltage driver connected to the plurality of diodes through respectively corresponding switches.
Abstract:
An apparatus and method for forming a carbon protective layer on a substrate using a plasma CVD method allows a more uniform in-plane distribution of the carbon protective layer thickness. The apparatus includes an annular anode that generates a plasma beam and a disk-shaped shield disposed between the anode and the substrate. The anode, the shield, and the substrate are concentrically arranged so that a straight line connecting the centers of the anode and the substrate is perpendicular to the deposition surface of the substrate where the carbon protective layer is to be formed. The center of the shield is also on the straight line.
Abstract:
A method for producing, by means of plasma, nanostructured thin layers particularly of the hierarchically organized type, and an apparatus for implementing the method, are described. At least a first chamber (10) is provide in which are present an injector (14) of a reagent gas, means (31, 31′) for feeding inert gases, and an antenna (16) for the creation of a plasma in said first chamber. Enclosing said first chamber is a second chamber (11) to which a pumping system is connected, containing a housing for the substrate (35) on which the nanostructured film is produced. A wall (12) separates said first chamber from said second chamber and has at least one opening (13). The injector and antenna are arranged in the first chamber with a geometry such that the distance between the outlet of said injector is at a distance of no more than 5 cm from the plane of the surface of said antenna farther from said wall, and said surface is at a distance of no more than 5 cm from said opening.
Abstract:
A plasma deposition apparatus is provided. The plasma deposition apparatus comprises a chamber. A pedestal is placed in the chamber. A plasma generator is placed in the chamber and over the pedestal. The plasma generator comprises a plasma jet for plasma thin film deposition having a discharge direction angle θ1 larger than 0° and less than 90° between a normal direction of the pedestal and the discharge direction of the plasma jet. A gas-extracting pipe extends into the chamber and over the pedestal. The gas-extracting pipe provides a pumping path for particles and side-products having a pumping direction angle θ2 larger than 0° and less than 90° between the normal direction of the pedestal and the pumping direction of the gas-extracting pipe. The chamber is kept at an ambient atmospheric pressure.