公开(公告)号：US20160230285A1

公开(公告)日：2016-08-11

申请号：US14912698

申请日：2014-07-31

Applicant: YAMAMOTO-MS CO., LTD. ,  WASEDA UNIVERSITY

Inventor： Wataru Yamamoto ,  Kimiko Koiwa ,  Takayuki HOMMA ,  Masahiro YANAGISAWA ,  Mikiko Saito ,  Tomoyuki YAMAMOTO

IPC: C23C18/16 ,  C25D17/00 ,  C25D17/10 ,  C25D21/12

CPC classification number: C23C18/1619 ,  C23C18/163 ,  C23C18/1683 ,  C25D17/001 ,  C25D17/002 ,  C25D17/004 ,  C25D17/008 ,  C25D17/06 ,  C25D17/10 ,  C25D17/12 ,  C25D21/12

Abstract: A plating apparatus (1) includes: a holding member (2) that holds a plated object (W); a spacer (4) that is stacked on the holding member (2) via a first seal member (3) in an annular shape surrounding the plated object (W), and has a through portion (45) from which the plated object (W) is exposed and which stores a plating solution; and an anode member (6) that is stacked on the spacer (4) via a second seal member (3) in an annular shape surrounding the through portion (45), and has an anode layer (62) arranged to face the plated object (W) which is exposed from the through portion (45).

Abstract translation: 电镀装置（1）包括：保持电镀对象（W）的保持构件（2）; 经由第一密封构件（3）以包围电镀对象（W）的环状形状堆叠在保持构件（2）上的间隔物（4），并且具有贯通部（45），电镀对象 ）暴露并存储电镀液; 以及阳极部件（6），其经由第二密封部件（3）以围绕所述贯通部（45）的环状形状堆叠在所述间隔件（4）上，并且具有布置成面向所述镀覆对象物的阳极层（62） （W）从所述贯通部（45）露出。

公开(公告)号：US09399827B2

公开(公告)日：2016-07-26

申请号：US14259492

申请日：2014-04-23

Applicant: APPLIED Materials, Inc.

Inventor： Robert B. Moore ,  David Silvetti ,  Paul Wirth ,  Randy Harris

IPC: C25D17/06 ,  C25D17/00

CPC classification number: C25D17/06 ,  C25D7/12 ,  C25D17/001 ,  C25D17/005 ,  H01L21/68707 ,  H01L21/68721 ,  H01L21/68764 ,  H01L21/76879

Abstract: In a processing system for electroplating semiconductor wafers and similar substrates, the contact ring of the electroplating processor is removed from the rotor of the processor and replaced with a previously deplated contact ring. This allows the contact ring to be deplated in ring service module of the system, while the processor continues to operate. Wafer throughput is improved. The contact ring may be attached to a chuck for moving the contact ring between the processors and the ring service module, with the chuck quickly attachable and releasable to the rotor.

Abstract translation: 在用于电镀半导体晶片和类似衬底的处理系统中，电镀处理器的接触环从处理器的转子移除，并被先前去绝缘的接触环替代。 这允许接触环在系统的环形服务模块中脱落，同时处理器继续工作。 晶圆生产量提高。 接触环可以附接到卡盘，用于使处理器和环形服务模块之间的接触环移动，卡盘可快速地附接和释放到转子上。

公开(公告)号：US09388504B2

公开(公告)日：2016-07-12

申请号：US14223972

申请日：2014-03-24

Applicant: EBARA CORPORATION

Inventor： Tomonori Hirao

IPC: B65G45/26 ,  C25D17/06 ,  C23C18/16 ,  B65G45/24 ,  B65G45/10 ,  B65G45/22 ,  C25D17/00

CPC classification number: C25D5/48 ,  B65G45/10 ,  B65G45/22 ,  B65G45/24 ,  B65G45/26 ,  C23C18/1628 ,  C23C18/163 ,  C23C18/1632 ,  C23C18/1675 ,  C25D17/001 ,  C25D17/06 ,  C25D21/02 ,  C25D21/04 ,  C25D21/06

Abstract: A plating apparatus includes a processing bath configured to store a processing liquid therein, a transporter configured to immerse a substrate holder, holding a substrate, in the processing liquid, raise the substrate holder out of the processing bath, and transport the substrate holder in a horizontal direction, and a gas flow generator configured to generate a clean gas flow forward of the substrate with respect to a direction in which the substrate holder is transported. The transporter moves the gas flow generator together with the substrate holder in the horizontal direction while transporting the substrate holder in the horizontal direction.

Abstract translation: 电镀装置包括：配置成在其中储存处理液的处理槽，构造成将保持基板的基板保持件浸入处理液中的输送器，将基板保持器从处理槽中升出，并将基板保持件输送到 水平方向和气流发生器，其构造成相对于输送基板保持器的方向产生衬底前方的清洁气体流。 输送器沿水平方向将气流发生器与基板保持器一起移动，同时沿水平方向输送基板保持器。

公开(公告)号：US20160194776A1

公开(公告)日：2016-07-07

申请号：US14653462

申请日：2013-12-03

Applicant: ATOTECH DEUTSCHLAND GMBH

Inventor： Ray WEINHOLD ,  Ferdinand WIENER

IPC: C25D5/08 ,  C25D17/06 ,  C25D7/00 ,  C25D3/38 ,  C25D7/12

CPC classification number: C25D5/08 ,  C25D3/38 ,  C25D7/00 ,  C25D7/12 ,  C25D17/001 ,  C25D17/06 ,  C25D17/12

Abstract: A method and device for vertical galvanic metal deposition on a substrate, the device including at least first and second device elements arranged vertically parallel to each other, the first device element including at least a first anode element having a plurality of through-going conduits and at least a first carrier element having a plurality of through-going conduits, the at least first anode element and the at least first carrier element firmly connected to each other; and the second device element including at least a first substrate holder adapted to receive at least one substrate to be treated, the at least one substrate holder at least partially surrounding the at least one substrate along its outer frame after receiving it; the distance between the first anode element and the at least first substrate holder ranging from 2 to 15 mm.

Abstract translation: 一种用于垂直电镀金属沉积在衬底上的方法和装置，该装置至少包括彼此垂直平行布置的第一和第二器件元件，第一器件元件至少包括具有多个贯穿管道的第一阳极元件， 至少第一载体元件具有多个贯穿管道，所述至少第一阳极元件和所述至少第一载体元件彼此牢固地连接; 并且所述第二装置元件至少包括适于接纳至少一个待处理基板的第一基板保持架，所述至少一个基板保持件在接收之后沿其外框架至少部分地围绕所述至少一个基板; 所述第一阳极元件和所述至少第一衬底保持器之间的距离为2至15mm。

公开(公告)号：US09340893B2

公开(公告)日：2016-05-17

申请号：US14678686

申请日：2015-04-03

Applicant: Novellus Systems, Inc.

Inventor： Jingbin Feng ,  R. Marshall Stowell ,  Shantinath Ghongadi ,  Zhian He ,  Frederick Dean Wilmot

IPC: C25D17/12 ,  C25D17/00 ,  C25D17/06 ,  C25D17/10 ,  C25D7/12

CPC classification number: C25D17/12 ,  C25D7/12 ,  C25D7/123 ,  C25D17/001 ,  C25D17/06 ,  C25D17/10 ,  C25D21/12 ,  H01L21/2885

Abstract: Apparatus and methods for electroplating are described. Apparatus described herein include anode supports including positioning mechanisms that maintain a consistent distance between the surface of the wafer and the surface of a consumable anode during plating. Greater uniformity control is achieved.

公开(公告)号：US20160108542A1

公开(公告)日：2016-04-21

申请号：US14897130

申请日：2014-06-06

Applicant: KYB CORPORATION ,  CHUO SEISAKUSHO, LTD.

Inventor： Yoshitaka MOCHIZUKI ,  Toshihisa MIYAZAKI ,  Akira TAKAMATSU

IPC: C25D17/12 ,  C25D17/00 ,  C25D5/08

CPC classification number: C25D17/12 ,  C25D5/08 ,  C25D7/00 ,  C25D17/005 ,  C25D17/007 ,  C25D17/06 ,  C25D17/10 ,  C25D21/10

Abstract: Providing an anode capable of desirably performing plating for a long period of time. An anode is cylindrical and forms a space between an article to be plated and itself. A plating solution flows in the space. Positive voltage is applied to the anode. The anode includes an outer cylinder and an inner cylinder welded to be in contact with an inner surface of the outer cylinder. The inner cylinder is formed of a plate material made from platinum.

Abstract translation: 提供能够长时间期望地进行电镀的阳极。 阳极是圆柱形的，并且在待镀制品和自身之间形成空间。 电镀液在该空间中流动。 阳极施加正电压。 阳极包括外筒和焊接成与外筒的内表面接触的内筒。 内筒由铂制成的板材形成。

公开(公告)号：US09303329B2

公开(公告)日：2016-04-05

申请号：US14076610

申请日：2013-11-11

Applicant: TEL NEXX, Inc.

Inventor： Arthur Keigler ,  David Guarnaccia ,  Demetrius Papapanayiotou ,  Jonathan Hander

IPC: C25D21/10 ,  C25D17/00 ,  C25D7/12 ,  C25D17/06 ,  C25D17/10 ,  C25D21/14 ,  H01L21/288

CPC classification number: C25D21/10 ,  C25D17/001 ,  C25D17/002 ,  C25D17/06 ,  C25D17/10 ,  C25D21/14 ,  H01L21/2885

Abstract: Techniques disclosed herein include an electro-chemical deposition apparatus that provides an efficient circulation system, chemical management that provides reliable and uniform plating, and a configuration that provides short maintenance times and greater tool availability. Techniques include a processing tank containing an anolyte fluid, and one or more plating cells each having a catholyte fluid compartment with a circulation path that connects to a separate or remote catholyte reservoir. Thus, with such a configuration, a single pump can be used to flow catholyte (via manifolds) through one or more plating cells. Thus, with the catholyte reservoir maintained off board, instead of dumping catholyte over a weir into a reservoir, catholyte fluid—after flowing through a plating cell—is returned to the catholyte reservoir.

Abstract translation: 本文公开的技术包括提供有效的循环系统的电化学沉积设备，提供可靠和均匀的电镀的化学管理以及提供短维护时间和更大的刀具可用性的配置。 技术包括含有阳极电解液的处理槽和一个或多个电镀单元，每个电镀单元具有连接到单独或远程阴极电解液储存器的循环路径的阴极电解液隔室。 因此，通过这种构造，可以使用单个泵将阴极电解液（经由歧管）流过一个或多个电镀单元。 因此，随着阴极电解液储存器的维护，不是将阴极电解液倾倒在堰内进入储层，所以在流过电镀池之后的阴极液被返回到阴极电解液储存器。

公开(公告)号：US20160076163A1

公开(公告)日：2016-03-17

申请号：US14946392

申请日：2015-11-19

Applicant: DePuy Synthes Products, Inc.

Inventor： Urs HULLIGER

IPC: C25D11/34 ,  C25D17/06 ,  A61L2/07 ,  A61F2/00

CPC classification number: C25D11/34 ,  A61B50/20 ,  A61B50/30 ,  A61B2017/00526 ,  A61F2/0095 ,  A61L2/07 ,  B65B5/00 ,  C25D11/005 ,  C25D17/06 ,  C25D17/08

Abstract: A device is for treating and packaging implants. The device includes a container including a chamber therein. The chamber is closed by a removable seal. The device also includes a carrier sized and shaped to be inserted into the chamber. The carrier includes a carrying structure configured to connect an implant thereto. A portion of the carrier may be formed of an electrically conductive material.

Abstract translation: 一种装置用于处理和包装植入物。 该装置包括其中包括室的容器。 腔室由可拆卸的密封封闭。 该装置还包括尺寸和形状被插入到室中的载体。 载体包括构造成将植入物连接到其上的承载结构。 载体的一部分可以由导电材料形成。

公开(公告)号：US20160068987A1

公开(公告)日：2016-03-10

申请号：US14480624

申请日：2014-09-08

Applicant: Tung-Shan Kuo

Inventor： Tung-Shan Kuo

IPC: C25D17/06

CPC classification number: C25D17/06 ,  C25D17/08

Abstract: An electric plating hanging rod assembly for supporting a work piece to be plated, comprises a hanging rod having an upper retaining bar and a lower retaining bar; a distal end of the upper retaining bar far away from the hanging rod being pointed upwards; and a distal end of the lower retaining bar far away from the hanging rod being pointed downwards. The hanging rod extended with at least one upper supporting rod and at least one lower supporting rod which are alternatively arranged; at a distal end of the upper supporting rod far away from the hanging rod is fixed with an upper retaining bar and at a distal end of the lower supporting rod far away from the hanging rod is fixed with a lower retaining bar. A distal end of each of the upper and lower retaining is formed as a tapered reduced end.

Abstract translation: 一种用于支撑待电镀的工件的电镀吊杆组件，包括具有上保持杆和下保持杆的悬挂杆; 远离吊杆的上保持杆的远端向上指向; 并且远离悬挂杆的下保持杆的远端向下指向。 所述吊杆延伸有至少一个上支撑杆和至少一个下支撑杆，所述至少一个下支撑杆交替布置; 在远离悬挂杆的上支撑杆的远端处固定有上保持杆，并且远离悬挂杆的下支撑杆的远端固定有下保持杆。 上部和下部保持件中的每一个的远端形成为渐缩的缩小端。

公开(公告)号：US20160068985A1

公开(公告)日：2016-03-10

申请号：US14784042

申请日：2013-04-22

Applicant: ACM RESEARCH (SHANGHAI) INC.

Inventor： Hui Wang ,  Fuping Chen ,  Xi Wang

IPC: C25D5/20 ,  C25D17/06 ,  C25D5/18 ,  C25D3/02

CPC classification number: C25D5/20 ,  C25D3/02 ,  C25D5/18 ,  C25D17/001 ,  C25D17/06

Abstract: The present invention relates to applying at least one ultra/mega sonic device and its reflection plate for forming standing wave in a metallization apparatus to achieve highly uniform metallic film deposition at a rate far greater than conventional film growth rate in electrolyte. In the present invention, the substrate is dynamically controlled so that the position of the substrate passing through the entire acoustic field with different power intensity in each motion cycle. This method guarantees each location of the substrate to receive the same amount of total sonic energy dose over the interval of the process time, and to accumulatively grow a uniform deposition thickness at a rapid rate.

Abstract translation: 本发明涉及在金属化装置中应用至少一个超/超声波装置及其用于形成驻波的反射板，以达到远高于电解质中常规膜生长速率的高度均匀的金属膜沉积。 在本发明中，基板被动态地控制，使得基板的位置在每个运动周期中以不同的功率强度通过整个声场。 该方法确保基板的每个位置在处理时间的间隔内接收相同量的总声波能量，并且以快速的速度累积生长均匀的沉积厚度。