公开(公告)号：US10021809B2

公开(公告)日：2018-07-10

申请号：US14902801

申请日：2014-07-04

申请人： LG ELECTRONICS INC.

发明人： Yung Koo Lee ,  Jong Chul Ha ,  Dong Soo Moon ,  Hyun Jong Kim

IPC分类号： F28F7/00 ,  H05K7/20 ,  F25B21/02 ,  F24F1/24

CPC分类号： H05K7/20136 ,  F24F1/24 ,  F25B21/02 ,  H05K7/20254

摘要： Disclosed in an air conditioner including a control box having a space formed therein, a PCB arranged to form an air circulation passage in the space, the PCB having a plurality of electric components mounted thereto, a cooling module for making a first electric component of the plurality of electric components to heat exchange with refrigerant, and a circulating fan arranged in the air circulation passage to make air to flow to a second electric component of the plurality of electric components after cooled by the cooling module, thereby dissipating heat from an inside of the control box with a mixed cooling system of a refrigerant cooling system and an air cooling system, efficiently.

公开(公告)号：US20180145239A1

公开(公告)日：2018-05-24

申请号：US15607627

申请日：2017-05-29

申请人： Hyundai Motor Company ,  Kia Motors Corporation

发明人： Man Ju Oh ,  Sang Shin Lee ,  Jae Woo Park ,  So Yoon Park ,  Jae Woong Kim ,  So La Chung

IPC分类号： H01L35/30 ,  B60N2/56

CPC分类号： H01L35/30 ,  B60N2/5635 ,  B60N2/5642 ,  B60N2/5657 ,  B60N2/5685 ,  B60N2/5692 ,  F25B21/02 ,  F25B2321/0251 ,  H01L35/28

摘要： A ventilation module can be used with a ventilation seat for a vehicle. A thermoelectric air-conditioning part has a thermoelectric unit performing heat absorption and heat generation by using a Peltier effect when electric power is applied, a cooling unit provided at a first side of the thermoelectric unit, and a heat dissipation unit provided at a second side of the thermoelectric unit. The module is configured so that air that is supplied from a blower is cooled by the thermoelectric air-conditioning part, passes through a cooling fin of the cooling unit, and is discharged to an interior of the vehicle through a seat cushion. The module is also configured so that air that is supplied from the blower is heated by the thermoelectric air-conditioning part, passes through a heat dissipating fin of the heat dissipation unit, and is discharged through the heat dissipation path.

公开(公告)号：US09968001B2

公开(公告)日：2018-05-08

申请号：US15356103

申请日：2016-11-18

申请人： Huawei Technologies Co., Ltd.

发明人： Xingxing Huang ,  Kaikai Liu ,  Shineng Chen

IPC分类号： H05K7/20 ,  F25B21/02 ,  G02B6/42 ,  H05K5/00

CPC分类号： H05K7/20263 ,  F25B21/02 ,  F25B2321/023 ,  F25B2321/0251 ,  F25B2321/0252 ,  G02B6/42 ,  G02B6/4266 ,  G02B6/4268 ,  G02B6/4271 ,  H05K5/0026 ,  H05K7/20281 ,  H05K7/20336 ,  H05K7/20445 ,  H05K7/2049

摘要： Embodiments of the present invention disclose a heat dissipation assembly including: a cage, a TEC assembly, a mounting kit, an elastic carrier, and a heat pipe, where a window is provided in a side face of the cage, the TEC assembly is located on an outer side of the cage, and a cold side of the TEC assembly passes through the window and thermally communicates with the heat emitting device in the cage; the mounting kit is configured to mount the TEC assembly and enable the TEC assembly to move in a direction leaving or approaching the heat emitting device; and a heat absorption portion of the heat pipe is mounted on the elastic carrier, and the heat absorption portion that is of the heat pipe and that is mounted on the elastic carrier thermally communicates with a hot side of the TEC assembly.

公开(公告)号：US20180110266A1

公开(公告)日：2018-04-26

申请号：US15786879

申请日：2017-10-18

申请人： NIKE, Inc.

发明人： HOONJOO LEE ,  MATTHEW D. NORDSTROM

IPC分类号： A41D13/005

CPC分类号： A41D13/005 ,  A41D1/002 ,  A41D1/005 ,  A41D13/0025 ,  A41D27/28 ,  A45F5/02 ,  A61B5/6804 ,  F25B21/02 ,  F25B21/04 ,  G08B21/0453 ,  H01L35/30

摘要： Aspects herein are directed to an apparel thermo-regulatory system that actively heats or cools a wearer. The apparel thermo-regulatory system comprises an apparel item, a dimensionally stable frame comprising at least one aperture that is affixed to an outer-facing surface of the apparel item at a predetermined location, an absorbent material applied to an exposed face of the dimensionally stable frame, and at least one thermoelectric module that is releasably positioned within the aperture of the dimensionally stable frame.

公开(公告)号：US09943931B2

公开(公告)日：2018-04-17

申请号：US15221102

申请日：2016-07-27

申请人： Intel Corporation

发明人： Zhihua Li ,  Hemanth K. Dhavaleswarapu ,  Joseph B. Petrini ,  Shankar Devasenathipathy ,  Steven B. Roach ,  Ioan Sauciuc ,  Pranav K. Desai ,  George S. Kostiew ,  Sanjoy K. Saha

IPC分类号： B23K37/00 ,  B23K3/08 ,  H01L23/00 ,  H05K3/34 ,  B23K20/02 ,  F25B21/02

CPC分类号： B23K37/003 ,  B23K3/085 ,  B23K20/023 ,  F25B21/02 ,  F25B2321/0251 ,  H01L24/13 ,  H01L24/29 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/131 ,  H01L2224/291 ,  H01L2224/75252 ,  H01L2224/75301 ,  H01L2224/75502 ,  H01L2224/81203 ,  H01L2224/83203 ,  H05K3/34 ,  H01L2924/014

摘要： Various embodiments of thermal compression bonding transient cooling solutions are described. Those embodiments include a an array of vertically separated micro channels coupled to a heater surface, wherein every outlet micro channel comprises two adjacent inlet micro channel, and wherein an inlet and outlet manifold are coupled to the array of micro channels, and wherein the heater surface and the micro channels are coupled within the same block.

公开(公告)号：US20180081262A1

公开(公告)日：2018-03-22

申请号：US15564104

申请日：2016-04-07

申请人： SEIKO EPSON CORPORATION

发明人： Kentaro NAKAMURA ,  Kaname NAGATANI

IPC分类号： G03B21/16 ,  F25B21/04 ,  F28D7/00 ,  F28F9/26 ,  G03B21/14

CPC分类号： G03B21/16 ,  F25B21/02 ,  F25B21/04 ,  F25D17/02 ,  F25D17/06 ,  F28D7/0066 ,  F28F9/26 ,  G03B21/00 ,  G03B21/006 ,  G03B21/145 ,  H04N5/74 ,  H05K7/20

摘要： A projector includes a first circulation channel formed in a sealed space and where a first fluid for cooling a cooling target arranged within the sealed space circulates, a second circulation channel where a second fluid to which heat is conducted from the first fluid circulates, and a third circulation channel where a third fluid to which heat is conducted from the second fluid circulates and where the heat conducted to the third fluid is radiated in a process of circulation of the third fluid. The first fluid is gas. The second fluid and the third fluid are liquid.

公开(公告)号：US20180066887A1

公开(公告)日：2018-03-08

申请号：US15811493

申请日：2017-11-13

申请人： BEDFORD SYSTEMS LLC

发明人： Steven MacKey ,  Pranav Chopra ,  Scott Grubb ,  Thomas Fedorka ,  Qian Gao ,  Jeremy B. Gordon

IPC分类号： F25D31/00 ,  A47J31/54 ,  A47J31/40 ,  F28F1/14

CPC分类号： F25D31/006 ,  A47J31/407 ,  A47J31/54 ,  F25B21/02 ,  F25B23/006 ,  F25B2321/025 ,  F28D1/06 ,  F28F1/14

摘要： A beverage making machine having a tank may be arranged to carbonate and/or chill liquid in the tank. A thermoelectric device may be thermally coupled to the tank to cool precursor liquid in the tank, and a heat pipe may transfer heat from the thermoelectric device to a heat sink. The heat sink may be located remotely from the thermoelectric device, e.g., in an air duct that helps prevent contact of moisture, dirt, etc. in the duct with the thermoelectric device.

公开(公告)号：US20180046234A1

公开(公告)日：2018-02-15

申请号：US15668921

申请日：2017-08-04

申请人： Prepared for Flight LLC

发明人： Edward Wyrwas

IPC分类号： G06F1/20 ,  F25B21/02

CPC分类号： G06F1/206 ,  F25B21/02 ,  G06F1/20 ,  G06F2200/201

摘要： A thermal transfer system includes an enclosure, optional thermal insulation inside the enclosure, a dielectric fluid inside the enclosure, and a porous medium inside the enclosure. The porous medium can be at least partially immersed in the dielectric fluid. A cooling device can have a first surface contacting an interior surface of the enclosure and a second surface contacting the dielectric fluid, the porous medium, or both. The porous medium can include a cutout or cavity configured to support an electrical or electronic device immersed in the dielectric fluid. A port can be in a wall of the enclosure and a set of electrical conductors can run through the port and the electrical or electronic device immersed in the dielectric fluid.

公开(公告)号：US09885502B2

公开(公告)日：2018-02-06

申请号：US14535770

申请日：2014-11-07

申请人： The Aerospace Corporation

发明人： Sidney W. K. Yuan ,  Tung T. Lam

IPC分类号： F25B21/02 ,  F25B21/04 ,  F25B40/00 ,  H01L35/32 ,  F28F13/00

CPC分类号： F25B21/04 ,  F25B21/02 ,  F28F2013/008 ,  H01L35/32

摘要： Various embodiments are directed to a thermoelectric device comprising a thermoelectric element, a first heat switch and a second heat switch. The thermoelectric element may comprise a first component in electrical contact with a second component at an interface. The first component may comprise a first material and the second component may comprise a second material different from the first material. The first heat switch may comprise a first terminal in thermal contact with the interface and a second terminal in thermal contact with a thermal reservoir. The second heat switch may comprise a first terminal in thermal contact with the interface and a second terminal in thermal contact with a thermal load.

公开(公告)号：US20180023864A1

公开(公告)日：2018-01-25

申请号：US15536567

申请日：2015-09-28

申请人： Qingdao Haier Joint Stock Co., Ltd.

发明人： Haibo TAO ,  Dong YU ,  Peng LI ,  Jianru LIU ,  Dingyuan WANG ,  Chunyang LI ,  Feifei QI ,  Lisheng JI

IPC分类号： F25B21/02 ,  F25D16/00 ,  F25D23/06

CPC分类号： F25B21/02 ,  F25B2321/0252 ,  F25D16/00 ,  F25D19/00 ,  F25D23/006 ,  F25D23/066 ,  F28D15/0233 ,  F28F9/0132

摘要： The present invention provides a bent pipe for a fluid to flow therein, which comprises: a plurality of bent portions; a plurality of connecting pipe sections, each connecting two adjacent bent portions; and a retention member, which is successively fixed at different locations along the length thereof to the bent portions on the same side of the bent pipe. In addition, the present invention further provides a semiconductor refrigerator having the bent pipe. Since the bent pipe and the semiconductor refrigerator of the present invention have a retention member, at least some of the pipe sections of the bent pipe can be kept in the bent shape such that the bending angle of the bent pipe is kept constant and thus the refrigerant in the semiconductor refrigerator can flow reliably in the bent pipe and can be effectively evaporated or condensed.