利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

1248 条记录 (耗时 0.022 秒)

    Method for pre-heating probe card
    41.
    发明授权
    Method for pre-heating probe card 有权
    探针卡预热方法

    公开(公告)号：US09519022B2

    公开(公告)日：2016-12-13

    申请号：US14680718

    申请日：2015-04-07

    申请人： TOKYO ELECTRON LIMITED

    发明人： Hiroshi Yamada ,  Takaaki Hoshino ,  Shinji Kojima ,  Takeshi Saigusa ,  Hiroshi Shimoyama

    IPC分类号： G01R31/28

    CPC分类号： G01R31/2887 ,  G01R31/2891 ,  G01R31/2893

    摘要： A wafer inspection apparatus includes a first and second wafer transfer mechanisms, an alignment chamber, a second wafer transfer mechanism and a plurality of inspection chambers. The first wafer transfer mechanism is installed at a first transfer area to transfer wafers individually from a housing. The alignment chamber has an alignment mechanism configured to align the wafer at an inspection position for an electrical characteristics inspection. The second wafer transfer mechanism is configured to transfer the wafer through a wafer retaining support in a second transfer area formed along the first transfer area and an alignment area. The plurality of inspection chambers is arranged at an inspection area formed along the second transfer area and is configured to inspect electrical characteristics of the wafer transferred by the second wafer transfer mechanism through the wafer retaining support.

    摘要翻译： 晶片检查装置包括第一和第二晶片传送机构，对准室，第二晶片传送机构和多个检查室。 第一晶片传送机构安装在第一传送区域以分别从外壳传送晶片。 对准室具有对准机构，其配置成将晶片对准用于电特性检查的检查位置。 第二晶片传送机构被配置为将晶片通过晶片保持支撑件传送在沿着第一传送区域形成的第二传送区域和对准区域中。 多个检查室被布置在沿着第二传送区域形成的检查区域，并且被配置为检查由第二晶片传送机构通过晶片保持支撑件传送的晶片的电特性。

    IC HANDLER
    42.
    发明申请
    IC HANDLER 审中-公开
    IC手柄

    公开(公告)号：US20160356843A1

    公开(公告)日：2016-12-08

    申请号：US15101386

    申请日：2013-12-03

    申请人： HAPPYJAPAN, INC.

    发明人： Shouhei Matsumoto ,  Mitsuo Koizumi ,  Fumiaki Togashi ,  Satoshi Ueno ,  Keitaro Harada ,  Masayoshi Yokoo

    IPC分类号： G01R31/28

    CPC分类号： G01R31/2891 ,  G01R31/2887 ,  G01R31/2893 ,  G01R31/308

    摘要： An IC handler (4) of the present invention transfers an IC device (D) to a test head (2). The test head (2) is provided with a socket (3), which has a placing surface (3a) having the IC device (D) placed thereon, and which attaches the IC device (D) placed on the placing surface (3a) to the test head (2). The IC handler (4) is provided with a non-contact displacement meter (71) that is disposed by being spaced apart from the socket (3) in the direction perpendicular to the placing surface (3a). The non-contact displacement meter (71) measures a distance from the non-contact displacement meter (71) to the IC device (D) placed on the placing surface (3a) by emitting a laser beam toward the placing surface (3a) of the socket (3).

    摘要翻译： 本发明的IC处理器（4）将IC器件（D）传送到测试头（2）。 测试头（2）设置有插座（3），其具有放置有IC器件（D）的放置面（3a），并且将放置在放置面（3a）上的IC器件（D） 到测试头（2）。 IC处理器（4）设置有非接触式位移计（71），该非接触位移计（71）通过在垂直于放置表面（3a）的方向上与插座（3）间隔开来设置。 非接触式位移计（71）通过向激光束朝向放置面（3a）的放置面（3a）发射激光，测量从非接触位移计（71）到放置在放置面（3a）上的IC器件（D）的距离 插座（3）。

    Electrical contactor and contact method for the same
    44.
    发明授权
    Electrical contactor and contact method for the same 有权
    电气接触器和接触方法相同

    公开(公告)号：US09435854B2

    公开(公告)日：2016-09-06

    申请号：US13914952

    申请日：2013-06-11

    申请人： Kabushiki Kaisha Nihon Micronics

    发明人： Mika Nasu ,  Akihiro Karouji ,  Takayuki Hayashizaki

    IPC分类号： G01R31/02 ,  G01R31/28 ,  G01R1/067

    CPC分类号： G01R31/2889 ,  G01R1/067 ,  G01R1/06727 ,  G01R31/2891

    摘要： An electrical contactor has a contact portion that is pressed onto a terminal of an electronic device and is electrically connected. When the dimension of the contact portion is S1, the contact dimension of the contact portion and the terminal of the electronic device is V, the amount of sliding of the contact portion is W, and the additional element including at least positional accuracy of the contact portion is X, the dimension of the contact portion S1 satisfies S1>V+W+X. In a contact method for the electrical contactor, when the sum of a clearance on the front end side in the sliding direction in starting contact and a clearance on the back end side in the sliding direction in ending contact is X3, the crushed area S2 of the terminal is set to satisfy a relationship of S2

    摘要翻译： 电接触器具有被按压到电子设备的端子上并被电连接的接触部分。 当接触部分的尺寸为S1时，接触部分和电子设备的端子的接触尺寸为V，接触部分的滑动量为W，并且附加元件至少包括接触位置精度 部分为X，接触部分S1的尺寸满足S1> V + W + X。 在电接触器的接触方法中，当起动接触中的滑动方向上的前端侧的间隙与终止接触时的滑动方向的后端侧的间隙的和为X3时，破碎面积S2 终端被设定为满足S2

    DEVICE TEST METHOD
    47.
    发明申请
    DEVICE TEST METHOD 有权
    器件测试方法

    公开(公告)号：US20160209465A1

    公开(公告)日：2016-07-21

    申请号：US14915171

    申请日：2014-08-01

    申请人： TOKYO ELECTRON LIMITED

    发明人： Masataka HATTA ,  Kazunari ISHII

    IPC分类号： G01R31/28 ,  G01R1/073

    CPC分类号： G01R31/2891 ,  G01R1/07307 ,  G01R1/44 ,  G05B19/234

    摘要： A device test method performed in a substrate test apparatus which includes a mounting table for mounting thereon a substrate on which a device having an electrode is formed, the mounting table being movable by a X-direction motor and a Y-direction motor, and a probe card arranged to face the mounting table. A measuring electrode is arranged to correspond to the electrode of the device, the probe card has a probe that is engageable with the measuring electrode, and the X-direction motor or Y-direction motor generates torque to keep the mounting table from moving when measuring an electrical characteristic of the device. In the device test method, after the probe is engaged with the measuring electrode, when measuring an electrical characteristic of the device, the maximum value of the torque generated by the X-direction motor or Y-direction motor is limited to a predetermined value or less.

    摘要翻译： 一种在基板测试装置中执行的器件测试方法，该测试装置包括：安装台，用于安装其上形成有具有电极的器件的基板，所述安装台可通过X方向马达和Y方向马达移动， 探针卡布置成面对安装台。 测量电极被设置为对应于装置的电极，探针卡具有可与测量电极接合的探针，并且X方向马达或Y方向马达产生扭矩以在测量时保持安装台不移动 该设备的电气特性。 在器件测试方法中，在探头接合测量电极之后，当测量器件的电气特性时，由X方向电动机或Y方向电动机产生的转矩的最大值被限制在预定值或 减。

    SEMICONDUCTOR CHIP TESTING APPARATUS
    50.
    发明申请
    SEMICONDUCTOR CHIP TESTING APPARATUS 有权
    半导体芯片测试设备

    公开(公告)号：US20160154023A1

    公开(公告)日：2016-06-02

    申请号：US14687141

    申请日：2015-04-15

    申请人： Amkor Technology Korea, Inc.

    发明人： Duk-Soon CHOI ,  In-Seol HWANG ,  Woo-Yoel JEONG ,  Seong-Han PARK ,  In-Seob KWON ,  Dong-Shin KIM

    IPC分类号： G01R1/04 ,  G01R31/28

    CPC分类号： G01R1/0466 ,  G01R31/2891

    摘要： A semiconductor chip testing apparatus is disclosed. The semiconductor chip testing apparatus includes: an upper socket unit which is formed therein with a receiving space receiving an upper semiconductor chip, holds a lower semiconductor chip using a suction airflow passing around the upper semiconductor chip in the receiving space, and electrically connects the lower semiconductor chip to the upper semiconductor chip; a blade block coupled to the upper socket unit to deliver a vacuum pressure for generating the suction airflow in the receiving space; and a lower socket unit on which the lower semiconductor chip held by the upper socket unit is seated, and which is electrically connected to the seated lower semiconductor chip.

    摘要翻译： 公开了一种半导体芯片测试装置。 半导体芯片测试装置包括：上插座单元，其中形成有容纳上半导体芯片的接收空间，使用在接收空间中穿过上半导体芯片的吸入气流保持下半导体芯片，并且将下部半导体芯片电连接 半导体芯片到上半导体芯片; 叶片块，其联接到所述上插座单元以递送用于在所述接收空间中产生吸入气流的真空压力; 以及下插座单元，其上由上插座单元保持的下半导体芯片就座在其上，并且电连接到就座的下半导体芯片。