公开(公告)号：US06982876B1

公开(公告)日：2006-01-03

申请号：US10070742

申请日：2000-09-13

Applicant: George Young

Inventor： George Young

IPC: H05K7/20

CPC classification number: H05K1/0203 ,  H01L2924/0002 ,  H05K1/0206 ,  H05K1/141 ,  H05K1/165 ,  H05K1/182 ,  H05K3/368 ,  H05K2201/086 ,  H05K2201/09063 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/10333 ,  H05K2201/10515 ,  H05K2201/10545 ,  H01L2924/00

Abstract: A PCB assembly (1) in this case a DC-DC converter comprising a single layer board (2), mounts power semi-conductor devices forming high heat generating components (3) and various cores of magnetic material forming heat dissipating components (4). Tracks of heat conductive coupling material (6) lie above or below each heat generating component (3) and project into one of the heat dissipating components (4) and beside the others. In one embodiment, the heat generating components (3) are housed within a heat dissipating component (3). In another PCB assembly, there is an additional plug-in PCB which may itself carry heat generating components (3) or only heat dissipating components (4). In the latter case, the heat generating components (3) are mounted on the PCB assembly below the additional plug-in PCB.

Abstract translation: 在这种情况下，PCB组件（1）是包括单层板（2）的DC-DC转换器，安装形成高发热部件（3）的功率半导体器件和形成散热部件（4）的各种磁性材料芯， 。 导热耦合材料（6）的轨道位于每个发热部件（3）的上方或下方，并且投射到其中一个散热部件（4）中。 在一个实施例中，发热部件（3）容纳在散热部件（3）内。 在另一个PCB组件中，还有一个额外的插入式PCB，其本身可以携带发热部件（3）或仅散热部件（4）。 在后一种情况下，发热部件（3）安装在附加插入式PCB下面的PCB组件上。

公开(公告)号：US06881906B2

公开(公告)日：2005-04-19

申请号：US10477201

申请日：2002-05-08

Applicant: Dietmar Birgel ,  Karl-Peter Hauptvogel ,  Wolfgang Brutschin ,  Alexander Müller

Inventor： Dietmar Birgel ,  Karl-Peter Hauptvogel ,  Wolfgang Brutschin ,  Alexander Müller

IPC: H01R9/16 ,  H01R12/57 ,  H01R43/02 ,  H05K1/11 ,  H05K1/18 ,  H05K3/32 ,  H05K3/34 ,  H01R12/04

CPC classification number: H01R12/57 ,  H01R9/16 ,  H01R43/0256 ,  H05K1/183 ,  H05K3/3405 ,  H05K2201/09036 ,  H05K2201/10333

Abstract: A circuit board with a contact sleeve mounted thereon. The contact sleeve is electrically connectable in the manner used for an SMD-component. An upper side of the circuit board has a recess and a metallizing bordering the recess, the metallizing being connected to a conductor path extending on the circuit board, and, set in the recess, a contact sleeve, which is both mechanically secured and electrically connected to the metallizing by means of a solder connection.

Abstract translation: 具有安装在其上的接触套筒的电路板。 接触套筒可以用于SMD组件的方式电连接。 电路板的上侧具有与凹部接合的凹部和金属化，金属化连接到在电路板上延伸的导体路径，并且在凹部中设置接触套筒，该接触套筒机械地固定和电连接 通过焊接连接到金属化。

公开(公告)号：US06790056B2

公开(公告)日：2004-09-14

申请号：US10393434

申请日：2003-03-20

Applicant: Charles J. Buondelmonte ,  Joseph P. Mendelsohn ,  Richard William Brown ,  Min Li ,  Richard Franklin Schwartz ,  Sanjay S. Upasani

Inventor： Charles J. Buondelmonte ,  Joseph P. Mendelsohn ,  Richard William Brown ,  Min Li ,  Richard Franklin Schwartz ,  Sanjay S. Upasani

IPC: H01R1200

CPC classification number: H05K3/368 ,  B23K2101/42 ,  H01R12/523 ,  H05K3/3447 ,  H05K2201/10303 ,  H05K2201/10333 ,  H05K2201/10871 ,  H05K2201/10962 ,  H05K2203/0415 ,  Y10T29/53174

Abstract: A method for providing a mechanical/electrical interconnection between two circuit boards, and the interconnection components required therefore, include a pin and socket each having a tail portion, a shoulder portion and a head portion. The tail portion of the pin is sized so as to fit into a plated through hole of the first board, the head portion is sized so as to allow an automated device to capture the head portion and to rest on top of the plated through hole when inserted therein, and the shoulder portion is sized in relation to the plated through hole so as to rest inside the plated through hole and to allow a predetermined amount of solder to flow under the head portion and down into the plated through hole, but not as far down as the tail portion, thereby assisting in centering the pin in the through hole. Upon heating to a solder reflow temperature, a ring of solder, around the periphery of the head portion of the pin and the shoulder portion of the socket, flows under the head of the pin and the shoulder of the socket, thereby forming a soldered electrical connection between the pin and the first board, and the socket and the second board. By aligning the pin with the socket and inserting the tail portion of the pin into the cavity of the socket, a separable reliable mechanical and electrical interconnection is formed between the first board and the second board.

Abstract translation: 一种用于在两个电路板之间提供机械/电气互连的方法以及因此需要的互连部件包括每个具有尾部，肩部和头部的销和插座。 销的尾部的尺寸设计成适合于第一板的电镀通孔中，头部的尺寸被设计成允许自动装置捕获头部并且搁置在电镀通孔的顶部上，当 插入其中，并且肩部的尺寸相对于电镀通孔的尺寸，以便放置在电镀通孔内，并允许预定量的焊料在头部下方流动并进入电镀通孔，而不是如 远离尾部，从而有助于将销定位在通孔中。 在加热到回流焊温度时，围绕销的头部周边和插座的肩部的焊料环在插头的头部和插座的肩部下方流动，从而形成焊接的电气 引脚与第一板，插座和第二板之间的连接。 通过将销与插座对准并将销的尾部插入插座的空腔中，在第一板和第二板之间形成可分离的可靠的机械和电气互连。

公开(公告)号：US20040140123A1

公开(公告)日：2004-07-22

申请号：US10477201

申请日：2003-11-17

Inventor： Dietmar Birgel ,  Karl-Peter Hauptvogel ,  Wolfgang Brutschin ,  Alexander Muller

IPC: H05K001/11 ,  H01R012/04

CPC classification number: H01R12/57 ,  H01R9/16 ,  H01R43/0256 ,  H05K1/183 ,  H05K3/3405 ,  H05K2201/09036 ,  H05K2201/10333

Abstract: A circuit board (15) with a contact sleeve (17) mounted thereon. The contact sleeve (17) is electrically connectable in the manner used for an SMD-component. An upper side of the circuit board (15) has a recess (23) and a metallizing (25, 26) bordering the recess (23), the metallizing (25, 26) being connected to a conductor path (27) extending on the circuit board (15), and, set in the recess (23), a contact sleeve (17), which is both mechanically secured and electrically connected to the metallizing (25) by means of a solder connection (29).

Abstract translation: 具有安装在其上的接触套筒（17）的电路板（15）。 接触套筒（17）可以用于SMD组件的方式电连接。 所述电路板（15）的上侧具有与所述凹部（23）接壤的凹部（23）和金属化（25,26），所述金属化（25,26）连接到在所述导体路径（27）上延伸的导体路径 电路板（15），并且设置在凹部（23）中的接触套筒（17），其通过焊接连接（29）机械地固定并电连接到金属化部分（25）。

公开(公告)号：US06326560B1

公开(公告)日：2001-12-04

申请号：US09366812

申请日：1999-08-04

Applicant: Sheng-Ji Liao

Inventor： Sheng-Ji Liao

IPC: H01R909

CPC classification number: H01R12/526 ,  H05K1/112 ,  H05K1/141 ,  H05K3/368 ,  H05K7/1084 ,  H05K2201/049 ,  H05K2201/09472 ,  H05K2201/10333 ,  H05K2201/10734 ,  H05K2203/0455

Abstract: An adapter is provided for mounting a ball grid array device on a pin-type integrated circuit socket, and includes a base plate and an interfacing plate. The base plate has a device mounting side formed with a plurality of solder pads thereon. The solder pads correspond to and are adapted for surface mounting of solder balls of the ball grid array device thereon. The base plate is further formed with a plurality of upper through holes, each of which corresponds to one of the solder pads. The interfacing plate is formed with a plurality of lower through holes that correspond respectively with the upper through holes. The interfacing plate further has a socket confronting side with a plurality of insert pins depending therefrom. The insert pins correspond to and are adapted for insertion into pin holes in the integrated circuit socket in order to establish electrical contact with board mounting pins that are disposed in the pin holes. Electrical conductors are provided on the base plate and the interfacing plate for connecting electrically and respectively the solder pads and the insert pins via the upper and lower through holes.

Abstract translation: 提供了一种适配器，用于将球栅阵列装置安装在针式集成电路插座上，并且包括基板和接口板。 基板具有在其上形成有多个焊盘的器件安装侧。 焊盘对应于并适用于其上的球栅阵列器件的焊球的表面安装。 基板还形成有多个上通孔，每个上通孔对应于焊盘之一。 接口板形成有分别对应于上通孔的多个下通孔。 接口板还具有一个与其相对的多个插入销的面对面的插座。 插入销对应于并适于插入到集成电路插座中的针孔中，以便与设置在销孔中的板安装销建立电接触。 电导体设置在基板和接口板上，用于经由上和下通孔电连接和分别焊接焊盘和插入销。

公开(公告)号：US6144559A

公开(公告)日：2000-11-07

申请号：US288343

申请日：1999-04-08

Applicant: Kenneth W Johnson ,  Thomas J Zamborelli ,  Larry Bartosch

Inventor： Kenneth W Johnson ,  Thomas J Zamborelli ,  Larry Bartosch

IPC: H01R31/06 ,  G01R1/04 ,  H01L23/32 ,  H01R43/00 ,  H05K1/02 ,  H05K3/34 ,  H05K1/18

CPC classification number: H05K1/0246 ,  G01R1/0416 ,  H05K3/3447 ,  H05K1/023 ,  H05K2201/10022 ,  H05K2201/10333 ,  H05K2201/10515 ,  H05K2201/10636 ,  H05K2201/10734 ,  H05K2203/0415 ,  Y02P70/611

Abstract: Disclosed is a process to manufacture an interposer which includes an interposer socket assembly to use in probing dense pad arrays that minimizes the associated extraneous pin loading and cross-talk caused by a probe tip. The process comprises the steps of: mounting a number of resistors onto a number of predetermined positions in a pad array on an interposer board; inserting a number of interposer pins of a pin socket into the pads of the pad array on the interposer board, wherein the ends of the interposer pins protrude through the interposer board; placing a solder preform around the ends of the interposer pins; and, heating the solder preforms in a solder re-flow oven to solder the interposer pins to the respective pads of the pad array.

Abstract translation: 公开了一种制造插入器的方法，其中包括插入器插座组件，用于探测密集衬垫阵列，其最小化由探针尖端引起的相关的外部引脚负载和串扰。 该过程包括以下步骤：将多个电阻器安装在插入板上的焊盘阵列中的多个预定位置上; 将插座的多个插入针插入到插入器板上的焊盘阵列的焊盘中，其中插入器引脚的端部突出穿过插入器板; 将焊料预制件放置在插入件销的端部周围; 并且在焊料回流炉中加热焊料预成型件以将插入件引脚焊接到焊盘阵列的各个焊盘。

公开(公告)号：US6086383A

公开(公告)日：2000-07-11

申请号：US103971

申请日：1998-06-24

Applicant: Benjamin V. Fasano ,  Kevin M. Prettyman

Inventor： Benjamin V. Fasano ,  Kevin M. Prettyman

IPC: H01R12/57 ,  H01R24/50 ,  H01R43/00 ,  H05K1/02 ,  H05K1/14 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H01R12/00

CPC classification number: H01R24/50 ,  H01R12/57 ,  H05K1/0243 ,  H01L2924/0002 ,  H01R2103/00 ,  H05K1/0237 ,  H05K2201/09809 ,  H05K2201/10325 ,  H05K2201/10333 ,  H05K2201/10378 ,  H05K2201/10962 ,  H05K3/325 ,  H05K3/341 ,  H05K3/4015 ,  Y10T29/49123 ,  Y10T29/49147

Abstract: A surface mounted electronic interconnect device. The device includes a coaxial electrical pad comprising a plurality of conductive surfaces on a substrate corresponding to the conductor arrangement of a coaxial connector; and, a coaxial connector comprising a dielectric material having a center opening and isolated electrically conductive interior and exterior surfaces that are planar with the ends of the connector. The dielectric separates the inner conductive surface from the outer conductive surface and is tubularly shaped having an inner wall for the electrically conductive interior surface. The coaxial connector inner and outer conductors may alternatively be comprised of microsprings. The coaxial connector has first and second ends, the first end for attachment to an electronic package and the second end for pluggable attachment to a PC board. A socket for mating with the coaxial connector second end is demonstrated, comprising a body and inner and outer conductors and configured so as to contact the interior and exterior surfaces of the coaxial connector at different times. The inner conductor of the socket is adapted to be received within the electrically conductive interior surface of the coaxial connector.

Abstract translation: 表面安装的电子互连器件。 该装置包括：同轴电焊盘，其包括在与同轴连接器的导体布置相对应的衬底上的多个导电表面; 以及包括电介质材料的同轴连接器，所述电介质材料具有与所述连接器的端部平坦的中心开口和隔离的导电内部和外部表面。 电介质将内部导电表面与外部导电表面分离，并且管状地形成有用于导电内表面的内壁。 同轴连接器内外导体也可以由微弹簧构成。 同轴连接器具有第一端和第二端，用于附接到电子封装的第一端和用于可插拔连接到PC板的第二端。 示出了用于与同轴连接器第二端配合的插座，包括主体和内部和外部导体，并且构造成在不同时间接触同轴连接器的内部和外部表面。 插座的内导体适于被容纳在同轴连接器的导电内表面内。

公开(公告)号：US5940966A

公开(公告)日：1999-08-24

申请号：US953546

申请日：1997-10-21

Applicant: Benjamin V. Fasano ,  Kevin M. Prettyman

Inventor： Benjamin V. Fasano ,  Kevin M. Prettyman

IPC: H01R12/57 ,  H01R24/50 ,  H01R43/00 ,  H05K1/02 ,  H05K1/14 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H01B13/20

CPC classification number: H01R24/50 ,  H01R12/57 ,  H05K1/0243 ,  H01L2924/0002 ,  H01R2103/00 ,  H05K1/0237 ,  H05K2201/09809 ,  H05K2201/10325 ,  H05K2201/10333 ,  H05K2201/10378 ,  H05K2201/10962 ,  H05K3/325 ,  H05K3/341 ,  H05K3/4015 ,  Y10T29/49123 ,  Y10T29/49147

Abstract: An electronic interconnect device and methods of making the device. The device comprises a coaxial connector comprising a dielectric material having a center opening and isolated electrically conductive interior and exterior surfaces. The coaxial connector having first and second ends, the first end for attachment to an electronic package and the second end for pluggable attachment to a PC board.

Abstract translation: 一种电子互连装置及其制造方法。 该装置包括同轴连接器，其包括具有中心开口和隔离的导电内部和外部表面的电介质材料。 该同轴连接器具有第一端和第二端，用于附接到电子封装的第一端和用于可插拔连接到PC板的第二端。

公开(公告)号：US5309327A

公开(公告)日：1994-05-03

申请号：US983222

申请日：1992-11-30

Applicant: Cody Z. Slater

Inventor： Cody Z. Slater

IPC: H05K1/00 ,  H05K3/30 ,  H05K7/08 ,  G11C11/00

CPC classification number: H05K7/08 ,  H05K1/0287 ,  H05K3/306 ,  H05K2201/09827 ,  H05K2201/10333 ,  H05K2201/10393 ,  H05K2201/10863 ,  H05K2203/0173 ,  H05K2203/162

Abstract: A circuit board assembly system for manufacturing a prototype printed circuit board having a matrix formed in it. A base board having a connection matrix that matches the matrix of the printed circuit board is hinged to a frame having tracks for receiving the printed circuit board, so that the printed circuit board is locatable in a fixed position in relation to the printed circuit board with their respective matrices matching. Component leads may be inserted into the connection matrix through the printed circuit board to form a circuit, which may be tested. The base board may be pivoted away from the printed circuit board to allow the leads to be soldered. The printed circuit board may then be removed from the base board. A cover that is latchable onto the printed circuit board may be used to prevent components from being accidentally removed from the printed circuit board.

Abstract translation: 一种用于制造其中形成有矩阵的原型印刷电路板的电路板组装系统。 具有与印刷电路板的矩阵匹配的连接矩阵的基板铰接到具有用于接收印刷电路板的轨道的框架，使得印刷电路板可相对于印刷电路板定位在固定位置， 它们各自的矩阵匹配。 组件引线可以通过印刷电路板插入到连接矩阵中，以形成可以被测试的电路。 基板可以从印刷电路板枢转以允许引线被焊接。 然后可以将印刷电路板从基板上移除。 可以将可锁定在印刷电路板上的盖子用于防止组件被意外地从印刷电路板上移除。

公开(公告)号：US4736266A

公开(公告)日：1988-04-05

申请号：US737077

申请日：1985-05-23

Applicant: Norio Tanibe

Inventor： Norio Tanibe

IPC: H04M1/02 ,  H05K1/02 ,  H05K1/14 ,  H05K1/18 ,  H05K3/30 ,  H05K3/36 ,  H05K3/46 ,  H05K7/10 ,  H05K7/14 ,  H05K9/00 ,  H05K1/11

CPC classification number: H04M1/0277 ,  H01R12/58 ,  H01R12/718 ,  H05K1/141 ,  H05K9/0039 ,  H05K1/0237 ,  H05K2201/0715 ,  H05K2201/10303 ,  H05K2201/10318 ,  H05K2201/10333 ,  H05K2201/10371 ,  H05K2201/10871 ,  H05K3/308 ,  H05K3/368

Abstract: A printed circuit board comprises a baseboard having conductor patterns therein and ground layers on both surfaces thereof, and terminal pins mounted on the baseboard. The terminal pins have a root portion which does not project from the baseboard and a contact portion which projects from the baseboard. A circuit assembly comprises a mother printed circuit board, such as the above-mentioned printed circuit board, on which circuit modules are mounted. The circuit module has terminal jacks, which are enclosed within a shielded package and into which the terminal pins of the mother printed circuit board are connected by insertion.

Abstract translation: 印刷电路板包括其中具有导体图案的基板和其两个表面上的接地层，以及安装在基板上的端子引脚。 端子销具有不从基板突出的根部部分和从基板突出的接触部分。 电路组件包括诸如上述印刷电路板的母板印刷电路板，其上安装有电路模块。 电路模块具有封装在屏蔽封装内的端子插座，母版印刷电路板的端子引脚通过插入连接到端子插座中。