公开(公告)号：US3384955A

公开(公告)日：1968-05-28

申请号：US40900464

申请日：1964-11-04

Applicant: TRW INC

Inventor： PIERCE GLENN W

IPC: H05K1/18 ,  H05K3/40 ,  H05K7/08

CPC classification number: H05K7/08 ,  H05K1/185 ,  H05K3/4046 ,  H05K2201/10636 ,  H05K2201/10643 ,  H05K2203/1316 ,  H05K2203/1469 ,  Y02P70/611 ,  Y10T29/4913 ,  Y10T29/49812

公开(公告)号：US3142783A

公开(公告)日：1964-07-28

申请号：US86127759

申请日：1959-12-22

Applicant: HUGHES AIRCRAFT CO

Inventor： WARREN WILLIAM B

IPC: H05K1/18 ,  H05K3/40

CPC classification number: H05K1/184 ,  H05K3/4046 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/10636 ,  H05K2201/10643 ,  Y02P70/611 ,  Y10T74/20636

公开(公告)号：US3096466A

公开(公告)日：1963-07-02

申请号：US65522357

申请日：1957-04-26

Applicant: STANDARD COIL PROD CO INC

Inventor： FISHER GOSSARD THOMAS

IPC: H04N5/44 ,  H05K1/03 ,  H05K1/11 ,  H05K1/18 ,  H05K3/32

CPC classification number: H04N5/4446 ,  H05K1/0306 ,  H05K1/119 ,  H05K1/184 ,  H05K3/326 ,  H05K2201/09063 ,  H05K2201/09827 ,  H05K2201/1059 ,  H05K2201/10643 ,  H05K2201/10946

公开(公告)号：US3049647A

公开(公告)日：1962-08-14

申请号：US75829958

申请日：1958-09-02

Applicant: SYLVANIA ELECTRIC PROD

Inventor： LINCOLN MILAN L

IPC: H01G2/04 ,  H05K1/11 ,  H05K1/18 ,  H05K3/32

CPC classification number: H01G2/04 ,  H05K1/119 ,  H05K1/184 ,  H05K3/326 ,  H05K2201/09081 ,  H05K2201/09827 ,  H05K2201/09854 ,  H05K2201/1059 ,  H05K2201/10643

公开(公告)号：US2763119A

公开(公告)日：1956-09-18

申请号：US33135753

申请日：1953-01-15

Applicant: HELFELD ELMER C

Inventor： HELFELD ELMER C

IPC: A01D87/06 ,  H05K3/32

CPC classification number: A01D87/06 ,  H05K3/325 ,  H05K2201/09072 ,  H05K2201/1031 ,  H05K2201/10469 ,  H05K2201/10636 ,  H05K2201/10643 ,  Y02P70/611

公开(公告)号：US11903131B2

公开(公告)日：2024-02-13

申请号：US17643100

申请日：2021-12-07

Applicant: WÜRTH ELEKTRONIK EISOS GMBH & CO. KG

Inventor： Alexander Treml ,  Julia Sanwald ,  Stefan Klingler

IPC: H05K1/18

CPC classification number: H05K1/181 ,  H05K2201/1028 ,  H05K2201/10037 ,  H05K2201/10462 ,  H05K2201/10643

Abstract: The invention relates to a holder for a button cell, wherein the holder is intended to be fastened on a printed circuit board, wherein the holder has at least two first latching arms which protrude from the printed circuit board when the holder is in the mounted state, wherein the button cell is received between the first latching arms when the button cell is in the mounted state, wherein the first latching arms, at one end, are each connected to a main body which has a base area which is connected to the printed circuit board when the holder is in the mounted state, wherein the first latching arms each have at least one first latching lug in order to hold the button cell on the printed circuit board, and wherein the first latching lugs are arranged at a first distance from the base area of the main body.

公开(公告)号：US08759156B2

公开(公告)日：2014-06-24

申请号：US13618280

申请日：2012-09-14

Applicant: Martin Standing

Inventor： Martin Standing

IPC: H01L21/00

CPC classification number: H05K1/185 ,  H01L21/4846 ,  H01L23/3107 ,  H01L23/5389 ,  H01L25/072 ,  H01L25/16 ,  H01L2924/0002 ,  H01L2924/12044 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H05K1/16 ,  H05K3/429 ,  H05K2201/09718 ,  H05K2201/10643 ,  H01L2924/00

Abstract: A method of producing a laminate insert package includes providing a first metal layer, printing a first dielectric layer on the first metal layer, providing a second metal layer, printing a second dielectric layer on the second metal layer, and printing a dielectric spacer layer on the first dielectric layer. At least one semiconductor chip is attached to either the first or the second metal layer. A first layer assembly comprising the first metal layer, the first dielectric layer, the dielectric spacer layer and a second layer assembly comprising the second metal layer and the second dielectric layer are brought together. The first and second layer assemblies are laminated to form a laminate insert package, whereby the at least one semiconductor chip is embedded within the laminate insert package.

Abstract translation: 一种制造叠层嵌件封装的方法包括提供第一金属层，在第一金属层上印刷第一介电层，提供第二金属层，在第二金属层上印刷第二介电层，以及将介质间隔层印刷在 第一介电层。 至少一个半导体芯片附接到第一或第二金属层。 包括第一金属层，第一介电层，电介质间隔层和包括第二金属层和第二介电层的第二层组件的第一层组件被聚集在一起。 第一层和第二层组件被层压以形成层压嵌件封装，由此将至少一个半导体芯片嵌入在层叠插件封装内。

公开(公告)号：US20120079717A1

公开(公告)日：2012-04-05

申请号：US13305196

申请日：2011-11-28

Applicant: Azuma Chikara

Inventor： Azuma Chikara

IPC: H05K3/30

CPC classification number: H05K3/303 ,  H01G2/065 ,  H01G4/06 ,  H01G4/30 ,  H01L23/49822 ,  H01L23/50 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32014 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19106 ,  H01L2924/30105 ,  H05K1/0231 ,  H05K1/162 ,  H05K1/181 ,  H05K1/185 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4644 ,  H05K3/4688 ,  H05K2201/0187 ,  H05K2201/10643 ,  H05K2201/10674 ,  Y10T29/4913 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method of assembling a packaged semiconductor device includes dropping a pre-formed capacitor precursor on a surface of a substrate. A pair of vias are formed in the pre-formed capacitor precursor if they don't already exist. The vias are filled with an electrically conductive material to form a chip capacitor. The filling of the vias provides an electrical contact between capacitor plates of the chip capacitor and electrically conductive contact regions on the substrate.

Abstract translation: 组装封装的半导体器件的方法包括将预先形成的电容器前体放在衬底的表面上。 如果它们不存在，则在预先形成的电容器前体中形成一对通孔。 通孔填充有导电材料以形成片状电容器。 通孔的填充提供了片状电容器的电容器板和衬底上的导电接触区域之间的电接触。

公开(公告)号：US20100083497A1

公开(公告)日：2010-04-08

申请号：US12246200

申请日：2008-10-06

Applicant: David S. SLATON ,  David L. McDonald ,  Shreenath S. Perlaguri

Inventor： David S. SLATON ,  David L. McDonald ,  Shreenath S. Perlaguri

IPC: H01R43/00 ,  H01R4/42

CPC classification number: H01R13/2442 ,  H01M2/1044 ,  H05K1/182 ,  H05K3/301 ,  H05K2201/10037 ,  H05K2201/10325 ,  H05K2201/10454 ,  H05K2201/10643 ,  Y10T29/49108 ,  Y10T29/4913 ,  Y10T29/49153 ,  Y10T29/49174 ,  Y10T29/49176 ,  Y10T29/49204

Abstract: A method for coupling a battery within an embedded system is described. The method includes creating a hole extending through a printed circuit board (PCB), inserting a portion of the battery into the hole, and electrically coupling the battery to at least one contact.

Abstract translation: 描述了一种用于在嵌入式系统内耦合电池的方法。 该方法包括创建延伸穿过印刷电路板（PCB）的孔，将电池的一部分插入到孔中，以及将电池电耦合到至少一个触点。

公开(公告)号：US07378184B2

公开(公告)日：2008-05-27

申请号：US10711534

申请日：2004-09-24

Applicant: Jih-Chen Yeh

Inventor： Jih-Chen Yeh

IPC: H01M2/10

CPC classification number: H01M2/1044 ,  H01R12/57 ,  H05K3/301 ,  H05K3/341 ,  H05K2201/1031 ,  H05K2201/10393 ,  H05K2201/10643 ,  Y02P70/611

Abstract: A battery holder (210) for mounting a button-type battery (200) on a printed circuit board (220) is provided. The battery holder comprises a resilient electrode plate (212), a ring (214) and a battery cap (216). The resilient electrode plate is soldered to positive contacts (222) of the printed circuit board. A positive electrode of the battery is put on and electrically connects with the resilient electrode plate to thereby connect electrically with the positive contacts on the printed circuit board. The ring is soldered to negative contacts (224) of the printed circuit board and surrounds the resilient electrode plate. The battery is accommodated within the ring. The battery cap is fixed and electrically connected to the ring and covers the battery. The battery cap also electrically contacts with a negative electrode (202) on a top of the battery. The negative electrode and positive electrode of the battery are separated by an insulation (206).

Abstract translation: 提供一种用于将按钮式电池（200）安装在印刷电路板（220）上的电池座（210）。 电池座包括弹性电极板（212），环（214）和电池盖（216）。 弹性电极板被焊接到印刷电路板的正触点（222）上。 电池的正极被放置并与弹性电极板电连接，从而与印刷电路板上的正触点电连接。 环被焊接到印刷电路板的负触点（224）并且围绕弹性电极板。 电池容纳在环内。 电池盖固定并电连接到环上并覆盖电池。 电池盖也与电池顶部的负极（202）电接触。 电池的负极和正极通过绝缘体（206）分开。