公开(公告)号：US20030177637A1

公开(公告)日：2003-09-25

申请号：US10106977

申请日：2002-03-25

Inventor： Michael C. Seckora

IPC: H05K003/30 ,  H05K003/34 ,  H05K001/16 ,  H05K013/00

CPC classification number: H05K1/0243 ,  H05K1/0231 ,  H05K3/305 ,  H05K3/3426 ,  H05K2201/09727 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2201/10818 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49169

Abstract: Methods and apparatus provide for electrical coupling of electrical components to traces on a substrate such that impedance mismatches otherwise experienced in high frequency operation are avoided. Connecting elements having length, width, and thickness, are provided for terminals of a component to be connected to a trace. The connecting element is electrically coupled between the terminal and the trace, typically by soldering. The dimensions of the connecting element are chosen to reduce or eliminate the impedance mismatch which would result from a direct connection between the trace and component. Connecting elements are generally L-shaped, i.e., having first and second planar portions perpendicular with respect to each other, and having a curving portion that connects the first and second planar portions. In one embodiment, dimensions of at least a portion of the connecting element are such that its width increases as its distance from a ground plane within the substrate increases.

Abstract translation: 方法和装置提供电气部件与衬底上的迹线的电耦合，使得避免了在高频操作中经历的阻抗失配。 具有长度，宽度和厚度的连接元件被提供给要连接到轨迹的部件的端子。 连接元件通常通过焊接电耦合在端子和迹线之间。 选择连接元件的尺寸以减少或消除由迹线和部件之间的直接连接导致的阻抗失配。 连接元件通常为L形，即具有相对于彼此垂直的第一和第二平面部分，并且具有连接第一和第二平面部分的弯曲部分。 在一个实施例中，连接元件的至少一部分的尺寸使得其宽度随着与衬底内的接地平面的距离的增加而增加。

公开(公告)号：US06426880B1

公开(公告)日：2002-07-30

申请号：US09518284

申请日：2000-03-03

Applicant: Philip H. Chen

Inventor： Philip H. Chen

IPC: H05K332

CPC classification number: H01R4/04 ,  H05K3/321 ,  H05K3/3426 ,  H05K2201/0373 ,  H05K2201/10636 ,  H05K2201/10651 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: Surface mount device packages with increased mounting strength and a method therefor. In one embodiment, an, electronic device is made up of a device package and one or more electrically conductive terminals. For surface mounting, the device terminals are each provided with a mounting surface which is bonded using a conductive adhesive to a corresponding contact pad on a circuit board. The terminals are further provided with at least one groove across the mounting surface. When conductive adhesive is used to mount the device on a circuit board, this groove serves to form the conductive adhesive into a ridge or “dam” over the contact pad. This provides increased mounting strength which may eliminate the need for additional adhesive material to provide side reinforcement of the device, and thereby allow an increase in the packing density of devices on the circuit board.

Abstract translation: 具有更高安装强度的表面贴装器件封装及其方法。 在一个实施例中，电子设备由设备封装和一个或多个导电端子组成。 对于表面安装，器件端子各自设置有使用导电粘合剂粘合到电路板上的相应接触焊盘的安装表面。 端子还设置有跨过安装表面的至少一个凹槽。 当使用导电粘合剂将装置安装在电路板上时，该槽用于将导电粘合剂形成在接触垫上的脊或“阻挡”。 这提供了增加的安装强度，这可以消除额外的粘合剂材料对装置的侧面加强的需要，从而允许电路板上的装置的堆积密度的增加。

公开(公告)号：US06421249B1

公开(公告)日：2002-07-16

申请号：US09690390

申请日：2000-10-18

Applicant: Donald Milton Trombley ,  Robert Ray Voltenburg, Jr. ,  David Brian Houser ,  Paul Dennis Scheller

Inventor： Donald Milton Trombley ,  Robert Ray Voltenburg, Jr. ,  David Brian Houser ,  Paul Dennis Scheller

IPC: H05K710

CPC classification number: F21V19/005 ,  H05K3/303 ,  H05K3/305 ,  H05K3/3421 ,  H05K3/3457 ,  H05K2201/09781 ,  H05K2201/10113 ,  H05K2201/10651 ,  H05K2201/10969 ,  Y02P70/613

Abstract: An electronic device having an enhanced attachment to a surface mount lamp (106) includes a circuit board (100), at least two conductive pads (102), at least two adhesive pads (104), and the surface mount lamp (106). The conductive pads (102) and the adhesive pads (104) are integrally formed within the circuit board (100). Preferably, each section of the circuit board (100) allotted for one surface mount lamp (106) has two conductive pads (102) and two adhesive pads arranged in a grid-like pattern such that similar pads are in opposing corners of the grid. The surface mount lamp (106) has two electrical leads (108), each protruding from opposing corners of a base (110) of the surface mount lamp (106). These electrical leads (108) are soldered to the conductive pads (102) in the circuit board (100). The unobscured opposing corners (112) of the plastic base (110) are partially melted and adhered to the adhesive pads (104) in the circuit board (100).

Abstract translation: 具有与表面安装灯（106）的增强附件的电子设备包括电路板（100），至少两个导电焊盘（102），至少两个粘合垫（104）和表面安装灯（106）。 导电焊盘（102）和粘合垫（104）一体地形成在电路板（100）内。 优选地，为一个表面安装灯（106）分配的电路板（100）的每个部分具有两个导电焊盘（102）和布置成格子状图案的两个粘合垫，使得类似的焊盘位于栅格的相对的角部。 表面安装灯（106）具有两个电引线（108），每个电引线（108）从表面安装灯（106）的基座（110）的相对的角部突出。 这些电引线（108）被焊接到电路板（100）中的导电焊盘（102）。 塑料基座（110）的视野相对的角部（112）被部分熔化并粘附到电路板（100）中的粘合垫（104）上。

公开(公告)号：US6154118A

公开(公告)日：2000-11-28

申请号：US321619

申请日：1999-05-28

Applicant: Satoshi Ishikawa ,  Osamu Soda

Inventor： Satoshi Ishikawa ,  Osamu Soda

IPC: B60R16/02 ,  H01C7/02 ,  H02H9/02 ,  H05K1/02 ,  H05K1/18 ,  H01C7/13

CPC classification number: H01C7/027 ,  H05K1/02 ,  H05K1/18 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/10651

Abstract: A circuit protective device with a positive temperature coefficient element is provided, which includes: a positive temperature coefficient (hereinafter "PTC") element, made of a conductive composition having a PTC characteristics, provided for shutting off an electric circuit; a circuit board having the PTC element and electrodes to be connected with the PTC element; and a slot formed on the circuit board so as to prevent a low resistance conductive passage from being formed between the electrodes, the low resistance conductive passage being made of powder of the conductive composition released from the PTC element. And also an electric junction box with the above circuit protective device is provided. Thus, the circuit protective device or the electric junction box with the circuit protective device wherein a low resistance conductive passage made of a carbonaceous powder to be released from the PTC element is not formed between the electrodes of the PTC element can be realized.

Abstract translation: 提供具有正温度系数元件的电路保护装置，其包括：用于切断电路的具有PTC特性的导电组合物制成的正温度系数（以下称为“PTC”）元件; 具有PTC元件和与PTC元件连接的电极的电路板; 以及形成在电路板上的槽，以防止在电极之间形成低电阻导电通道，低电阻导电通道由从PTC元件释放的导电组合物的粉末制成。 还提供了具有上述电路保护装置的电接线盒。 因此，可以实现具有电路保护装置的电路保护装置或电接线盒，其中在PTC元件的电极之间不形成由PTC元件释放的由碳质粉末制成的低电阻导电通道。

公开(公告)号：US6031318A

公开(公告)日：2000-02-29

申请号：US47854

申请日：1998-03-25

Applicant: Kenji Sunaga ,  Hideo Hoshi ,  Masayoshi Shiraishi ,  Kishirou Nakamura ,  Takashi Konno

Inventor： Kenji Sunaga ,  Hideo Hoshi ,  Masayoshi Shiraishi ,  Kishirou Nakamura ,  Takashi Konno

IPC: H03H9/02 ,  H03H3/02 ,  H03H9/05 ,  H03H9/10 ,  H03H9/19 ,  H05K3/30 ,  H01L41/04

CPC classification number: H03H9/0504 ,  H05K3/303 ,  H05K2201/09781 ,  H05K2201/10075 ,  H05K2201/10462 ,  H05K2201/10583 ,  H05K2201/10606 ,  H05K2201/10651 ,  H05K3/301 ,  Y02P70/613

Abstract: A crystal oscillating device comprises an outer case having a longitudinal axis, a cavity, a pair of first surfaces extending along the longitudinal axis, a pair of second surfaces extending in a direction generally transverse to the longitudinal axis, a first opening portion in one of the first surfaces for providing access into the cavity, a second opening portion in one of the second surfaces, and a groove in the other of the second surfaces. A crystal oscillator is disposed in the cavity of the outer case and has lead terminals extending through the second opening portion of the outer case for electrically connecting the crystal oscillator to a circuit board. A bonding material is disposed in the cavity of the outer case for bonding the crystal oscillator to the outer case. A connecting member is disposed in the groove of the outer case for connecting the outer case to the circuit board.

Abstract translation: 一种晶体振荡装置包括具有纵向轴线的外壳体，腔体，沿着纵向轴线延伸的一对第一表面，沿着大致横向于纵向轴线的方向延伸的一对第二表面， 用于提供进入空腔的第一表面，在第二表面之一中的第二开口部分和另一个第二表面中的凹槽。 晶体振荡器设置在外壳的空腔中，并且具有延伸穿过外壳的第二开口部分的引线端子，用于将晶体振荡器电连接到电路板。 接合材料设置在外壳的空腔中，用于将晶体振荡器接合到外壳。 连接构件设置在外壳的槽中，用于将外壳连接到电路板。

公开(公告)号：US5936593A

公开(公告)日：1999-08-10

申请号：US708401

申请日：1996-09-04

Applicant: Harufumi Mandai ,  Kenji Asakura ,  Teruhisa Tsuru ,  Seiji Kanba

Inventor： Harufumi Mandai ,  Kenji Asakura ,  Teruhisa Tsuru ,  Seiji Kanba

IPC: H01Q1/02 ,  H01Q1/12 ,  H01Q1/27 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q1/40 ,  H01Q9/30 ,  H05K1/18 ,  H05K3/30 ,  H05K3/34

CPC classification number: H01Q1/40 ,  H01Q1/362 ,  H01Q1/38 ,  H05K1/18 ,  H05K2201/10651 ,  H05K2201/10871 ,  H05K3/308 ,  H05K3/3421

Abstract: An antenna apparatus which exhibits excellent mechanical strength and which is protected from heat and moisture, and also which is mountable on a printed wiring board with the provision of a clearance between the apparatus and the board, free from deformation caused by a warp of the board. The antenna apparatus has a rectangular-prism shaped substrate. A feeding terminal and a fixing terminal are disposed at the respective end surfaces in the longitudinal direction of the substrate. Metal strips serving as support terminals are soldered at the respective first ends to the feeding terminal and the fixing terminal, respectively. A coating material formed of a non-metallic material, such as glass, resin or the like, is applied to the surface of the substrate by way of coating, dipping or other method. A coating layer is thus formed on the substrate in a state in which the respective second ends of the metal strips project from the substrate.

Abstract translation: 具有优异的机械强度并且受到热和湿气的保护的天线装置，并且还可以在设备和板之间设置间隙安装在印刷线路板上，不受板的翘曲引起的变形 。 天线装置具有矩形棱柱形基板。 馈电端子和固定端子设置在基板的纵向方向上的相应端面处。 用作支撑端子的金属带分别在相应的第一端处焊接到馈电端子和固定端子。 由诸如玻璃，树脂等的非金属材料形成的涂料通过涂布，浸渍或其它方法施加到基材的表面。 因此，在金属带的各个第二端从基板突出的状态下，在基板上形成涂层。

公开(公告)号：US5901045A

公开(公告)日：1999-05-04

申请号：US812841

申请日：1997-03-06

Applicant: Ernest Bencivenga ,  Ronald P. Fotino

Inventor： Ernest Bencivenga ,  Ronald P. Fotino

IPC: H01H85/20 ,  H01H85/25 ,  H01R4/72 ,  H05K1/02 ,  H05K1/18 ,  H05K3/30 ,  H05K7/02

CPC classification number: H05K1/0256 ,  H01R4/72 ,  H01H85/2045 ,  H01H85/25 ,  H05K1/18 ,  H05K2201/10651 ,  H05K3/301

Abstract: A device for isolating a hazardous connection on a circuit board includes an elongated enclosure having a bore extending therethrough and a slot extending longitudinally from a first end of the enclosure. A component such as a fuse, having leads on both ends, is advanced through the bore until one of the leads, bent orthogonally to the enclosure, becomes secured in a distal end (pocket) of the slot. The length of the enclosure is determined such that when the lead is engaged in the distal end of the slot, a portion of the enclosure extends over the lead to isolate any connections made by that lead from external contact. In a preferred embodiment, a second slot is provided on the other end of the enclosure wherein a second lead may then be bent orthogonally to the device, and parallel with the first lead, to isolate both leads of the component. The protective device is advantageously transparent to allow for monitoring of the component being isolated.

Abstract translation: 用于隔离电路板上的危险连接的装置包括具有延伸穿过其中的孔的细长外壳和从外壳的第一端纵向延伸的槽。 诸如保险丝的部件（在两端具有引线）通过孔前进，直到与壳体垂直弯曲的引线之一固定在槽的远端（凹槽）中。 外壳的长度被确定为使得当引线接合在槽的远端时，外壳的一部分在引线上延伸以将由该引线制成的任何连接与外部接触隔离。 在优选实施例中，第二狭槽设置在外壳的另一端，其中然后可以将第二引线垂直于设备弯曲并与第一引线平行，以隔离部件的两个引线。 保护装置有利地是透明的，以允许监测被隔离的部件。

公开(公告)号：US5842275A

公开(公告)日：1998-12-01

申请号：US524097

申请日：1995-09-05

Applicant: Richard Keith McMillan, II ,  Vivek Amir Jairazbhoy ,  Robert Joseph Gordon ,  George Albert Garfinkel

Inventor： Richard Keith McMillan, II ,  Vivek Amir Jairazbhoy ,  Robert Joseph Gordon ,  George Albert Garfinkel

IPC: H01L21/60 ,  H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K3/34 ,  H05K3/42

CPC classification number: H01L24/81 ,  H05K1/0206 ,  H05K1/113 ,  H05K3/341 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01082 ,  H01L2924/014 ,  H05K1/0272 ,  H05K2201/09036 ,  H05K2201/091 ,  H05K2201/0959 ,  H05K2201/10166 ,  H05K2201/10651 ,  H05K2201/10969 ,  H05K2203/0455 ,  H05K2203/1178 ,  H05K3/0061 ,  H05K3/0094 ,  H05K3/42 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: Method of surface mounting an electronic component to a bonding pad on one side of a supporting insulating board carrying a planar printed circuit thereon, the pad being connected to one or more conductors on the board by use of solder material subject to one or more gas trapping through-hole vias, comprising: (a) creating at least one vent channel below the top plane of the printed circuit and extending from a location at or closely adjacent to one of said vias to a location essentially near a periphery of solder material to be placed thereover; (b) planting a deposit of solder material between the component and pad; (c) bringing the component, solder material and pad together to form an assembly; and (d) heating the assembly to momentarily reflow the solder material in place without shifting, skewing, or tilting of the component, any trapped air in said one vias being allowed to expand and migrate away through the channel to at least the periphery of the pad.

Abstract translation: 将电子部件表面安装在其上承载有平面印刷电路的支撑绝缘板的一侧上的接合焊盘的方法，该焊盘通过使用经受一个或多个气体捕获的焊料材料连接到板上的一个或多个导体 通孔通孔，包括：（a）在印刷电路的顶面下方形成至少一个通气通道，并且从位于或接近其中一个通孔的位置延伸到基本上接近焊料材料周边的位置， 放在其上 （b）在部件和焊盘之间种植焊料的沉积物; （c）使部件，焊料和焊盘一起形成组件; 和（d）加热组件以将焊料材料短暂地回流到位，而不会移动，倾斜或倾斜组件，允许所述一个通孔中的任何被捕获的空气膨胀并通过通道迁移至至少外围 垫。

公开(公告)号：US5696478A

公开(公告)日：1997-12-09

申请号：US680625

申请日：1996-07-17

Applicant: Rene Weiner

Inventor： Rene Weiner

IPC: H01F5/04 ,  H01F27/28 ,  H01F27/29 ,  H01R4/02 ,  H05K3/30 ,  H01F27/30

CPC classification number: H05K3/308 ,  H01F5/04 ,  H01R12/58 ,  H05K2201/10651 ,  H05K2201/10787 ,  H05K2201/1081 ,  H05K2201/10878

Abstract: A soldering pin has a periphery defined by two straight line planar sides, and two arc-shaped sides. The planar sides allow gas to escape, while the arc-shaped sides ensure a solid connection. Fluting is provided on the arc-shaped sides.

Abstract translation: 焊脚具有由两条直线平面侧面和两个弧形侧面限定的周边。 平面侧面允许气体逸出，而弧形侧面确保牢固的连接。 弧形设置在弧形侧。

公开(公告)号：US5576927A

公开(公告)日：1996-11-19

申请号：US550860

申请日：1995-10-31

Applicant: Yoshinori Sekiguchi

Inventor： Yoshinori Sekiguchi

IPC: H01G9/004 ,  H01G9/00 ,  H01G9/012 ,  H01G9/08 ,  H05K3/34 ,  H01G4/228 ,  H01G4/248 ,  H05K5/06

CPC classification number: H01G9/012 ,  H05K3/3426 ,  H05K2201/10651 ,  Y02P70/613

Abstract: A solid electrolytic chip capacitor in which L-shaped portions of the anode terminal and cathode terminal form slanting surfaces which project beyond the projecting side surfaces of the resin sheathing.

Abstract translation: 一种固体电解片电容器，其中阳极端子和阴极端子的L形部分形成倾斜表面，突出超出树脂护套的突出侧表面。