专利检索 ap:("Richard Keith McMillan, II" OR "Vivek Amir Jairazbhoy" OR "Robert Joseph Gordon" OR "George Albert Garfinkel") AND inv:"Robert Joseph Gordon" 第 1 页

1.

发明授权
Reflow soldering to mounting pads with vent channels to avoid skewing 失效
标题翻译：回流焊接到带排气通道的安装垫，以避免歪斜

公开(公告)号：US5842275A

公开(公告)日：1998-12-01

申请号：US524097

申请日：1995-09-05

申请人： Richard Keith McMillan, II , Vivek Amir Jairazbhoy , Robert Joseph Gordon , George Albert Garfinkel

发明人： Richard Keith McMillan, II , Vivek Amir Jairazbhoy , Robert Joseph Gordon , George Albert Garfinkel

IPC分类号： H01L21/60 , H05K1/02 , H05K1/11 , H05K3/00 , H05K3/34 , H05K3/42

CPC分类号： H01L24/81 , H05K1/0206 , H05K1/113 , H05K3/341 , H01L2224/81801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01082 , H01L2924/014 , H05K1/0272 , H05K2201/09036 , H05K2201/091 , H05K2201/0959 , H05K2201/10166 , H05K2201/10651 , H05K2201/10969 , H05K2203/0455 , H05K2203/1178 , H05K3/0061 , H05K3/0094 , H05K3/42 , Y02P70/613 , Y10T29/4913 , Y10T29/49144

摘要： Method of surface mounting an electronic component to a bonding pad on one side of a supporting insulating board carrying a planar printed circuit thereon, the pad being connected to one or more conductors on the board by use of solder material subject to one or more gas trapping through-hole vias, comprising: (a) creating at least one vent channel below the top plane of the printed circuit and extending from a location at or closely adjacent to one of said vias to a location essentially near a periphery of solder material to be placed thereover; (b) planting a deposit of solder material between the component and pad; (c) bringing the component, solder material and pad together to form an assembly; and (d) heating the assembly to momentarily reflow the solder material in place without shifting, skewing, or tilting of the component, any trapped air in said one vias being allowed to expand and migrate away through the channel to at least the periphery of the pad.

摘要翻译： 将电子部件表面安装在其上承载有平面印刷电路的支撑绝缘板的一侧上的接合焊盘的方法，该焊盘通过使用经受一个或多个气体捕获的焊料材料连接到板上的一个或多个导体通孔通孔，包括：（a）在印刷电路的顶面下方形成至少一个通气通道，并且从位于或接近其中一个通孔的位置延伸到基本上接近焊料材料周边的位置，放在其上（b）在部件和焊盘之间种植焊料的沉积物; （c）使部件，焊料和焊盘一起形成组件; 和（d）加热组件以将焊料材料短暂地回流到位，而不会移动，倾斜或倾斜组件，允许所述一个通孔中的任何被捕获的空气膨胀并通过通道迁移至至少外围垫。

2.

发明授权
Method for making an electrical circuit board 失效
标题翻译：制造电路板的方法

公开(公告)号：US06391211B1

公开(公告)日：2002-05-21

申请号：US09655559

申请日：2000-09-06

申请人： Andrew Z. Glovatsky , Robert Joseph Gordon , Vivek Amir Jairazbhoy , Vladimir Stoica

发明人： Andrew Z. Glovatsky , Robert Joseph Gordon , Vivek Amir Jairazbhoy , Vladimir Stoica

IPC分类号： H01B1300

CPC分类号： H05K3/062 , H01L2924/00013 , H05K3/445 , H05K3/4614 , H05K3/4641 , H05K2201/0361 , H05K2201/0379 , H05K2201/09881 , H05K2203/0323 , H01L2224/29099

摘要： A method for making multi-layer electronic circuit board including a pre-circuit assembly 12 and a ground layer 14 which are automatically aligned and bonded together by use of solder material or deposits 26, 28.

摘要翻译： 一种制造多层电子电路板的方法，其包括通过使用焊料或沉积物26,28自动对准并结合在一起的预电路组件12和接地层14。

3.

发明授权
Sensor cover and method of construction thereof 有权
标题翻译：传感器盖及其构造方法

公开(公告)号：US06750819B2

公开(公告)日：2004-06-15

申请号：US10044761

申请日：2002-01-10

申请人： Samuel G. Rahaim , Robert Joseph Gordon , Paul Kirk Zoratti , Timothy Arthur Tiernan , Robert Edward Belke

发明人： Samuel G. Rahaim , Robert Joseph Gordon , Paul Kirk Zoratti , Timothy Arthur Tiernan , Robert Edward Belke

IPC分类号： H01Q138

CPC分类号： H01Q1/405

摘要： A sensor cover is disclosed for camouflaging a high frequency sensor, including for example, a radar sensor. The sensor cover includes a substrate having a non-planar surface with non-signal transmitting regions and signal transmitting regions. A metal layer is disposed on each of the non-signal transmitting regions. Further, each of the non-signal transmitting regions is separated by one of the signal transmitting regions. The method of constructing such a sensor cover is also disclosed.

摘要翻译： 公开了用于对包括例如雷达传感器在内的高频传感器进行伪装的传感器盖。传感器盖包括具有非平面表面的基板，其具有非信号传输区域和信号传输区域。金属层设置在每个非信号传输区域上。此外，每个非信号发送区域被信号发送区域之一分离。还公开了构造这种传感器盖的方法。

4.

发明授权
Forming rigid circuit board 失效
标题翻译：形成刚性电路板

公开(公告)号：US5655291A

公开(公告)日：1997-08-12

申请号：US494747

申请日：1995-06-26

申请人： Michael George Todd , Robert Edward Belke, Jr. , Robert Joseph Gordon

发明人： Michael George Todd , Robert Edward Belke, Jr. , Robert Joseph Gordon

IPC分类号： H05K3/00 , H05K3/36

CPC分类号： H05K3/0014 , H05K2203/1105 , H05K2203/302 , Y10T29/49126

摘要： A method and apparatus for forming a rigid circuit board uses a circuit board with a reduced thickness in a bend region. The bend region may have several layers of laminate and conductive material. The circuit board is heated to the glass transition temperature which allows the circuit board to become flexible. The apparatus has two rollers used to form the bend region to a predetermined shape. When the circuit is cooled, the circuit board again becomes rigid in its predetermined shape.

摘要翻译： 用于形成刚性电路板的方法和装置在弯曲区域中使用厚度减小的电路板。弯曲区域可以具有多层层压体和导电材料。电路板被加热到允许电路板变得柔性的玻璃化转变温度。该装置具有用于将弯曲区域形成为预定形状的两个辊。当电路冷却时，电路板再次变成刚性的预定形状。