公开(公告)号：US20250145859A1

公开(公告)日：2025-05-08

申请号：US18938313

申请日：2024-11-06

Applicant: KCTECH CO., LTD.

Inventor： Ji Hye KIM ,  Jae Ik LEE ,  Dam Bi KIM ,  Bo Hyeok CHOI

IPC: C09G1/02 ,  C09K3/14

Abstract: A slurry composition for chemical mechanical polishing (CMP) is provided. The slurry composition includes colloidal silica particles, at least one nonionic compound among dextran, dextrose, and dextrin, an amino acid, a pH buffer, and a pH adjuster. The slurry composition may have a pH of 1 to 4.

公开(公告)号：US20250026960A1

公开(公告)日：2025-01-23

申请号：US18715108

申请日：2022-12-01

Applicant: KCTECH CO.,LTD.

Inventor： Bo Hyeok CHOI ,  Hyun Goo KONG ,  Ji Hye KIM

IPC: C09G1/02

Abstract: The present invention relates to a polishing slurry composition, and more specifically to a polishing slurry composition for polysilicon polishing, the composition comprising: colloidal silica abrasive particles; a quaternary ammonium cationic monomer; and an acidic material.

公开(公告)号：US20240375242A1

公开(公告)日：2024-11-14

申请号：US18469542

申请日：2023-09-18

Applicant: KCTECH CO., LTD.

Inventor： Ho Kyun LIM

IPC: B24B49/12 ,  B24B49/06 ,  H01L21/66

Abstract: A method of discrimination a wafer region and a wafer region discrimination apparatus performing the same are disclosed. A wafer region discrimination apparatus includes a probe including an optical sensor and configured to obtain optical spectrum signals of which signal values vary based on a thickness characteristic of a wafer at a plurality of positions on the wafer and a processor configured to identify whether a current optical spectrum signal is obtained from a die region on the wafer in which a chip is disposed using a region discrimination model based on a neural network that uses the current optical spectrum signal obtained by the probe as an input.

公开(公告)号：US20240318037A1

公开(公告)日：2024-09-26

申请号：US18609795

申请日：2024-03-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yearin Byun ,  Eunock Kim ,  Suyeong Jung ,  Hyungoo Kong ,  Inkwon Kim ,  Sanghyun Park

IPC: C09G1/02 ,  H01L21/3205 ,  H01L21/321

CPC classification number: C09G1/02 ,  H01L21/3212 ,  H01L21/32051

Abstract: The present disclosure relates to slurry compositions used for chemical mechanical polishing of a metal film. An example slurry composition includes abrasive particles, deionized water, and an oxidizer. The oxidizer includes iodine, and is a temperature-sensitive oxidizer capable of controlling both a static etch rate and a removal rate of the metal film when a polishing temperature during the chemical mechanical polishing is about 5° C. to about 100° C.

公开(公告)号：US12091636B2

公开(公告)日：2024-09-17

申请号：US17516668

申请日：2021-11-01

Applicant: KCTECH CO., LTD.

Inventor： Kyong Jin Jung ,  Ga Young Jung ,  Young Ho Yun ,  Kun Hee Park ,  Young Gon Kim ,  Yong Ho Jeong

IPC: C11D1/00 ,  C09G1/02 ,  C09K3/14 ,  C11D1/14 ,  H01L21/304

CPC classification number: C11D1/143 ,  C09G1/02 ,  C09K3/1409 ,  C11D1/004 ,  C11D2111/22 ,  H01L21/304

Abstract: A composition for dissolving abrasive particles, and a cleaning method using the composition are provided. The composition includes a sulfur-containing organic acid, a fluorine ion-containing compound, and a solvent, and a turbidity change rate (%) measured at 60° C. for 15 minutes may be in a range of −80 to −99.

公开(公告)号：US11919122B2

公开(公告)日：2024-03-05

申请号：US17036062

申请日：2020-09-29

Applicant: Samsung Display Co., LTD. ,  KCTECH CO., LTD.

Inventor： Seung Bae Kang ,  Sung Hyeon Park ,  Jung Gun Nam ,  Joon-Hwa Bae ,  Kyung Bo Lee ,  Keun Woo Lee ,  Woo Jin Cho ,  Byoung Kwon Choo

IPC: B24B37/015 ,  B24B37/04 ,  C03C19/00 ,  H01L27/12 ,  H01L29/66 ,  H10K59/121 ,  H10K71/00 ,  H10K71/20 ,  H10K71/70 ,  H10K77/10 ,  H01L29/768 ,  H01L29/786 ,  H10K59/12

CPC classification number: B24B37/015 ,  B24B37/042 ,  C03C19/00 ,  H10K59/1213 ,  H10K71/00 ,  H10K71/20 ,  H10K71/70 ,  H10K77/10 ,  H01L27/1218 ,  H01L27/1222 ,  H01L27/1262 ,  H01L27/1274 ,  H01L29/6675 ,  H01L29/78672 ,  H10K59/1201

Abstract: A substrate processing apparatus includes: a conveyor belt configured to have an outer surface on which a bottom surface of a substrate is seated; and a polishing head unit configured to face an upper surface of the substrate, wherein the polishing head unit includes: a polishing head connected to a driver; a polishing pad configured to face the polishing head; a polishing pad fixing ring disposed between the polishing head and the polishing pad; and a temperature sensor configured to overlap the polishing pad fixing ring and to be spaced apart from the polishing pad fixing ring.

公开(公告)号：US20230136640A1

公开(公告)日：2023-05-04

申请号：US17977702

申请日：2022-10-31

Applicant: KCTECH CO., LTD.

Inventor： Chang Gil KWON ,  Sung Pyo LEE

IPC: C09G1/02 ,  H01L21/306

Abstract: Provided is a polishing slurry composition including abrasive particles, a dispersant, a pH buffering agent, and a dishing inhibitor including at least one selected from a group consisting of a saccharides compound, an amino acid, and a mixture thereof.

公开(公告)号：US11612981B2

公开(公告)日：2023-03-28

申请号：US16575176

申请日：2019-09-18

Applicant: KCTECH CO., LTD.

Inventor： Huiseong Che

IPC: B24B49/10 ,  B24B37/005 ,  B24B53/017 ,  H01L21/67 ,  B24B37/26

Abstract: Provided is a substrate processing apparatus. The substrate processing apparatus comprises a polishing table; a polishing pad disposed on an upper surface of the polishing table; a conditioner including a conditioner head, a disk holder movably coupled to the conditioner head in a vertical direction, and a conditioning disk mounted to the disk holder and in contact with the polishing pad; and a thickness measuring unit of obtaining the thickness of the polishing pad from the relative moving distance of the disk holder with respect to the conditioner head, wherein the information of the relative moving distance is received from sensing unit.

公开(公告)号：US20230033789A1

公开(公告)日：2023-02-02

申请号：US17786741

申请日：2020-10-30

Applicant: KCTECH CO., LTD.

Inventor： Bo Hyeok CHOI ,  Jae Hak LEE ,  Jae Woo LEE ,  Ji Hye KIM ,  Jae Ik LEE

IPC: C09G1/02 ,  C09K3/14 ,  H01L21/306

Abstract: The present invention relates to a slurry composition for polishing an organic film, and the slurry composition for polishing an organic film according to one embodiment of the present invention comprises: abrasive particles; a polishing control agent containing an organic acid, an inorganic acid, or both; an organic film polishing enhancer containing an amide compound or an amide polymer; an oxidizing agent; and a pH control agent.

公开(公告)号：US20220274264A1

公开(公告)日：2022-09-01

申请号：US17583624

申请日：2022-01-25

Applicant: KCTECH CO., LTD.

Inventor： Moon Gi Cho ,  Hee Sung Chae ,  Seung Eun Lee ,  Geun Sik Yun

IPC: B25J15/00 ,  B65G49/06

Abstract: A substrate transferring system may include a first transfer unit to transfer a substrate along a circular first orbit while rotating on a first axis perpendicular to a ground, and a second transfer unit to transfer a substrate along a circular second orbit while rotating on a second axis perpendicular to the ground, wherein the first orbit and the second orbit may overlap with each other at a first point, and at the first point, a substrate may be transferred from the first transfer unit to the second transfer unit or from the second transfer unit to the first transfer unit.