Abstract:
A pixel structure includes a plurality of data lines and a common line. The common line overlaps each data line, and is coupled with each data line to respectively form a first coupling capacitor, a second coupling capacitor, a third coupling capacitor, a fourth coupling capacitor, a fifth coupling capacitor, and a sixth coupling capacitor. The third coupling capacitor is smaller than the second coupling capacitor, and the fifth coupling capacitor is smaller than the fourth coupling capacitor.
Abstract:
A method of making a lithography mask with a stress-relief treatment is disclosed. The method includes providing a substrate and depositing an opaque layer on the substrate. The opaque layer is patterned to form a patterned mask. A stress-relief treatment is applied to the patterned mask by using an radiation exposure.
Abstract:
In this patent, we isolated a novel compound from fruiting body of Antrodia cinnamomea, namely, (22R)-5α-lanosta-8,24-dien-3β,15α,21-triol. This compound possesses preferential cytotoxicity against human leukemia, pancreatic cancer, esophageal cancer, hepatoma, and cervical cancer cells.
Abstract:
A current balance circuit includes a first and a second current sensors, an averager, a first and a second control modules, and a first and a second rheostat elements. The first and second current sensors receive a first current and a second current from a power source respectively and convert the first and second currents into a first and a second voltages. The averager receives the first and second voltages and calculates to obtain an average voltage. The first and second control modules receive the first voltage, the second voltage, and the average voltage, to obtain a first and a second control signals, to control current conduction ability of the first and second rheostat elements, to make the first and second currents keep a dynamic balance.
Abstract:
The disclosure relates to a fin field effect transistor (FinFET). An exemplary structure for a FinFET comprises a substrate comprising a major surface; a plurality of first trenches having a first width and extending downward from the substrate major surface to a first height, wherein a first space between adjacent first trenches defines a first fin; and a plurality of second trenches having a second width less than first width and extending downward from the substrate major surface to a second height greater than the first height, wherein a second space between adjacent second trenches defines a second fin.
Abstract:
A method for reducing layer overlay errors by synchronizing the density of mask material in the frame area across the masks in a set is disclosed. An exemplary method includes creating a mask design database corresponding to a mask and containing a die area with one or more dies and a frame area outside the die area. Fiducial features within the frame area are identified, and from the fiducial features, an idle frame area is identified. A reference mask design, which corresponds to a reference mask configured to be aligned with the mask, is used to determine a reference density for the idle frame area. The idle frame area of the mask design database is modified to correspond to the reference density. The modified mask design database is then available for further use including manufacturing the mask.
Abstract:
A phishing processing method includes: an information input web page comprising an information input interface, through which information is transmitted to an information receiving address, is received. Determine if the information input web page is a phishing web page. If it is determined that the information input web page is the phishing web page, fake input information is transmitted to the information receiving address. When information for verification is received from an information transmitting address, if the received information for verification is the fake input information is determined. If the received information for verification is the fake input information, it is determined that the information transmitting address is a malicious address.
Abstract:
A method for calculating efficiency of a power supply system includes: displaying a parameter selection interface on the display unit for selecting power supply parameters and transmission line parameters. Obtaining power supply parameters and transmission line parameters selected by the user via the parameter selection interface when determining the user has finished the selection. Determining a efficiency of a selected power supply of the power supply parameters according to the relationship table, and calculating a sum efficiency according to the obtained power supply parameters and the transmission line parameters and the efficiency of the selected power supply. And calculating a total efficiency of the power supply system according to each sum efficiency when determining that all of the power supplies of the power supply system have been selected.
Abstract:
Provided is a method for reducing phase defects on many different types of semiconductor mask blanks. The method includes receiving a semiconductor mask blank substrate, creating alignment marks on the surface of the substrate, performing an inspection of the surface of the substrate to locate a plurality of surface defects, and repairing the plurality of surface defects on the surface of the substrate. A semiconductor mask is also provided that includes a repaired substrate a multilayer stack comprising a plurality of molybdenum and silicon layers, a capping layer, an absorber layer, and in some instances a photoresist layer.
Abstract:
A buck converter configured for converting a voltage output from a power supply to a load includes a first switch, a second switch, an inductor, three compensators and a control microchip. The first switch and the second switch are connected in series between two ends of the power supply. A first end of the inductor is connected to a node between the first switch and the second switch; a second end of the inductor serves as an output terminal connected to the load. The compensators are correspondingly connected to the first switch, the second switch and the inductor. The control microchip is electrically connected to the first and second switches and the node. The control microchip controls the first and second switches to turn on or off, and executes a current protective process when output current of the output terminal exceeds a current protective threshold of the load.