公开(公告)号：US20100075343A1

公开(公告)日：2010-03-25

申请号：US12524036

申请日：2007-11-29

申请人： Motoo Yamasaki ,  Noriyuki Takahashi ,  Naoto Minamino ,  Kazuki Sasaki ,  Toshifumi Takao ,  Yoshinori Satomi ,  Yoichi Ueta

发明人： Motoo Yamasaki ,  Noriyuki Takahashi ,  Naoto Minamino ,  Kazuki Sasaki ,  Toshifumi Takao ,  Yoshinori Satomi ,  Yoichi Ueta

IPC分类号： G01N33/53 ,  C07K14/00 ,  C07K7/06 ,  C07K7/08 ,  C07H21/00 ,  C12N15/63 ,  C12N5/00 ,  C12P21/00 ,  C07K16/00 ,  C12Q1/02

CPC分类号： C07K16/22 ,  A61K38/00 ,  C07K14/47 ,  G01N33/5008

摘要： The present invention provides novel peptides with energy-modulating activity or circulatory function-modulating activity. The peptides of the present invention have energy-modulating activity or circulatory function-modulating activity and thus are useful for treating food consumption disorders and diseases of the circulatory system.

摘要翻译： 本发明提供具有能量调节活性或循环功能调节活性的新型肽。 本发明的肽具有能量调节活性或循环功能调节活性，因此可用于治疗食物消耗障碍和循环系统的疾病。

公开(公告)号：US20090309213A1

公开(公告)日：2009-12-17

申请号：US12481078

申请日：2009-06-09

申请人： Noriyuki TAKAHASHI ,  Mamoru SHISHIDO

发明人： Noriyuki TAKAHASHI ,  Mamoru SHISHIDO

IPC分类号： H01L23/34 ,  H01L21/50

CPC分类号： H01L23/4334 ,  H01L21/561 ,  H01L23/3128 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/97 ,  H01L2224/05554 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/351 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/05599

摘要： A semiconductor chip is mounted on a heat sink disposed inside a through-hole of a wiring board, electrodes of the semiconductor chip and connecting terminals of the wiring board are connected by bonding wires, a sealing resin is formed to cover the semiconductor chip and the bonding wires, and solder balls are formed on the lower surface of the wiring board, thereby constituting the semiconductor device. The heat sink is thicker than the wiring board. The heat sink has a protruded portion protruding to outside from the side surface of the heat sink, the protruded portion is located on the upper surface of the wiring board outside the through-hole, and the lower surface of the protruded portion contacts to the upper surface of the wiring board. When the semiconductor device is manufactured, the heat sink is inserted from the upper surface side of the wiring board.

摘要翻译： 半导体芯片安装在布线板的通孔内的散热片上，半导体芯片的电极和布线基板的连接端子通过接合线连接，形成密封树脂以覆盖半导体芯片和 接合线和焊球形成在布线板的下表面上，从而构成半导体器件。 散热器比布线板厚。 散热器具有从散热片的侧面突出到外侧的突出部，突出部位于通孔外侧的布线基板的上表面，突出部的下表面与上部 接线板表面。 当制造半导体器件时，从布线板的上表面侧插入散热片。

公开(公告)号：US07615872B2

公开(公告)日：2009-11-10

申请号：US12314209

申请日：2008-12-05

申请人： Noriyuki Takahashi ,  Masahiro Ichitani ,  Rumiko Ichitani, legal representative ,  Kazuhiro Ichitani, legal representative ,  Sachiyo Ichitani, legal representative

发明人： Noriyuki Takahashi ,  Masahiro Ichitani

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L23/40

CPC分类号： H01L23/49838 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A semiconductor device comprises: a package substrate having a plurality of bonding electrodes arranged in a peripheral region of a main surface thereof and wirings connected to the respective bonding electrodes and electrolessly plated; a semiconductor chip mounted on the package substrate; a plurality of wires connecting pads of the semiconductor chip and the bonding electrodes; a sealing body for sealing the semiconductor chip and the wires with resin; and a plurality of solder balls arranged on the package substrate. The wirings are formed only at the inner side of the plurality of bonding electrodes on the main surface of the package substrate, and no solder resist film is formed at the outer side of the plurality of bonding electrodes. With this arrangement, the region outside the bonding electrodes can be minimized and the semiconductor device can be downsized without changing the size of the chip mounted thereon.

公开(公告)号：US20090091031A1

公开(公告)日：2009-04-09

申请号：US12314209

申请日：2008-12-05

申请人： Noriyuki Takahashi ,  Masahiro Ichitani ,  Rumiko Ichitani ,  Kazuhiro Ichitani ,  Sachiyo Ichitani

发明人： Noriyuki Takahashi ,  Masahiro Ichitani ,  Rumiko Ichitani ,  Kazuhiro Ichitani ,  Sachiyo Ichitani

IPC分类号： H01L23/498

CPC分类号： H01L23/49838 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A semiconductor device comprises: a package substrate having a plurality of bonding electrodes arranged in a peripheral region of a main surface thereof and wirings connected to the respective bonding electrodes and electrolessly plated; a semiconductor chip mounted on the package substrate; a plurality of wires connecting pads of the semiconductor chip and the bonding electrodes; a sealing body for sealing the semiconductor chip and the wires with resin; and a plurality of solder balls arranged on the package substrate. The wirings are formed only at the inner side of the plurality of bonding electrodes on the main surface of the package substrate, and no solder resist film is formed at the outer side of the plurality of bonding electrodes. With this arrangement, the region outside the bonding electrodes can be minimized and the semiconductor device can be downsized without changing the size of the chip mounted thereon.

公开(公告)号：US20090087049A1

公开(公告)日：2009-04-02

申请号：US12212863

申请日：2008-09-18

申请人： Noriyuki Takahashi

发明人： Noriyuki Takahashi

IPC分类号： G06K9/74

CPC分类号： G06F19/321 ,  A61B5/055 ,  A61B6/03 ,  A61B6/463 ,  A61B6/468 ,  G06F19/00 ,  G16H15/00

摘要： A medical reporting system includes a display panel for displaying plural CT images. A ROI setting unit designates a region of interest in the CT images. A group setting unit sets a group of specific CT images having the region of interest among the CT images, to generate group information of the group. A report editor displays a note area for inputting a note related to the specific CT images. A memory stores a text location of the note area assigned to the group information, and stores location information of the region of interest in the specific CT images. Furthermore, a first terminal device has the report editor, the ROI setting unit and the group setting unit. A second terminal device communicates with the first terminal device on line. A reporting display panel displays at least the specific CT images and the note.

摘要翻译： 医疗报告系统包括用于显示多个CT图像的显示面板。 ROI设置单元指定CT图像中的感兴趣区域。 组设定单元在CT图像之间设置具有感兴趣区域的一组特定CT图像，以生成组的组信息。 报告编辑器显示用于输入与特定CT图像有关的音符的音符区域。 存储器存储分配给组信息的笔记区域的文本位置，并将感兴趣区域的位置信息存储在特定CT图像中。 此外，第一终端装置具有报告编辑器，ROI设置单元和组设置单元。 第二终端设备在线上与第一终端设备通信。 报告显示面板至少显示特定的CT图像和音符。

公开(公告)号：US07479705B2

公开(公告)日：2009-01-20

申请号：US10927106

申请日：2004-08-27

申请人： Noriyuki Takahashi ,  Rumiko Ichitani, legal representative ,  Kazuhiro Ichitani, legal representative ,  Sachiyo Ichitani, legal representative

发明人： Masahiro Ichitani

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H01L23/49838 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A semiconductor device comprises: a package substrate having a plurality of bonding electrodes arranged in a peripheral region of a main surface thereof and wirings connected to the respective bonding electrodes and electrolessly plated; a semiconductor chip mounted on the package substrate; a plurality of wires connecting pads of the semiconductor chip and the bonding electrodes; a sealing body for sealing the semiconductor chip and the wires with resin; and a plurality of solder balls arranged on the package substrate. The wirings are formed only at the inner side of the plurality of bonding electrodes on the main surface of the package substrate, and no solder resist film is formed at the outer side of the plurality of bonding electrodes. With this arrangement, the region outside the bonding electrodes can be minimized and the semiconductor device can be downsized without changing the size of the chip mounted thereon.

摘要翻译： 一种半导体器件，包括：封装基板，其具有布置在其主表面的周边区域中的多个接合电极和连接到各个接合电极并无电镀的布线; 安装在所述封装基板上的半导体芯片; 连接半导体芯片的焊盘和接合电极的多根导线; 用于用树脂密封半导体芯片和电线的密封体; 以及布置在所述封装衬底上的多个焊球。 布线仅形成在封装基板的主表面上的多个接合电极的内侧，并且在多个接合电极的外侧不形成阻焊膜。 通过这种布置，可以最小化接合电极外部的区域，并且可以在不改变安装在其上的芯片的尺寸的情况下小型化半导体器件。

公开(公告)号：US20090007939A1

公开(公告)日：2009-01-08

申请号：US11839626

申请日：2007-08-16

申请人： Shu SHIMADA ,  Noriyuki TAKAHASHI ,  Hiroyuki NAKAJIMA ,  Hiroko TANAKA ,  Nobuyuki KANDA

发明人： Shu SHIMADA ,  Noriyuki TAKAHASHI ,  Hiroyuki NAKAJIMA ,  Hiroko TANAKA ,  Nobuyuki KANDA

IPC分类号： B08B5/00

CPC分类号： B08B7/0071 ,  G03F1/66 ,  G03F1/82

摘要： The present invention provides a method of cleaning a storage case to be used for storing or transporting mask substrates such as photomasks and photomask blanks, semiconductor substrates such as semiconductor wafers, pellicles, or the like. The present invention: facilitates a regular cleaning operation, can be used also for a storage case of a complicated shape, does not require a large scale equipment or an expensive equipment to facilitate an environmental countermeasure, and provides high cleaning effect. The method of cleaning a storage case polluted by adhesion of a foreign substance of an organic material, an ionic foreign substances or an ionic crystal foreign substance physically absorbed, comprises a step of placing the storage case still in air flow of cleaned air or an inert gas in a temperature range from room temperature to 80° C. for desorbing and removing the foreign substance adhered to the storage case.

摘要翻译： 本发明提供了一种清洁用于存放或传送诸如光掩模和光掩模坯料的掩模基板，诸如半导体晶片，薄膜等半导体基板的存储盒的方法。 本发明：便于定期的清洁操作，也可以用于复杂形状的储存盒，不需要大型设备或昂贵的设备来促进环境对策，并且提供高清洁效果。 清洁被有机材料的异物，物理吸收的离子性异物或离子性异物的附着物污染的储存箱的方法包括将储存箱放置在清洁空气的空气流中或惰性气体的步骤 气体在室温至80℃的温度范围内，用于解吸和除去粘附到储存盒的异物。

公开(公告)号：US20070186879A1

公开(公告)日：2007-08-16

申请号：US11674016

申请日：2007-02-12

申请人： Noriyuki TAKAHASHI

发明人： Noriyuki TAKAHASHI

IPC分类号： F01P5/10 ,  F02F1/10 ,  F02F1/14 ,  F02B77/00

CPC分类号： F01P5/10 ,  F01M1/02 ,  F01P11/04 ,  F01P2050/16 ,  F02B61/02 ,  F02B75/22 ,  F02F7/007

摘要： A cooling water structure for an engine with improved external appearance and reduced cost. A first passage section of a cooling water passage discharges cooling water from a water pump to water jackets of front and rear cylinders. The first passage section is formed in a surface of a partition wall of a right case that is an inside wall surface of a crank case. The water pump is accommodated with the first passage section in a crank chamber of the crank case.

摘要翻译： 用于发动机的冷却水结构，具有改善的外观和降低的成本。 冷却水通道的第一通道部分将冷却水从水泵排放到前缸和后缸的水套上。 第一通道部分形成在作为曲轴箱的内壁表面的右壳体的分隔壁的表面中。 水泵容纳有曲柄箱的曲柄室中的第一通道部分。

公开(公告)号：US20060141677A1

公开(公告)日：2006-06-29

申请号：US11360512

申请日：2006-02-24

申请人： Tadashi Munakata ,  Shingo Oosaka ,  Mitsuru Kinoshita ,  Yoshihiko Yamaguchi ,  Noriyuki Takahashi

发明人： Tadashi Munakata ,  Shingo Oosaka ,  Mitsuru Kinoshita ,  Yoshihiko Yamaguchi ,  Noriyuki Takahashi

IPC分类号： H01L21/50 ,  H01L21/78

CPC分类号： H01L21/78 ,  H01L21/02076 ,  H01L21/561 ,  H01L21/565 ,  H01L21/67092 ,  H01L21/67126 ,  H01L21/67333 ,  H01L21/6838 ,  H01L23/3128 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2924/00

摘要： A semiconductor device manufacturing method comprising the steps of providing a matrix substrate having a main surface with plural device areas formed thereon, fixing plural semiconductor chips to the plural device areas respectively, then sealing the plural semiconductor chips all together with resin to form a block sealing member, dividing the block sealing member and the matrix substrate for each of the device areas by dicing, thereafter rubbing a surface of each of the diced sealing member portions with a brush, then storing semiconductor devices formed by the dicing once into pockets respectively of a tray, and conveying the semiconductor devices each individually from the tray. Since the substrate dividing work after block molding is performed by dicing while vacuum-chucking the surface of the block sealing member, the substrate division can be done without imposing any stress on an external terminal mounting surface of the matrix substrate.

公开(公告)号：US07033857B2

公开(公告)日：2006-04-25

申请号：US10462463

申请日：2003-06-17

申请人： Tadashi Munakata ,  Shingo Oosaka ,  Mitsuru Kinoshita ,  Yoshihiko Yamaguchi ,  Noriyuki Takahashi

发明人： Tadashi Munakata ,  Shingo Oosaka ,  Mitsuru Kinoshita ,  Yoshihiko Yamaguchi ,  Noriyuki Takahashi

IPC分类号： H01L21/44

CPC分类号： H01L21/78 ,  H01L21/02076 ,  H01L21/561 ,  H01L21/565 ,  H01L21/67092 ,  H01L21/67126 ,  H01L21/67333 ,  H01L21/6838 ,  H01L23/3128 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01057 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2924/00

摘要： A semiconductor device manufacturing method comprising the steps of providing a matrix substrate having a main surface with plural device areas formed thereon, fixing plural semiconductor chips to the plural device areas respectively, then sealing the plural semiconductor chips all together with resin to form a block sealing member, dividing the block sealing member and the matrix substrate for each of the device areas by dicing, thereafter rubbing a surface of each of the diced sealing member portions with a brush, then storing semiconductor devices formed by the dicing once into pockets respectively of a tray, and conveying the semiconductor devices each individually from the tray. Since the substrate dividing work after block molding is performed by dicing while vacuum-chucking the surface of the block sealing member, the substrate division can be done without imposing any stress on an external terminal mounting surface of the matrix substrate.