公开(公告)号：US20090227282A1

公开(公告)日：2009-09-10

申请号：US12367770

申请日：2009-02-09

Applicant: Naoki MIYABAYASHI ,  Yoshihiro YONEDA ,  Isao SOMA ,  Kazuo TAKADA ,  Seiji KURODA ,  Yasuharu ISHIKAWA ,  Masahiro SUEYOSHI

Inventor： Naoki MIYABAYASHI ,  Yoshihiro YONEDA ,  Isao SOMA ,  Kazuo TAKADA ,  Seiji KURODA ,  Yasuharu ISHIKAWA ,  Masahiro SUEYOSHI

IPC: H04M1/00

CPC classification number: H04L63/18 ,  H04L63/0492 ,  H04L63/08 ,  H04W4/21 ,  H04W12/06 ,  H04W92/18

Abstract: A communication device has a first communication section that supports a first communication mode having a low communication rate and a second communication section that supports a second communication mode having a higher communication rate than the first communication mode. The communication device includes a packet generation section and a communication control section. The packet generation section generates a first portion containing authentication information used for connection authentication for the second communication mode and a second portion other than the first portion. The communication control section performs control to cause the first communication section to transmit the first portion and to cause the second communication section to transmit the second portion after the connection authentication succeeds using the authentication information contained in the first portion.

Abstract translation: 通信装置具有支持具有低通信速率的第一通信模式的第一通信部分和支持具有比第一通信模式更高通信速率的第二通信模式的第二通信部分。 通信设备包括分组产生部分和通信控制部分。 分组产生部分生成包含用于第二通信模式的连接认证的认证信息的第一部分和除了第一部分之外的第二部分。 通信控制部进行控制，使得第一通信部发送第一部分，并且在使用包含在第一部分中的认证信息进行连接认证成功之后使第二通信部发送第二部分。

公开(公告)号：US07091527B2

公开(公告)日：2006-08-15

申请号：US11166247

申请日：2005-06-27

Applicant: Yoshihiro Yoneda ,  Ikuo Hanawa

Inventor： Yoshihiro Yoneda ,  Ikuo Hanawa

IPC: H01L31/107

CPC classification number: H01L31/1075 ,  H01L31/02161 ,  H01L31/022408 ,  H01L31/02327 ,  H01L31/1035 ,  H01L31/105

Abstract: A semiconductor photodetection device includes a semiconductor structure including an optical absorption layer having a photo-incidence surface on a first side thereof, a dielectric reflecting layer formed on a second side of the semiconductor structure opposite to the first side, a contact electrode surrounding the dielectric reflecting layer and contacting with the semiconductor structure, and a close contact electrode covering the dielectric reflecting layer and contacting with the contact electrode and the dielectric reflecting layer, wherein the close contact electrode adheres to the dielectric reflecting layer more strongly than to the contact electrode.

公开(公告)号：US06924541B2

公开(公告)日：2005-08-02

申请号：US10736072

申请日：2003-12-16

Applicant: Yoshihiro Yoneda ,  Ikuo Hanawa

Inventor： Yoshihiro Yoneda ,  Ikuo Hanawa

IPC: H01L31/10 ,  H01L29/732 ,  H01L31/0224 ,  H01L31/0304 ,  H01L31/103 ,  H01L31/107 ,  H01L31/109 ,  H01L31/00

CPC classification number: H01L31/1075 ,  H01L31/02161 ,  H01L31/022408 ,  H01L31/02327 ,  H01L31/1035 ,  H01L31/105

Abstract: A semiconductor photodetection device includes a semiconductor structure including an optical absorption layer having a photo-incidence surface on a first side thereof, a dielectric reflecting layer formed on a second side of the semiconductor structure opposite to the first side, a contact electrode surrounding the dielectric reflecting layer and contacting with the semiconductor structure, and a close contact electrode covering the dielectric reflecting layer and contacting with the contact electrode and the dielectric reflecting layer, wherein the close contact electrode adheres to the dielectric reflecting layer more strongly than to the contact electrode.

Abstract translation: 半导体光检测装置包括：半导体结构，其包括在第一侧上具有光入射面的光吸收层，形成在与第一侧相反的半导体结构的第二侧上的电介质反射层，围绕电介质的接触电极 反射层并与半导体结构接触，以及覆盖电介质反射层并与接触电极和电介质反射层接触的紧密接触电极，其中紧密接触电极比接触电极更牢固地粘附于电介质反射层。

公开(公告)号：US06791186B2

公开(公告)日：2004-09-14

申请号：US10127640

申请日：2002-04-22

Applicant: Haruo Sorimachi ,  Yoshihiro Yoneda

Inventor： Haruo Sorimachi ,  Yoshihiro Yoneda

IPC: H01L2348

CPC classification number: H01L23/49822 ,  H01L23/49838 ,  H01L24/81 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/16238 ,  H01L2224/81191 ,  H01L2224/81395 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/00015 ,  H01L2224/0401

Abstract: A mounting substrate on which a semiconductor element is to be mounted by flip-chip bonding, the semiconductor element having a surface on which a plurality of electrode terminals are arranged in a line, each of said electrode terminals having a protruded electrode formed thereon, wherein the surface of the mounting substrate on which the semiconductor element is to be mounted is provided with a protective film having an opening corresponding to an area of the semiconductor element where the protruded electrodes are located, a plurality of connection electrodes being arranged in the opening, the connection electrodes being provided with a solder for bonding it to the protruded electrodes, and being arranged at the same interval as that of the protruded electrodes, and each of the connection electrodes being connected to a wiring pattern of the mounting substrate, and wherein the length of a portion of the connection electrode from the center of the opening to the end thereof that is not connected with the wiring pattern is 150 &mgr;m or larger. A structure having a semiconductor element mounted on the substrate is also disclosed.

Abstract translation: 一种通过倒装芯片接合将半导体元件安装在其上的安装基板，该半导体元件具有多个电极端子排列成一行的表面，每个所述电极端子上形成有突起电极，其中， 安装有半导体元件的安装基板的表面设置有保护膜，该保护膜具有对应于突起电极所在的半导体元件的区域的开口，多个连接电极布置在开口中， 连接电极设置有用于将其焊接到突出电极的焊料，并且以与突出电极相同的间隔布置，并且每个连接电极连接到安装基板的布线图案，并且其中 连接电极的一部分的长度从开口的中心到其末端为no t接线图为150 mum以上。 还公开了具有安装在基板上的半导体元件的结构。

公开(公告)号：US6049122A

公开(公告)日：2000-04-11

申请号：US136424

申请日：1998-08-20

Applicant: Yoshihiro Yoneda

Inventor： Yoshihiro Yoneda

IPC: H01L21/56 ,  H05K3/34 ,  H01L23/495

CPC classification number: H01L24/29 ,  H01L21/563 ,  H01L24/83 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2924/00013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/15787 ,  H05K3/3452

Abstract: A semiconductor device and method to control generation of a void within resin during supply to an area between a semiconductor chip and a substrate body. The substrate body includes a wiring layer which is connected to an external bump through internal wiring. Solder resist is formed on the substrate body and an aperture in the solder resist exposes a plurality of pads to electrically connect with the semiconductor chip. During loading of the semiconductor chip, the resin is supplied to the aperture. The aperture is formed in a circumferential shape to control generation of the void.

Abstract translation: 一种半导体装置和方法，用于在供给到半导体芯片和基板主体之间的区域时控制树脂内的空隙的产生。 基板主体包括通过内部布线连接到外部凸起的布线层。 在基板主体上形成抗焊剂，并且阻焊剂中的孔露出多个焊盘以与半导体芯片电连接。 在加载半导体芯片期间，将树脂供应到孔。 孔径形成为周向形状以控制空隙的产生。

公开(公告)号：US4792489A

公开(公告)日：1988-12-20

申请号：US941351

申请日：1986-12-15

Applicant: Hiroshi Kakiuchi ,  Setsuo Fukuhara ,  Michinobu Fujiwara ,  Hiroshi Maeda ,  Yutaka Shirakashi ,  Osamu Asakura ,  Yoshihiro Yoneda ,  Tetsuo Noda ,  Naoyuki Fujita

Inventor： Hiroshi Kakiuchi ,  Setsuo Fukuhara ,  Michinobu Fujiwara ,  Hiroshi Maeda ,  Yutaka Shirakashi ,  Osamu Asakura ,  Yoshihiro Yoneda ,  Tetsuo Noda ,  Naoyuki Fujita

IPC: A41G3/00 ,  D01D5/088 ,  D01D5/253 ,  D01F1/10 ,  D01F6/60 ,  D02G3/00

CPC classification number: A41G3/0083 ,  D01D5/0885 ,  D01D5/253 ,  D01F1/10 ,  D01F6/60 ,  Y10T428/2927 ,  Y10T428/2973 ,  Y10T428/2978

Abstract: A synthetic fiber having an uneven surface structure consisting of wrinkles having ridges and recesses of the surface of the fiber and not presenting specular luster, which may be used, for example, as artificial hair for wigs, can be produced easily and stably by melt-spinning a starting synthetic resin such as nylon and passing the spun mono-filament through a cooling bath at a temperature not lower than 30.degree. C. for a period of time sufficient for developing wrinkles in its surface. Inclusion of a pigment such as carbon black in an appropriate amount in the starting material is effective in providing dense distribution of wrinkles.

Abstract translation: 具有不均匀的表面结构的合成纤维可以容易且稳定地通过熔融粘合剂制造，该表面结构由具有脊部和纤维表面凹陷的褶皱组成，并且不呈现镜面光泽，例如可用作假发的人造毛发， 旋转起始合成树脂如尼龙，并将纺丝单丝通过冷却浴，温度不低于30℃，持续一段足以在其表面产生皱纹的时间。 在起始材料中包含适量的碳黑等颜料在提供致密的皱纹分布方面是有效的。

公开(公告)号：US08964809B2

公开(公告)日：2015-02-24

申请号：US13597375

申请日：2012-08-29

Applicant: Yoshihiro Yoneda ,  Masaki Yanagisawa ,  Kenji Koyama ,  Hirohiko Kobayashi ,  Kenji Hiratsuka

Inventor： Yoshihiro Yoneda ,  Masaki Yanagisawa ,  Kenji Koyama ,  Hirohiko Kobayashi ,  Kenji Hiratsuka

IPC: H01S5/00 ,  H01S5/024 ,  H01S5/026 ,  H01S5/06 ,  H01S5/227 ,  H01S5/042 ,  H01S5/0625 ,  H01S5/343 ,  H01S5/20

CPC classification number: H01S5/02461 ,  B82Y20/00 ,  H01S5/0261 ,  H01S5/0425 ,  H01S5/0612 ,  H01S5/06256 ,  H01S5/209 ,  H01S5/2275 ,  H01S5/3434

Abstract: A semiconductor optical integrated device includes a substrate having a main surface with a first and second regions arranged along a waveguiding direction; a gain region including a first cladding layer, an active layer, and a second cladding layer arranged on the first region of the main surface; and a wavelength control region including a third cladding layer, an optical waveguide layer, and a fourth cladding layer arranged on the second region of the main surface and including a heater arranged along the optical waveguide layer. The substrate includes a through hole extending from a back surface of the substrate in the thickness direction and reaching the first region. A metal member is arranged in the through hole. The metal member extends from the back surface of the substrate in the thickness direction and is in contact with the first cladding layer.

Abstract translation: 半导体光学集成器件包括具有沿着波导方向布置的具有第一和第二区域的主表面的衬底; 包括布置在所述主表面的第一区域上的第一包层，有源层和第二包层的增益区域; 以及包括布置在主表面的第二区域上的第三包层，光波导层和第四包层的波长控制区域，并且包括沿着光波导层布置的加热器。 基板包括从基板的厚度方向的背面延伸并到达第一区域的通孔。 金属构件布置在通孔中。 金属部件在厚度方向上从基板的背面延伸并与第一包覆层接触。

公开(公告)号：US08565131B2

公开(公告)日：2013-10-22

申请号：US13101825

申请日：2011-05-05

Applicant: Naoki Miyabayashi ,  Yoshihiro Yoneda ,  Isao Soma ,  Kazuo Takada ,  Seiji Kuroda ,  Yasuharu Ishikawa ,  Masahiro Sueyoshi

Inventor： Naoki Miyabayashi ,  Yoshihiro Yoneda ,  Isao Soma ,  Kazuo Takada ,  Seiji Kuroda ,  Yasuharu Ishikawa ,  Masahiro Sueyoshi

IPC: H04B7/00

CPC classification number: H04L63/18 ,  H04L63/0492 ,  H04L63/08 ,  H04W4/21 ,  H04W12/06 ,  H04W92/18

Abstract: A communication device has a first communication section that supports a first communication mode having a low communication rate and a second communication section that supports a second communication mode having a higher communication rate than the first communication mode. The communication device includes a packet generation section and a communication control section. The packet generation section generates a first portion containing authentication information used for connection authentication for the second communication mode and a second portion other than the first portion. The communication control section performs control to cause the first communication section to transmit the first portion and to cause the second communication section to transmit the second portion after the connection authentication succeeds using the authentication information contained in the first portion.

Abstract translation: 通信装置具有支持具有低通信速率的第一通信模式的第一通信部分和支持具有比第一通信模式更高通信速率的第二通信模式的第二通信部分。 通信设备包括分组产生部分和通信控制部分。 分组产生部分生成包含用于第二通信模式的连接认证的认证信息的第一部分和除了第一部分之外的第二部分。 通信控制部进行控制，使得第一通信部发送第一部分，并且在使用包含在第一部分中的认证信息进行连接认证成功之后使第二通信部发送第二部分。

公开(公告)号：US08547195B2

公开(公告)日：2013-10-01

申请号：US12677492

申请日：2009-05-14

Applicant: Yuji Kimura ,  Takahiro Asada ,  Yoshihiro Yoneda ,  Kazuaki Suzuki

Inventor： Yuji Kimura ,  Takahiro Asada ,  Yoshihiro Yoneda ,  Kazuaki Suzuki

IPC: H01H85/20 ,  H01H85/04 ,  H01H37/76 ,  H01H69/02 ,  H02H5/04

CPC classification number: H01M2/34 ,  H01H37/761 ,  H01M10/0525 ,  H01M10/4235

Abstract: A protection element and a secondary battery device employing the protection element are provided for stably retaining a flux on a soluble conductor at a predetermined position, so as to enable appropriate blowout of the soluble conductor in the event of an abnormality. The protection element has a soluble conductor which is disposed on an insulation baseboard, and which is connected to a power supply path of a device targeted to be protected, and which causes a blowout when a predetermined abnormal electric power amount is supplied. A flux is coated on a surface of the soluble conductor, and an insulation cover member is mounted on the baseboard and covers the soluble conductor. The protection element also includes a stepped portion for retaining the flux at a predetermined position in contact with the flux, and the stepped portion is formed opposite to the soluble conductor on an interior face of the insulation cover member.

Abstract translation: 提供一种使用保护元件的保护元件和二次电池装置，用于将预定位置上的可溶性导体上的助熔剂稳定地保持，从而能够在发生异常时适当地喷出可溶性导体。 保护元件具有设置在绝缘基板上的可溶性导体，其与被保护对象的装置的电源路径连接，当提供规定的异常电力量时，产生喷出。 助焊剂涂覆在可溶性导体的表面上，绝缘覆盖件安装在基板上并覆盖可溶性导体。 保护元件还包括用于将焊剂保持在与焊剂接触的预定位置的阶梯部分，并且阶梯部分形成在绝缘覆盖部件的内表面上与可溶性导体相对。

公开(公告)号：US08301124B2

公开(公告)日：2012-10-30

申请号：US12365379

申请日：2009-02-04

Applicant: Isao Soma ,  Naoki Miyabayashi ,  Yoshihiro Yoneda ,  Seiji Kuroda ,  Yasuharu Ishikawa

Inventor： Isao Soma ,  Naoki Miyabayashi ,  Yoshihiro Yoneda ,  Seiji Kuroda ,  Yasuharu Ishikawa

IPC: H04M3/42

CPC classification number: H04M1/7253 ,  H04M1/72558 ,  H04M2250/02 ,  H04M2250/06 ,  H04W84/18

Abstract: An information processing apparatus for communicating with a different information processing apparatus, includes: a first connection establishment block configured to control a first communication section, which carries out nearby wireless communication for delivering and accepting information to and from the different information processing apparatus positioned near to the information processing apparatus, to establish a connection for the nearby wireless communication; an acquisition block configured to acquire setting information for short range wireless communication which exhibits a wire communication range than the nearby wireless communication and capability information regarding the capacity of the different information processing apparatus from the different information processing apparatus through the nearby wireless communication; and a second connection establishment block configured to control a second communication section, which carries out the short range wireless communication, based on the setting information and the capability information to establish a connection for the short range wireless communication.

Abstract translation: 一种用于与不同的信息处理装置进行通信的信息处理装置，包括：第一连接建立块，被配置为控制第一通信部分，其执行附近的无线通信，用于向位于附近的不同信息处理装置传送和接收信息; 信息处理装置，用于建立附近无线通信的连接; 获取块，被配置为从不同的信息处理设备通过附近的无线通信获取与不同的信息处理设备的容量相关的与附近的无线通信相关的有线通信范围的短距离无线通信的设置信息和能力信息; 以及第二连接建立块，其被配置为基于所述设置信息和能力信息来控制执行所述短距离无线通信的第二通信部分，以建立所述短距离无线通信的连接。