CHEMICAL DISPERSION METHOD AND DEVICE
    51.
    发明申请
    CHEMICAL DISPERSION METHOD AND DEVICE 审中-公开
    化学分散方法和装置

    公开(公告)号:US20130034966A1

    公开(公告)日:2013-02-07

    申请号:US13198420

    申请日:2011-08-04

    IPC分类号: H01L21/306 B05B1/00

    摘要: A method of semiconductor fabrication including providing a semiconductor wafer and dispensing a first chemical spray onto the wafer using a first nozzle and dispensing a second chemical spray using a second nozzle onto the wafer. These dispensing may be performed simultaneously. The method may further include moving the first and second nozzle. The first and second nozzle may provide the first and second chemical spray having at least one different property. For example, different chemical compositions, concentrations, temperatures, angles of dispensing, or flow rate. A chemical dispersion apparatus providing two nozzles which are operable to be separately controlled is also provided.

    摘要翻译: 一种半导体制造方法,包括提供半导体晶片并使用第一喷嘴将第一化学喷雾分配到晶片上,并且使用第二喷嘴将第二化学喷雾分配到晶片上。 这些分配可以同时进行。 该方法还可以包括移动第一和第二喷嘴。 第一和第二喷嘴可以提供具有至少一种不同性质的第一和第二化学喷雾。 例如,不同的化学成分,浓度,温度,分配角度或流速。 还提供了提供可分开控制的两个喷嘴的化学分散装置。

    Holographic reticle and patterning method
    52.
    发明授权
    Holographic reticle and patterning method 有权
    全息掩模版和图案化方法

    公开(公告)号:US08227150B2

    公开(公告)日:2012-07-24

    申请号:US12768405

    申请日:2010-04-27

    IPC分类号: G03F1/00 G03C5/00

    摘要: A hologram reticle and method of patterning a target. A layout pattern for an image to be transferred to a target is converted into a holographic representation of the image. A hologram reticle is manufactured that includes the holographic representation. The hologram reticle is then used to pattern the target. Three-dimensional patterns may be formed in a photoresist layer of the target in a single patterning step. These three-dimensional patterns may be filled to form three-dimensional structures or else used in a multi-surface imaging composition. The holographic representation of the image may also be transferred to a top photoresist layer of a top surface imaging (TSI) semiconductor device, either directly or using the hologram reticle. The top photoresist layer may then be used to pattern an underlying photoresist layer with the image. The lower photoresist layer is used to pattern a material layer of the device.

    摘要翻译: 全息图掩模版和图案化目标的方法。 要传输到目标的图像的布局图案被转换成图像的全息图。 制造包括全息图的全息标线。 然后使用全息图标线来对目标进行图案化。 可以在单个图案化步骤中在靶的光致抗蚀剂层中形成三维图案。 这些三维图案可以被填充以形成三维结构,或者用于多表面成像组合物中。 图像的全息图也可以直接地或使用全息图掩模图传递到顶表面成像(TSI)半导体器件的顶部光致抗蚀剂层。 然后可以使用顶部光致抗蚀剂层来用图像对下面的光致抗蚀剂层进行图案化。 下部光致抗蚀剂层用于对该器件的材料层进行图案化。

    Wafer repair system
    54.
    发明授权
    Wafer repair system 有权
    晶圆维修系统

    公开(公告)号:US08180141B2

    公开(公告)日:2012-05-15

    申请号:US11934512

    申请日:2007-11-02

    IPC分类号: G06K9/00 G03F1/00

    摘要: A system for wafer repair, comprising an inspection tool being capable of extracting a wafer image of a semiconductor wafer; a direct-writing tool being capable of locally exposing the semiconductor wafer; and an information processing module configured to compare the wafer image with a reference image and generate data of locations and patterns of defective regions and communicate the data of locations and patterns of defective regions to the direct-writing tool, wherein the reference image comprises a pattern consisting of a scanned image of another die having no defective region.

    摘要翻译: 一种用于晶片修复的系统,包括能够提取半导体晶片的晶片图像的检查工具; 能够局部暴露半导体晶片的直写工具; 以及信息处理模块,被配置为将晶片图像与参考图像进行比较,并生成缺陷区域的位置和图案的数据,并将缺陷区域的位置和图案的数据传送到直接书写工具,其中参考图像包括图案 由没有缺陷区域的另一个芯片的扫描图像组成。

    System and method for photolithography in semiconductor manufacturing
    55.
    发明授权
    System and method for photolithography in semiconductor manufacturing 有权
    半导体制造中的光刻系统及方法

    公开(公告)号:US08178289B2

    公开(公告)日:2012-05-15

    申请号:US12362316

    申请日:2009-01-29

    IPC分类号: G03F7/20 G03F7/26

    摘要: A method for producing a pattern on a substrate includes providing at least one exposure of the pattern onto a layer of the substrate by a higher-precision lithography mechanism and providing at least one exposure of the pattern onto a layer of the substrate by a lower-precision lithography mechanism. The exposures can be done in either order, and additional exposures can be included. The higher-precision lithography mechanism can be immersion lithography and the lower-precision lithography mechanism can be dry lithography.

    摘要翻译: 用于在衬底上产生图案的方法包括通过更高精度的光刻机构将图案的至少一次曝光提供到衬底的层上,并且通过较低精度的光刻机提供图案的至少一次曝光到衬底的层上, 精密光刻机制。 曝光可以以任一顺序完成,并可以包括额外的曝光。 高精度光刻机构可以是浸没式光刻技术,较低精度的光刻机构可以是干式光刻技术。

    Holographic Reticle and Patterning Method
    58.
    发明申请
    Holographic Reticle and Patterning Method 有权
    全息光罩和图案化方法

    公开(公告)号:US20100297538A1

    公开(公告)日:2010-11-25

    申请号:US12768405

    申请日:2010-04-27

    IPC分类号: G03F7/20 G03F1/00

    摘要: A hologram reticle and method of patterning a target. A layout pattern for an image to be transferred to a target is converted into a holographic representation of the image. A hologram reticle is manufactured that includes the holographic representation. The hologram reticle is then used to pattern the target. Three-dimensional patterns may be formed in a photoresist layer of the target in a single patterning step. These three-dimensional patterns may be filled to form three-dimensional structures or else used in a multi-surface imaging composition. The holographic representation of the image may also be transferred to a top photoresist layer of a top surface imaging (TSI) semiconductor device, either directly or using the hologram reticle. The top photoresist layer may then be used to pattern an underlying photoresist layer with the image. The lower photoresist layer is used to pattern a material layer of the device.

    摘要翻译: 全息图掩模版和图案化目标的方法。 要传输到目标的图像的布局图案被转换成图像的全息图。 制造包括全息图的全息标线。 然后使用全息图标线来对目标进行图案化。 可以在单个图案化步骤中在靶的光致抗蚀剂层中形成三维图案。 这些三维图案可以被填充以形成三维结构,或者用于多表面成像组合物中。 图像的全息图也可以直接地或使用全息图掩模图传递到顶表面成像(TSI)半导体器件的顶部光致抗蚀剂层。 然后可以使用顶部光致抗蚀剂层来用图像对下面的光致抗蚀剂层进行图案化。 下部光致抗蚀剂层用于对该器件的材料层进行图案化。

    Utilizing compensation features in photolithography for semiconductor device fabrication
    59.
    发明授权
    Utilizing compensation features in photolithography for semiconductor device fabrication 有权
    利用光刻中的补偿特性进行半导体器件制造

    公开(公告)号:US07811720B2

    公开(公告)日:2010-10-12

    申请号:US11044517

    申请日:2005-01-27

    IPC分类号: G03F1/00

    CPC分类号: G03F1/36 G03F1/70

    摘要: A photomask set includes at least two masks that combine to form a device pattern in a semiconductor device. Orthogonal corners may be produced in a semiconductor device pattern to include one edge defined by a first mask and an orthogonal edge defined by a second mask. The mask set may include a first mask with compensation features and a second mask with void areas overlaying the compensation features when the first and second masks are aligned with one another, such that the compensation features are removed when patterns are successfully formed from the first and second masks. The compensation features alleviate proximity effects during the formation of device features.

    摘要翻译: 光掩模组包括组合以在半导体器件中形成器件图案的至少两个掩模。 可以在半导体器件图案中产生正交角,以包括由第一掩模限定的一个边缘和由第二掩模限定的正交边缘。 掩模组可以包括具有补偿特征的第一掩模和当第一和第二掩模彼此对准时覆盖补偿特征的空隙区域的第二掩模,使得当从第一和第二掩模成功形成图案时,补偿特征被去除 第二个面具 补偿功能可以减轻设备特征形成过程中的邻近效应。

    Method and apparatus to improve lithography throughput
    60.
    发明授权
    Method and apparatus to improve lithography throughput 有权
    提高光刻产量的方法和装置

    公开(公告)号:US07795601B2

    公开(公告)日:2010-09-14

    申请号:US11421590

    申请日:2006-06-01

    IPC分类号: C12Q1/68 H01J40/00

    CPC分类号: G03F7/70991 G03F7/70466

    摘要: The present disclosure provides a lithography apparatus with improved lithography throughput. The lithography apparatus includes a first lens system; a first substrate stage configured to receive a first radiation energy from the first lens system, and designed operable to move a substrate during an exposing process; a second lens system, having a higher resolution than that of the first lens system; and a second substrate stage approximate to the first substrate stage and configured to receive a second radiation energy from the second lens system, and designed operable to receive the substrate from the first substrate stage and move the substrate.

    摘要翻译: 本公开提供了具有改进的光刻产量的光刻设备。 光刻设备包括第一透镜系统; 第一衬底台,被配置为从所述第一透镜系统接收第一辐射能量,并且被设计为可操作以在曝光过程期间移动衬底; 第二透镜系统,具有比第一透镜系统更高的分辨率; 以及第二衬底台,其近似于所述第一衬底台并且被配置为从所述第二透镜系统接收第二辐射能量,并且被设计为可操作以从所述第一衬底台接收所述衬底并移动所述衬底。