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103 条记录 (耗时 0.054 秒)

    Reactive gettering in phase change solders to inhibit oxidation at contact surfaces
    51.
    发明授权
    Reactive gettering in phase change solders to inhibit oxidation at contact surfaces 失效
    相变焊料中的反应性吸附剂以抑制接触表面的氧化

    公开(公告)号：US07727815B2

    公开(公告)日：2010-06-01

    申请号：US10954646

    申请日：2004-09-29

    申请人： Chad A. Kumaus ,  Carl Deppisch ,  Daewoong Suh ,  Ashay A. Dani

    发明人： Chad A. Kumaus ,  Carl Deppisch ,  Daewoong Suh ,  Ashay A. Dani

    IPC分类号： H01L21/44 ,  H01L21/48

    CPC分类号： H01L23/3736 ,  H01L23/053 ,  H01L23/26 ,  H01L2924/15311 ,  H01L2924/16195

    摘要： A method for forming a high thermal conductivity heat sink to IC package interface is disclosed. The method uses reactive getter materials added to a two phase solder system having a phase change temperature that is about the normal operating temperature range of the IC, to bind absorbed and dissolved oxygen in the two phase solder interface material at or near the air to solder surface. Over time this chemical binding action results in an oxide layer at the air to solder surface that slows the rate of oxygen absorption into the solder interface material, and thus reduces the harmful oxidation of the solder to IC package interface and the solder to heat sink interface.

    摘要翻译： 公开了一种用于在IC封装接口形成高导热性散热片的方法。 该方法使用反应性吸气剂材料添加到具有大约IC的正常操作温度范围的相变温度的两相焊料系统中，以将空气中或附近的两相焊料界面材料中的吸收和溶解的氧结合到焊料 表面。 随着时间的推移，这种化学结合作用导致空气到焊料表面的氧化物层，从而减慢了焊接界面材料中的氧吸收速率，从而减少了焊料对IC封装接口和焊料与散热片接口的有害氧化 。

    Microelectronic package, method of manufacturing same, and system containing same
    54.
    发明申请
    Microelectronic package, method of manufacturing same, and system containing same 审中-公开
    微电子封装，制造方法和含有该微电子封装的系统

    公开(公告)号：US20080150127A1

    公开(公告)日：2008-06-26

    申请号：US11644683

    申请日：2006-12-21

    申请人： Nachiket Raravikar ,  Leonel Arana ,  Daewoong Suh

    发明人： Nachiket Raravikar ,  Leonel Arana ,  Daewoong Suh

    IPC分类号： H01L23/36 ,  H01L21/58

    CPC分类号： H01L23/373 ,  H01L23/3677 ,  H01L23/42 ,  H01L2224/73253 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/16152

    摘要： A microelectronic package includes a substrate (110, 210, 310, 410, 510, 731), a die (120, 220, 320, 420, 520, 732), and a heat spreading region (130, 230, 330, 430, 530, 733). The die, which has an active side (121, 221, 321, 421, 521) and a passive side (122, 222, 322, 422, 522) located opposite the active side, is located over the substrate, and the heat spreading region is adjacent to the passive side of the die. The heat spreading region includes a composite (135, 235, 335, 435, 535) of nanotubes and a thermally conducting material.

    摘要翻译： 微电子封装包括衬底（110,210,310,410,510,731），管芯（120,220,320,420,520,732）和散热区域（130,230,330,430,430） 530，733）。 具有活动侧（121,221,321,421,521）和与活动侧相对的无源侧（122,222,322,422,522）的管芯位于衬底上方，并且散热 区域与模具的被动侧相邻。 散热区域包括纳米管和导热材料的复合材料（135,235,335,435,535）。

    Soldering an electronics package to a motherboard
    55.
    发明授权
    Soldering an electronics package to a motherboard 有权
    将电子封装焊接到主板上

    公开(公告)号：US07357293B2

    公开(公告)日：2008-04-15

    申请号：US10808192

    申请日：2004-03-24

    申请人： Daewoong Suh

    发明人： Daewoong Suh

    IPC分类号： B23K31/02

    CPC分类号： H05K3/3436 ,  H05K3/3463 ,  H05K2201/10992 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49147

    摘要： In some example embodiments, a method includes engaging a first contact on a motherboard with a second contact on an electronic package. A portion of one of the first and second contacts is covered with an interlayer that has a lower melting temperature than both of the first and second contacts. The method further includes bonding the first contact to the second contact by melting the interlayer to diffuse the interlayer into the first and second contacts. The bonded first and second contacts have a higher melting temperature than the interlayer before melting. In other example embodiments, an electronic assembly includes a motherboard having a first contact that is bonded to a second contact on an electronic package. An interlayer is diffused within the first and second contacts such that they have a higher melting temperature than the interlayer before the interlayer is diffused into the first and second contacts.

    摘要翻译： 在一些示例性实施例中，一种方法包括使主板上的第一触点与电子封装上的第二触点接合。 第一和第二触点之一的一部分被中间层覆盖，该中间层具有比第一和第二触点两者更低的熔化温度。 该方法还包括通过熔化中间层将第一接触件接合到第二接触件，以将中间层扩散到第一和第二接触件中。 接合的第一和第二触点在熔融之前具有比中间层更高的熔融温度。 在其他示例性实施例中，电子组件包括具有接合到电子封装上的第二触点的第一触点的母板。 中间层在第一和第二触点内扩散，使得它们在中间层扩散到第一和第二触点之前具有比中间层更高的熔化温度。

    ROOM TEMPERATURE JOINING PROCESS WITH PIEZOELECTRIC CERAMIC-ACTIVATED REACTIVE MULTILAYER FOIL
    57.
    发明申请
    ROOM TEMPERATURE JOINING PROCESS WITH PIEZOELECTRIC CERAMIC-ACTIVATED REACTIVE MULTILAYER FOIL 审中-公开
    压电陶瓷活化多层膜的室温加工工艺

    公开(公告)号：US20070235500A1

    公开(公告)日：2007-10-11

    申请号：US11278365

    申请日：2006-03-31

    申请人： Daewoong Suh ,  Yongki Min

    发明人： Daewoong Suh ,  Yongki Min

    IPC分类号： A47J36/02

    CPC分类号： B23K1/0006 ,  B23K20/165

    摘要： Apparatus comprising a multilayered reactive foil preform including alternating layers of first and second materials deposited on foils. The layers also include piezoelectric ceramic particles to provide an electrical stimulus when pressure is applied to activate an exothermic reaction between the first and second materials.

    摘要翻译： 包括多层反应箔预制件的装置，其包括沉积在箔上的第一和第二材料的交替层。 这些层还包括压电陶瓷颗粒，以在施加压力以激活第一和第二材料之间的放热反应时提供电刺激。

    Bulk metallic glass solder material
    60.
    发明申请
    Bulk metallic glass solder material 有权
    散装金属玻璃焊料

    公开(公告)号：US20070034305A1

    公开(公告)日：2007-02-15

    申请号：US11203546

    申请日：2005-08-12

    申请人： Daewoong Suh

    发明人： Daewoong Suh

    IPC分类号： C22C45/00 ,  B23K1/19

    CPC分类号： B23K1/0016 ,  C22C45/00 ,  H05K3/3463 ,  H05K3/3494

    摘要： High strength, reliable bulk metallic glass (BMG) solder materials formed from alloys possessing deep eutectics with asymmetric liquidous slopes. BMG solder materials are stronger and have a higher elastic modulus than, and therefore are less likely than crystalline solder materials to damage fragile low k interlayer dielectric (ILD) materials due to thermal stress in materials with different coefficients of thermal expansion (CTE). BMG solder materials may physically, electrically, or thermally couple a feature to another feature, or any combination thereof. For example, in an embodiment of the invention, a BMG solder material may physically and electrically couple an electronic component to a printed circuit board. In another embodiment of the invention, a BMG solder material may physically and thermally couple an integrated heat sink to a semiconductor device. Many embodiments of a BMG solder material are also lead-free, so they comply with lead-free product requirements, while providing a better solution than other lead-free solder materials such as tin-silver-copper.

    摘要翻译： 高强度，可靠的大块金属玻璃（BMG）焊料，由具有非对称液相斜率的深共晶体的合金形成。 BMG焊料材料比其材料具有不同的热膨胀系数（CTE）时的热应力更强，具有更高的弹性模量，因此不太可能结晶焊料材料损坏脆性低k层间电介质（ILD）材料。 BMG焊料可以物理，电或热耦合特征到另一特征，或其任何组合。 例如，在本发明的一个实施例中，BMG焊料材料可以将电子部件物理和电耦合到印刷电路板。 在本发明的另一个实施例中，BMG焊料材料可以将集成散热器物理和热耦合到半导体器件。 BMG焊料材料的许多实施例也是无铅的，因此它们符合无铅产品要求，同时提供比其它无铅焊料材料如锡 - 银 - 铜更好的解决方案。