公开(公告)号：US5371654A

公开(公告)日：1994-12-06

申请号：US963346

申请日：1992-10-19

申请人： Brian S. Beaman ,  Fuad E. Doany ,  Keith E. Fogel ,  James L. Hedrick, Jr. ,  Paul A. Lauro ,  Maurice H. Norcott ,  John J. Ritsko ,  Leathen Shi ,  Da-Yuan Shih ,  George F. Walker

发明人： Brian S. Beaman ,  Fuad E. Doany ,  Keith E. Fogel ,  James L. Hedrick, Jr. ,  Paul A. Lauro ,  Maurice H. Norcott ,  John J. Ritsko ,  Leathen Shi ,  Da-Yuan Shih ,  George F. Walker

IPC分类号： H01L23/52 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/28 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H01L25/07 ,  H01L25/18 ,  H05K7/00

CPC分类号： G01R1/07371 ,  G01R1/07307 ,  G01R1/07314 ,  G01R1/07342 ,  G01R3/00 ,  G01R31/2886 ,  H01L23/49827 ,  H01L23/5384 ,  H01L25/0652 ,  G01R1/06711 ,  G01R1/0675 ,  G01R1/07378 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/45164 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/78301 ,  H01L2224/85205 ,  H01L2224/85214 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/1627 ,  H01L2924/19107 ,  H01L2924/3011 ,  Y10S29/029 ,  Y10T29/49004 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49158 ,  Y10T29/49162 ,  Y10T29/49192 ,  Y10T29/53174

摘要： The present invention is directed to a structure for packaging electronic devices, such as semiconductor chips, in a three dimensional structure which permits electrical signals to propagate both horizontally and vertically. The structure is formed from a plurality of assemblies. Each assembly is formed from a substrate having disposed on at least one surface a plurality of electronic devices. Each assembly is disposed in a stack of adjacent assemblies. Between adjacent assemblies there is an electrical interconnection electrically interconnecting each assembly. The electrical interconnection formed from an elastomeric interposer having a plurality of apertures extending therethrough. The array of apertures corresponds to the array of electronic devices on the substrates. The aperture and electrical interconnection is disposed over the array of electronic devices so that the electrical interconnection between adjacent electronic devices. The stack of assemblies is compressed thereby compressing the electrical interconnection between adjacent assemblies. Methods for fabricating the electrical interconnection as a stand alone elastomeric sheet are described.

摘要翻译： 本发明涉及用于将三维结构中的诸如半导体芯片的电子器件封装在一起的结构，其允许电信号水平和垂直地传播。 该结构由多个组件形成。 每个组件由在多个电子装置的至少一个表面上设置的基板形成。 每个组件设置在相邻组件的堆叠中。 在相邻组件之间存在电互连，每个组件电连接。 由具有延伸穿过其中的多个孔的弹性体插入件形成的电互连。 孔阵列对应于基片上的电子器件阵列。 孔和电互连布置在电子器件阵列上，使得相邻电子器件之间的电互连。 组合堆叠被压缩，从而压缩相邻组件之间的电互连。 描述了用于制造作为独立弹性片的电互连的方法。

公开(公告)号：US5239447A

公开(公告)日：1993-08-24

申请号：US760038

申请日：1991-09-13

申请人： Paul W. Cotues ,  Paul A. Moskowitz ,  Philip Murphy ,  Mark B. Ritter ,  George F. Walker

发明人： Paul W. Cotues ,  Paul A. Moskowitz ,  Philip Murphy ,  Mark B. Ritter ,  George F. Walker

IPC分类号： H01L25/18 ,  H01L25/065 ,  H01L25/07 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K7/20

CPC分类号： H05K3/366 ,  H01L24/49 ,  H01L25/0652 ,  H01L25/0657 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/4911 ,  H01L2224/49175 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06579 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L24/45 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H05K2201/0314 ,  H05K2201/10484 ,  H05K3/325 ,  H05K3/3442

摘要： An electronic device packaging structure is described wherein an electronic device is electrically connected to a substrate wherein the electronic device subtends a non-normal angle with respect to the substrate. In a more specific embodiment, a plurality of electronic devices are stacked at offset with respect to each other to expose contact locations on the surface of each electronic device at an edge of each electronic device to form a stepped surface exposing a plurality of electronic device contact locations. This surface is disposed against a substrate having a plurality of contact locations thereon. The electronic device contact locations can be electrically interconnected to the substrate contact locations by solder mounds or alternatively by a cylindrical shaped elastomeric body having metallization bands with a spacing corresponding to the electronic device contact locations. The elastomeric body is pressed between the edge of the stacked electronic devices having the contact locations thereon and substrate surface to form electrical interconnections between electronic device contact locations and substrate contact locations through the electrically conducting bands. The stacked electronic devices can be thermally connected to a heat dissipation member. The stacked electronic devices can have a stepped surface embodying an enhanced area for transfer of heat from the electronic device stack to the heat dissipation member.

公开(公告)号：US5200112A

公开(公告)日：1993-04-06

申请号：US718079

申请日：1991-06-20

申请人： Marie Angelopoulos ,  Wu-Song Huang ,  Richard D. Kaplan ,  Marie-Annick Le Corre ,  Stanley E. Perreault ,  Jane M. Shaw ,  Michel R. Tissier ,  George F. Walker

发明人： Marie Angelopoulos ,  Wu-Song Huang ,  Richard D. Kaplan ,  Marie-Annick Le Corre ,  Stanley E. Perreault ,  Jane M. Shaw ,  Michel R. Tissier ,  George F. Walker

IPC分类号： C08G61/12 ,  H01B1/12 ,  H01J29/86 ,  H01L23/498 ,  H01L23/60 ,  H05K9/00

CPC分类号： H05K9/0079 ,  C08G61/12 ,  H01B1/125 ,  H01B1/127 ,  H01B1/128 ,  H01J29/868 ,  H01L23/49894 ,  H01L23/60 ,  H05K9/0081 ,  H01L2924/0002

摘要： Structures containing conducting polymers and methods of fabrication thereof. Electrical conductivity can be induced in polymers selected from the group of substituted and unsubstituted polyanilines, polyparaphenylenvinyles, substituted and unsubstituted polythiophenes substituted and unsubstituted poly-p-phenylene sulfides, substituted polyfuranes, substituted polypyrroles, substituted polyselenophene, polyacetylines formed from soluble precursors, combinations thereof and blends thereof with other polymers. The polymer contains a doping precursor, selected from the group of onium salts, iodonium salts, triflate salts, borate salts and tosylate salts and sulfonoxylimides. Conductivity can be selectively induced in the polymer by selectivly doping upon selective exposure to a source of energy such as electromagnetic radiation, an electron beam and heat. The electrically conductive polymers of the present invention are useful as electron discharge layers for electron beam applications, such as, SEM observations, as electromagnetic interference coatings on dielectric surfaces and as electron beam resist which acts as a discharge layer.

摘要翻译： 含有导电聚合物的结构及其制造方法。 可以在选自取代和未取代的聚苯胺，聚对苯二烯基乙烯基，取代和未取代的聚噻吩，取代和未取代的聚对苯硫醚，取代的聚呋喃，取代的聚吡咯，取代的聚硒酚，由可溶性前体形成的聚乙炔，其组合 及其与其它聚合物的共混物。 聚合物含有选自鎓盐，碘鎓盐，三氟甲磺酸盐，硼酸盐和甲苯磺酸盐和磺酰氧基酰亚胺的掺杂前体。 可以通过在选择性地暴露于诸如电磁辐射，电子束和热的能量源之间选择性地掺杂在聚合物中选择性地诱导电导率。 本发明的导电聚合物可用作用于电子束应用的电子放电层，例如SEM观察，作为电介质表面上的电磁干扰涂层和用作放电层的电子束抗蚀剂。