公开(公告)号：US08050011B2

公开(公告)日：2011-11-01

申请号：US12417461

申请日：2009-04-02

申请人： Ubaldo Mastromatteo

发明人： Ubaldo Mastromatteo

IPC分类号： H01L21/00 ,  H01G4/00

CPC分类号： B81C1/00269 ,  B81B2207/093 ,  B81C1/00301 ,  H01L21/50 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/10135 ,  H01L2224/10165 ,  H01L2224/8014 ,  H01L2224/81136 ,  H01L2224/81139 ,  H01L2224/8114 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01032 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2224/05655 ,  H01L2224/05666

摘要： A process for connecting two bodies forming parts of an electromechanical, fluid and optical microsystem, wherein a welding region is formed on a first body; an electrically conductive region and a spacing region are formed on a second body; the spacing region extends near the electrically conductive region and has a height smaller than the electrically conductive region. One of the first and second bodies is turned upside down on the other, and the two bodies are welded together by causing the electrically conductive region to melt so that it adheres to the welding region and collapses until its height becomes equal to that of the spacing region. Thereby it is possible to seal active parts or micromechanical structures with respect to the outside world, self-align the two bodies during bonding, obtain an electrical connection between the two bodies, and optically align two optical structures formed on the two bodies.

摘要翻译： 一种用于连接形成机电，流体和光学微系统的部件的两个主体的方法，其中在第一主体上形成焊接区域; 在第二主体上形成导电区域和间隔区域; 间隔区域在导电区域附近延伸并具有小于导电区域的高度。 第一和第二主体中的一个被另一个上下颠倒，并且两个主体通过使导电区域熔化而被焊接在一起，使得它粘附到焊接区域并且塌陷，直到它的高度等于间隔的高度 地区。 因此，可以相对于外界来密封活动部件或微机械结构，在接合期间自对准两个主体，获得两个主体之间的电连接，并且光学对准在两个主体上形成的两个光学结构。

公开(公告)号：US08018819B2

公开(公告)日：2011-09-13

申请号：US12117617

申请日：2008-05-08

申请人： Bruno Murari ,  Ubaldo Mastromatteo ,  Giulio Ricotti

发明人： Bruno Murari ,  Ubaldo Mastromatteo ,  Giulio Ricotti

IPC分类号： G11B9/00

CPC分类号： H02K41/0356 ,  G11B9/1454

摘要： A microelectromechanical device that includes a fixed supporting body, at least one semiconductor body, which is movable with respect to the fixed supporting body, and at least one micromotor for moving the semiconductor body with respect to the fixed supporting body, the micromotor having at least one permanent magnet and a coil, which are coupled together and are movable with respect to one another. A ferromagnetic guide is coupled to the magnet and is shaped so as to concentrate lines of magnetic field generated by the magnet towards the coil.

摘要翻译： 一种微机电装置，其包括固定支撑体，至少一个半导体本体，其相对于固定支撑体可移动;以及至少一个微电机，用于相对于固定支撑体移动半导体本体，所述微电机至少具有 一个永磁体和线圈，它们联接在一起并且可相对于彼此移动。 铁磁引导件耦合到磁体并且被成形为将磁体产生的磁场线集中到线圈。

公开(公告)号：US20110209524A1

公开(公告)日：2011-09-01

申请号：US13016086

申请日：2011-01-28

申请人： Federico Giovanni Ziglioli ,  Amedeo Maierna ,  Flavio Francesco Villa ,  Ubaldo Mastromatteo ,  Gabriele Barlocchi

发明人： Federico Giovanni Ziglioli ,  Amedeo Maierna ,  Flavio Francesco Villa ,  Ubaldo Mastromatteo ,  Gabriele Barlocchi

IPC分类号： G01N33/00

CPC分类号： G01N33/0009

摘要： A cartridge-like chemical sensor is formed by a housing having a base and a cover fixed to the base and provided with an input opening, an output hole and a channel for a gas to be analyzed. The channel extends in the cover between the input opening and the output hole and faces a printed circuit board carrying an integrated circuit having a sensitive region open toward the channel and of a material capable to bind with target chemicals in the gas to be analyzed. A fan is arranged in the housing, downstream of the integrated device, for sucking the gas after being analyzed, and is part of a thermal control system for the integrated circuit.

摘要翻译： 盒式化学传感器由壳体形成，壳体具有固定到基座的基部和盖，并且设置有用于待分析气体的输入开口，输出孔和通道。 通道在输入开口和输出孔之间的盖中延伸，并且面向承载具有朝向通道开口的敏感区域的集成电路的印刷电路板和能够与要分析的气体中的目标化学物质结合的材料。 在集成装置的下游的壳体内设置风扇，用于在分析后吸入气体，并且是集成电路的热控制系统的一部分。

公开(公告)号：US07906321B2

公开(公告)日：2011-03-15

申请号：US11009171

申请日：2004-12-10

申请人： Ubaldo Mastromatteo ,  Flavio Villa ,  Gabriele Barlocchi

发明人： Ubaldo Mastromatteo ,  Flavio Villa ,  Gabriele Barlocchi

IPC分类号： C12M1/34 ,  C12M3/00

CPC分类号： G01N21/6428 ,  B01J19/0093 ,  B01J2219/0097 ,  B01L3/502707 ,  B01L3/502715 ,  B01L7/52 ,  B01L2200/12 ,  B01L2300/0654 ,  B01L2300/0816 ,  G01N21/6454

摘要： An integrated semiconductor chemical microreactor for real-time polymerase chain reaction (PCR) monitoring, has a monolithic body of semiconductor material; a number of buried channels formed in the monolithic body; an inlet trench and an outlet trench for each buried channel; and a monitoring trench for each buried channel, extending between the inlet and outlet trenches thereof from the top surface of the monolithic body to the respective buried channel. Real-time PCR monitoring is carried out by channeling light beams into the buried channels, possibly through one of the inlet or outlet trenches, whereby the light beams impinge on the fluid therein and collecting the emergent light coming out from the monitoring trench.

摘要翻译： 一种用于实时聚合酶链反应（PCR）监测的集成半导体化学微反应器，具有半导体材料的整体; 形成在整体式主体中的多个埋入通道; 每个掩埋通道的入口沟槽和出口沟槽; 以及用于每个掩埋通道的监测沟槽，其在其入口和出口沟槽之间从单体主体的顶表面延伸到相应的掩埋通道。 通过将光束通过入口或出口沟槽中的一个引入到掩埋通道中，从而使光束照射在其中的流体并收集从监测沟槽出来的出射光，从而进行实时PCR监测。

公开(公告)号：US07595223B2

公开(公告)日：2009-09-29

申请号：US11766654

申请日：2007-06-21

申请人： Ubaldo Mastromatteo ,  Mauro Bombonati ,  Daniela Morin ,  Marta Mottura ,  Mauro Marchi

发明人： Ubaldo Mastromatteo ,  Mauro Bombonati ,  Daniela Morin ,  Marta Mottura ,  Mauro Marchi

IPC分类号： H01L21/20 ,  H01L21/00 ,  H01L21/46

CPC分类号： B81C1/00269 ,  H01L21/185 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L24/94 ,  H01L2224/0231 ,  H01L2224/02313 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05181 ,  H01L2224/05624 ,  H01L2224/10126 ,  H01L2224/10135 ,  H01L2224/13021 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13124 ,  H01L2224/13164 ,  H01L2224/81136 ,  H01L2224/81139 ,  H01L2224/812 ,  H01L2224/81201 ,  H01L2224/81385 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/29099 ,  H01L2924/013

摘要： A process for bonding two distinct substrates that integrate microsystems, including the steps of forming micro-integrated devices in at least one of two substrates using micro-electronic processing techniques and bonding the substrates. Bonding is performed by forming on a first substrate bonding regions of deformable material and pressing the substrates one against another so as to deform the bonding regions and to cause them to react chemically with the second substrate. The bonding regions are preferably formed by a thick layer of a material chosen from among aluminum, copper and nickel, covered by a thin layer of a material chosen from between palladium and platinum. Spacing regions ensure exact spacing between the two wafers.

摘要翻译： 一种用于结合集成微系统的两个不同基板的方法，包括使用微电子处理技术和粘合基板在两个基板中的至少一个中形成微集成器件的步骤。 通过在第一基板上形成接合可变形材料的区域并将基板压在另一个上以使接合区域变形并使其与第二基板发生化学反应来进行接合。 接合区域优选由选自铝，铜和镍的材料的厚层形成，被选自钯和铂之间的材料的薄层覆盖。 间隔区确保两个晶片之间的精确间距。

公开(公告)号：US07578196B2

公开(公告)日：2009-08-25

申请号：US12018068

申请日：2008-01-22

申请人： Giulio Riccoti ,  Marco Morelli ,  Luigi Della Torre ,  Andrea Lorenzo Vitali ,  Ubaldo Mastromatteo

发明人： Giulio Riccoti ,  Marco Morelli ,  Luigi Della Torre ,  Andrea Lorenzo Vitali ,  Ubaldo Mastromatteo

IPC分类号： G01L9/00

CPC分类号： G01L9/0054 ,  G01L9/0045 ,  G01L15/00

摘要： In a pressure sensor with double measuring scale: a monolithic body of semiconductor material has a first main surface, a bulk region and a sensitive portion upon which pressure acts; a cavity is formed in the monolithic body and is separated from the first main surface by a membrane, which is flexible and deformable as a function of the pressure, and is arranged inside the sensitive portion and is surrounded by the bulk region; a low-pressure detecting element of the piezoresistive type, sensitive to first values of pressure, is integrated in the membrane and has a variable resistance as a function of the deformation of the membrane; in addition, a high-pressure detecting element, also of a piezoresistive type, is formed in the bulk region inside the sensitive portion and has a variable resistance as a function of the pressure. The high-pressure detecting element is sensitive to second values of pressure.

摘要翻译： 在具有双重测量尺的压力传感器中：半导体材料的整体主体具有第一主表面，主体区域和压力作用在其上的敏感部分; 在整体式主体中形成空腔，并通过作为压力的函数而变形的柔性且可变形的膜与第一主表面分离，并且布置在敏感部分的内部并被体区域包围; 对第一压力值敏感的压阻型低压检测元件集成在膜​​中，并具有作为膜的变形的函数的可变电阻; 此外，在敏感部分内部的本体区域中形成压阻型高压检测元件，并且具有作为压力的函数的可变电阻。 高压检测元件对第二压力值敏感。

公开(公告)号：US07479659B2

公开(公告)日：2009-01-20

申请号：US10446589

申请日：2003-05-27

申请人： Carlo Cognetti ,  Ubaldo Mastromatteo

发明人： Carlo Cognetti ,  Ubaldo Mastromatteo

IPC分类号： H01L27/15

CPC分类号： H01L31/18 ,  H01L31/0203 ,  H01L31/02325 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05568 ,  H01L2224/056 ,  H01L2224/11 ,  H01L2224/29011 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2224/83 ,  H01L2224/05099

摘要： A process for manufacturing encapsulated optical sensors, including the steps of: forming a plurality of mutually spaced optical sensors in a wafer of semiconductor material; bonding a plate of transparent material to the wafer so as to seal the optical sensors; and dividing the wafer into a plurality of dies, each comprising an optical sensor and a respective portion of the plate.

摘要翻译： 一种用于制造封装的光学传感器的方法，包括以下步骤：在半导体材料的晶片中形成多个相互间隔的光学传感器; 将透明材料板粘合到晶片上以便密封光学传感器; 并将晶片分成多个模具，每个模具包括光学传感器和板的相应部分。

公开(公告)号：US07239487B2

公开(公告)日：2007-07-03

申请号：US10601332

申请日：2003-06-20

申请人： Ubaldo Mastromatteo ,  Bruno Murari ,  Paolo Ferrari ,  Simone Sassolini

发明人： Ubaldo Mastromatteo ,  Bruno Murari ,  Paolo Ferrari ,  Simone Sassolini

IPC分类号： G11B5/56

CPC分类号： B81B3/0021 ,  H02N1/006

摘要： A micro-electro-mechanical device formed by a body of semiconductor material having a thickness and defining a mobile part and a fixed part. The mobile part is formed by a mobile platform, supporting arms extending from the mobile platform to the fixed part, and by mobile electrodes fixed to the mobile platform. The fixed part has fixed electrodes facing the mobile electrodes, a first biasing region fixed to the fixed electrodes, a second biasing region fixed to the supporting arms, and an insulation region of insulating material extending through the entire thickness of the body. The insulation region insulates electrically at least one between the first and the second biasing regions from the rest of the fixed part.

摘要翻译： 由具有厚度并限定可移动部分和固定部分的半导体材料体形成的微电子机械装置。 可移动部分由移动平台，从移动平台延伸到固定部分的支撑臂，以及固定到移动平台的移动电极形成。 固定部分具有面向移动电极的固定电极，固定到固定电极的第一偏置区域，固定到支撑臂的第二偏压区域以及延伸穿过主体整个厚度的绝缘材料的绝缘区域。 绝缘区域在第一和第二偏压区域之间至少一个与固定部件的其余部分绝缘。

公开(公告)号：US20050157372A1

公开(公告)日：2005-07-21

申请号：US11063483

申请日：2005-02-22

申请人： Bruno Murari ,  Ubaldo Mastromatteo ,  Paolo Ferrari

发明人： Bruno Murari ,  Ubaldo Mastromatteo ,  Paolo Ferrari

IPC分类号： G02B26/00 ,  G02B27/09 ,  H01L31/0232 ,  H01L31/0328

CPC分类号： G02B27/0994

摘要： A micromachined device made of semiconductor material is formed by: a semiconductor body; an intermediate layer set on top of the semiconductor body; and a substrate, set on top of the intermediate layer. A cavity extends in the intermediate layer and is delimited laterally by bottom fixed regions, at the top by the substrate, and at the bottom by the semiconductor body. The bottom fixed regions form fixed electrodes, which extend in the intermediate layer towards the inside of the cavity. An oscillating element is formed in the substrate above the cavity and is separated from top fixed regions through trenches, which extend throughout the thickness of the substrate. The oscillating element is formed by an oscillating platform set above the cavity, and by mobile electrodes, which extend towards the top fixed regions in a staggered way with respect to the fixed electrodes. The fixed electrodes and mobile electrodes are thus comb-fingered in plan view but formed on different levels.

摘要翻译： 由半导体材料制成的微机械加工装置由半导体本体形成， 设置在半导体本体顶部的中间层; 以及设置在中间层顶部的基板。 空腔在中间层中延伸并且由底部固定区域在顶部限定，在顶部由衬底限定，并且在底部由半导体本体限定。 底部固定区域形成固定电极，其在中间层中延伸到空腔的内部。 振荡元件形成在空腔上方的衬底中，并且通过沟槽与顶部固定区域分离，其延伸贯穿衬底的厚度。 振荡元件由设置在空腔上方的振荡平台和通过相对于固定电极以交错方式朝着顶部固定区域延伸的移动电极形成。 因此，固定电极和移动电极在平面图中梳理，但形成在不同的水平上。

公开(公告)号：US06784522B2

公开(公告)日：2004-08-31

申请号：US09874381

申请日：2001-06-04

申请人： Bruno Murari ,  Ubaldo Mastromatteo ,  Benedetto Vigna

发明人： Bruno Murari ,  Ubaldo Mastromatteo ,  Benedetto Vigna

IPC分类号： H01L2972

CPC分类号： H01L24/01 ,  H01L23/3157 ,  H01L23/36 ,  H01L23/3735 ,  H01L23/4827 ,  H01L2224/274 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082

摘要： The electronic device is formed in a die including a body of semiconductor material having a first face covered by a covering structure and a second face. An integral thermal spreader of metal is grown galvanically on the second face during the manufacture of a wafer, prior to cutting into dice. The covering structure comprises a passivation region and a protective region of opaque polyimide; the protective region and the passivation region are opened above the contact pads for the passage of leads.

摘要翻译： 电子器件形成在包括半导体材料体的模具中，该半导体材料体具有被覆盖结构覆盖的第一面和第二面。 在切割成骰子之前，在制造晶片期间，金属的整体散热器在第二面上电镀生长。 覆盖结构包括钝化区域和不透明聚酰亚胺的保护区域; 保护区域和钝化区域在接触焊盘上方打开以引导引线通过。