公开(公告)号：US20060274562A1

公开(公告)日：2006-12-07

申请号：US11146495

申请日：2005-06-06

申请人： Paul Coteus ,  Kevin Gower ,  Shawn Hall ,  Dale Pearson ,  Gareth Hougham

发明人： Paul Coteus ,  Kevin Gower ,  Shawn Hall ,  Dale Pearson ,  Gareth Hougham

IPC分类号： G11C5/04

CPC分类号： G11C5/04 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15192 ,  H05K1/181 ,  H05K2201/10159 ,  H01L2224/0401

摘要： A Planar Memory Module (PAMM) device comprising a generally planar card comprising a first side and a second side, the first side having a plurality of couplings and the second side having a plurality of connectors, a plurality of memory devices coupled to the card via a first portion of the plurality of couplings, and at least one hub chip coupled to the card via a second portion of the plurality of couplings. Each of the plurality of couplings is connected to an associated one of the plurality of connectors.

公开(公告)号：US20060009050A1

公开(公告)日：2006-01-12

申请号：US11220324

申请日：2005-09-06

申请人： Gareth Hougham ,  Keith Fogel ,  Joanna Rosner ,  Paul Lauro ,  Sherif Goma ,  Joseph Zinter

发明人： Gareth Hougham ,  Keith Fogel ,  Joanna Rosner ,  Paul Lauro ,  Sherif Goma ,  Joseph Zinter

IPC分类号： H01R12/00

CPC分类号： H05K7/1069 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01R12/52 ,  H05K3/326 ,  H05K3/4092 ,  H05K3/42 ,  H05K2201/10378 ,  H05K2203/308 ,  Y10T29/49147 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49204 ,  Y10T29/49222 ,  H01L2924/00

摘要： An interposer having one or more hollow electrical contact buttons disposed in a carrier. The interposer is formed by disposing sacrificial posts in vias of the carrier. The electrical contact buttons are formed on the sacrificial posts by a metallizing process in desired pattern using a mask. The sacrificial posts are made of a material that thermally decomposes upon application of heat without altering the carrier or the electrical contact buttons.

公开(公告)号：US06783717B2

公开(公告)日：2004-08-31

申请号：US10127373

申请日：2002-04-22

申请人： Gareth Hougham ,  Peter Fryer ,  Ronald Nunes ,  Mary Beth Rothwell

发明人： Gareth Hougham ,  Peter Fryer ,  Ronald Nunes ,  Mary Beth Rothwell

IPC分类号： B29C3340

CPC分类号： B29C35/0888 ,  B29C35/007 ,  B29C35/18 ,  B29C2035/0827 ,  B29C2791/004 ,  B29K2021/00 ,  B29K2105/0002

摘要： A process of making a high precision microcontact printing stamp in which an elastomeric monomer or oligomer is introduced into a mold wherein a photoresist master imprinted with a microcircuit design in negative relief is predisposed. The monomer or oligomer is cured at a temperature no higher than about ambient temperature whereby a distortion-free microcontact printing stamp having the microcircuit design of the photoresist master in positive relief is formed.

摘要翻译： 制造高精度微接触印刷印模的方法，其中将弹性体单体或低聚物引入模具中，其中用负浮雕的微电路设计印刷的光致抗蚀剂母版是易于发生的。 单体或低聚物在不高于约环境温度的温度下固化，由此形成具有正浮雕的光致抗蚀剂母版的微电路设计的无变形微接触印刷印模。

公开(公告)号：US08651877B2

公开(公告)日：2014-02-18

申请号：US13588585

申请日：2012-08-17

申请人： Gareth Hougham ,  Gerard McVicker ,  Xiaoxiong Gu

发明人： Gareth Hougham ,  Gerard McVicker ,  Xiaoxiong Gu

IPC分类号： H01R12/00

CPC分类号： H01L24/14 ,  H01L21/486 ,  H01L23/48 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/17 ,  H01L24/81 ,  H01L25/50 ,  H01L2224/11622 ,  H01L2224/1182 ,  H01L2224/13014 ,  H01L2224/13017 ,  H01L2224/1607 ,  H01L2224/16145 ,  H01L2224/81101 ,  H01L2224/81208 ,  H01L2224/81899 ,  H01L2225/06513 ,  H01L2924/0002 ,  H01L2924/12042 ,  H01L2924/15313 ,  H01L2924/15323 ,  H01L2924/15333 ,  H01R13/02 ,  H01R13/2421 ,  H01R43/16 ,  H05K3/064 ,  H05K3/326 ,  H05K3/4092 ,  H05K2201/0355 ,  H05K2201/0382 ,  H05K2201/10265 ,  H05K2201/10378 ,  Y10T29/49126 ,  Y10T29/49208 ,  Y10T29/49218 ,  Y10T29/49222 ,  Y10T29/49224 ,  H01L2924/00

摘要： A structure and method for manufacturing the same for manufacturing a contact structure for microelectronics manufacturing including the steps of forming first and second metal sheets to form a plurality of outwardly extending bump each defining a cavity. Symmetrically mating the first and second metal sheets in opposing relation to each other to form upper and lower bumps each defining an enclosure therebetween wherein the mated first and second sheets form a contact structure. Coating the contact structure with an insulating material, and fabricating helix shaped contacts from upper and lower bumps. The helix shaped contacts having first and second portions being in minor image relationship to each other.

摘要翻译： 一种用于制造用于微电子制造的接触结构的结构和方法，包括以下步骤：形成第一和第二金属片以形成多个向外延伸的凸起，每个限定腔。 将第一和第二金属板彼此相对地对称地配合，以形成每个限定其间的外壳的上凸块和下凸块，其中配合的第一和第二板形成接触结构。 用绝缘材料涂覆接触结构，并从上部和下部凸块制造螺旋形接触。 具有第一和第二部分的螺旋形接触件彼此具有小的图像关系。

公开(公告)号：US20110111647A1

公开(公告)日：2011-05-12

申请号：US12614231

申请日：2009-11-06

申请人： Gareth Hougham ,  Gerard McVicker ,  Xiaoxiong Gu

发明人： Gareth Hougham ,  Gerard McVicker ,  Xiaoxiong Gu

IPC分类号： H01R13/02 ,  H01R43/00

CPC分类号： H01L24/14 ,  H01L21/486 ,  H01L23/48 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/17 ,  H01L24/81 ,  H01L25/50 ,  H01L2224/11622 ,  H01L2224/1182 ,  H01L2224/13014 ,  H01L2224/13017 ,  H01L2224/1607 ,  H01L2224/16145 ,  H01L2224/81101 ,  H01L2224/81208 ,  H01L2224/81899 ,  H01L2225/06513 ,  H01L2924/0002 ,  H01L2924/12042 ,  H01L2924/15313 ,  H01L2924/15323 ,  H01L2924/15333 ,  H01R13/02 ,  H01R13/2421 ,  H01R43/16 ,  H05K3/064 ,  H05K3/326 ,  H05K3/4092 ,  H05K2201/0355 ,  H05K2201/0382 ,  H05K2201/10265 ,  H05K2201/10378 ,  Y10T29/49126 ,  Y10T29/49208 ,  Y10T29/49218 ,  Y10T29/49222 ,  Y10T29/49224 ,  H01L2924/00

摘要： A structure and method for manufacturing the same for manufacturing a contact structure for microelectronics manufacturing including the steps of forming first and second metal sheets to form a plurality of outwardly extending bump each defining a cavity. Symmetrically mating the first and second metal sheets in opposing relation to each other to form upper and lower bumps each defining an enclosure therebetween wherein the mated first and second sheets form a contact structure. Coating the contact structure with an insulating material, and fabricating helix shaped contacts from upper and lower bumps. The helix shaped contacts having first and second portions being in mirror image relationship to each other.

摘要翻译： 一种用于制造用于微电子制造的接触结构的结构和方法，包括以下步骤：形成第一和第二金属片以形成多个向外延伸的凸起，每个限定腔。 将第一和第二金属板彼此相对地对称地配合，以形成每个限定其间的外壳的上凸块和下凸块，其中配合的第一和第二板形成接触结构。 用绝缘材料涂覆接触结构，并从上部和下部凸块制造螺旋形接触。 具有彼此成镜像关系的第一和第二部分的螺旋形接触件。

公开(公告)号：US20080045052A1

公开(公告)日：2008-02-21

申请号：US11855325

申请日：2007-09-14

申请人： Paul Coteus ,  Kevin Gower ,  Shawn Hall ,  Gareth Hougham ,  Dale Pearson

发明人： Paul Coteus ,  Kevin Gower ,  Shawn Hall ,  Gareth Hougham ,  Dale Pearson

IPC分类号： H01R12/20

CPC分类号： G11C5/04 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15192 ,  H05K1/181 ,  H05K2201/10159 ,  H01L2224/0401

摘要： A Planar Memory Module (PAMM) device comprising a generally planar card comprising a first side and a second side, the first side having a plurality of couplings and the second side having a plurality of connectors, a plurality of memory devices coupled to the card via a first portion of the plurality of couplings, and at least one hub chip coupled to the card via a second portion of the plurality of couplings. Each of the plurality of couplings is connected to an associated one of the plurality of connectors.

公开(公告)号：US20080026607A1

公开(公告)日：2008-01-31

申请号：US11865440

申请日：2007-10-01

申请人： Gareth Hougham ,  Brian Beaman ,  Evan Colgan ,  Paul Coteus ,  Stefano Oggioni ,  Enrique Vargas

发明人： Gareth Hougham ,  Brian Beaman ,  Evan Colgan ,  Paul Coteus ,  Stefano Oggioni ,  Enrique Vargas

IPC分类号： H01R12/14

CPC分类号： H01R12/714 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01R12/52 ,  H05K3/326 ,  H05K3/4007 ,  H05K7/1061 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2201/09745 ,  H05K2201/10378 ,  H05K2201/10734 ,  Y10T29/49002 ,  Y10T29/49121 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/49213 ,  Y10T29/49218 ,  Y10T29/49222 ,  H01L2924/00

摘要： A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.

公开(公告)号：US20080026606A1

公开(公告)日：2008-01-31

申请号：US11865353

申请日：2007-10-01

申请人： Gareth Hougham ,  Brian Beaman ,  Evan Colgan ,  Paul Coteus ,  Stefano Oggioni ,  Enrique Vargas

发明人： Gareth Hougham ,  Brian Beaman ,  Evan Colgan ,  Paul Coteus ,  Stefano Oggioni ,  Enrique Vargas

IPC分类号： H01R12/14

CPC分类号： H01R12/714 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01R12/52 ,  H05K3/326 ,  H05K3/4007 ,  H05K7/1061 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2201/09745 ,  H05K2201/10378 ,  H05K2201/10734 ,  Y10T29/49002 ,  Y10T29/49121 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/49213 ,  Y10T29/49218 ,  Y10T29/49222 ,  H01L2924/00

摘要： A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.

公开(公告)号：US20080020597A1

公开(公告)日：2008-01-24

申请号：US11865423

申请日：2007-10-01

申请人： Gareth Hougham ,  Brian Beaman ,  Evan Colgan ,  Paul Coteus ,  Stefano Oggioni ,  Enrique Vargas

发明人： Gareth Hougham ,  Brian Beaman ,  Evan Colgan ,  Paul Coteus ,  Stefano Oggioni ,  Enrique Vargas

IPC分类号： H01R12/00

CPC分类号： H01R12/714 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01R12/52 ,  H05K3/326 ,  H05K3/4007 ,  H05K7/1061 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2201/09745 ,  H05K2201/10378 ,  H05K2201/10734 ,  Y10T29/49002 ,  Y10T29/49121 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/49213 ,  Y10T29/49218 ,  Y10T29/49222 ,  H01L2924/00

摘要： A land grid array (LGA) interposer structure, including an electrically insulating carrier plane, and at least one interposer mounted on a first surface of said carrier plane. The interposer possesses a hemi-toroidal configuration in transverse cross-section and is constituted of a dielectric elastomeric material. A plurality of electrically-conductive elements are arranged about the surface of the at least one hemi-toroidal interposer and extend radically inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of the electrically insulating carrier plane. Provided is also a method of producing the land grid array interposer structure.

公开(公告)号：US20070054512A1

公开(公告)日：2007-03-08

申请号：US11327710

申请日：2006-01-05

申请人： Gareth Hougham ,  Brian Beaman ,  John Corbin ,  Paul Coteus ,  Shawn Hall ,  Kathleen Hinge ,  Theron Lewis ,  Frank Libsch ,  Amanda Mikhail

发明人： Gareth Hougham ,  Brian Beaman ,  John Corbin ,  Paul Coteus ,  Shawn Hall ,  Kathleen Hinge ,  Theron Lewis ,  Frank Libsch ,  Amanda Mikhail

IPC分类号： H01R12/00

CPC分类号： H05K3/368 ,  H01R12/52 ,  H01R12/714 ,  H05K1/0269 ,  H05K3/325 ,  H05K2201/10378 ,  Y10T29/49117 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149

摘要： LGA connectors are fabricated with buttons or spring contacts preformed to different heights to accommodate the initial topography of a typical module or PCB of a particular product type. This is accomplished during fabrication by measuring topographies of mating surfaces of a first electronic device and of a second electronic device; fabricating interposer contacts to form opposing non-planar sides having respective inverse topographies for contacting the mating surfaces; and sandwiching the interposer between the first and second electronic devices with the opposing sides in contact with respective mating serfaces. For those LGA types made by molding techniques such as the metal-in-polymer type (eg. Tyco Electronics MPI, or Shin Etsu RP) or the Metal-on-Elastomer type (IBM), using molds with the desired topography provides the desired LGA topography. For those LGAs made of metal springs, cantilevers, armatures and the like, the desired topography is imposed by shaping of the buttons during or after fabrication using a sizing die with the desired topography.

摘要翻译： LGA连接器采用预制到不同高度的按钮或弹簧触点制成，以适应特定产品类型的典型模块或PCB的初始形貌。 这是通过测量第一电子装置和第二电子装置的配合表面的形貌来制造的; 制造内插器触点以形成具有用于接触配合表面的相应反向形状的相对非平面侧; 并且将所述插入件夹在所述第一和第二电子设备之间，所述相对侧与相应的匹配塞线接触。 对于通过成型技术（例如，Tyco Electronics MPI或Shin Etsu RP）或Metal-on-Elastomer型（IBM）等成型技术制造的LGA类型，使用具有所需形貌的模具可提供所需的 LGA地形。 对于由金属弹簧，悬臂，电枢等制成的那些LGAs，通过使用具有所需形状的尺寸模具在制造期间或之后使按钮成形来施加所需的形状。