METHOD FOR MANUFACTURING NONVOLATILE SEMICONDUCTOR MEMORY ELEMENT
    51.
    发明申请
    METHOD FOR MANUFACTURING NONVOLATILE SEMICONDUCTOR MEMORY ELEMENT 有权
    制造非易失性半导体存储元件的方法

    公开(公告)号:US20120238055A1

    公开(公告)日:2012-09-20

    申请号:US13502769

    申请日:2011-11-10

    IPC分类号: H01L21/02

    摘要: An object of the present invention is to provide a method for manufacturing a variable resistance nonvolatile semiconductor memory element which can operate at a low voltage and high speed when initial breakdown is caused, and inhibit oxidization of a contact plug. The method for manufacturing the variable resistance nonvolatile semiconductor memory element, which includes a bottom electrode, a variable resistance layer, and a top electrode which are formed above a contact plug, includes oxidizing to insulate an end portion of the variable resistance layer prior to forming a bottom electrode by patterning a first conductive film.

    摘要翻译: 本发明的目的是提供一种用于制造可变电阻非易失性半导体存储元件的方法,其可以在初始击穿时能够以低电压和高速工作,并且抑制接触插塞的氧化。 制造可变电阻型非易失性半导体存储元件的方法,其包括形成在接触插塞上方的底电极,可变电阻层和顶电极,包括在形成之前进行氧化以使可变电阻层的端部绝缘 通过图案化第一导电膜来形成底部电极。

    Nonvolatile semiconductor memory device and manufacturing method thereof
    52.
    发明授权
    Nonvolatile semiconductor memory device and manufacturing method thereof 有权
    非易失性半导体存储器件及其制造方法

    公开(公告)号:US08253136B2

    公开(公告)日:2012-08-28

    申请号:US12738778

    申请日:2008-10-22

    IPC分类号: H01L29/10

    CPC分类号: H01L27/24 H01L27/1021

    摘要: A nonvolatile semiconductor memory device of the present invention includes a substrate (1), first wires (2), memory cells each including a resistance variable element (5) and a portion of a diode element (6), second wires (11) which respectively cross the first wires (2) to be perpendicular to the first wires (2) and each of which contains a remaining portion of the diode element (6), and upper wires (13) formed via an interlayer insulating layer (12), respectively, and the first wires (2) are connected to the upper wires (13) via first contacts (14), respectively, and the second wires (11) are connected to the upper wires (13) via second contacts (15), respectively.

    摘要翻译: 本发明的非易失性半导体存储器件包括基板(1),第一布线(2),各自包括电阻可变元件(5)和二极管元件(6)的一部分的存储单元,第二布线(11) 分别与第一布线(2)垂直的第一布线(2),并且每个布线包含二极管元件(6)的剩余部分,以及经由层间绝缘层(12)形成的上部布线(13) 并且第一导线(2)分别经由第一触头(14)连接到上导线(13),并且第二导线(11)经由第二触点(15)连接到上导线(13) 分别。

    NONVOLATILE MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
    53.
    发明申请
    NONVOLATILE MEMORY DEVICE AND MANUFACTURING METHOD THEREOF 有权
    非易失性存储器件及其制造方法

    公开(公告)号:US20120097915A1

    公开(公告)日:2012-04-26

    申请号:US13132544

    申请日:2009-06-30

    IPC分类号: H01L47/00 H01L21/02

    摘要: There are provided a resistance variable nonvolatile memory device which changes its resistance stably at low voltages and is suitable for a miniaturized configuration, and a manufacturing method thereof. The nonvolatile memory device comprises: a substrate (100); a first electrode (101); an interlayer insulating layer (102); a memory cell hole (103) formed in the interlayer insulating layer; a first resistance variable layer (104a) formed in at least a bottom portion of the memory cell hole and connected to the first electrode; a second resistance variable layer (104b) formed inside the memory cell hole (103) and located on the first resistance variable layer (104a); and a second electrode (105); the first resistance variable layer (104a) and the second resistance variable layer (104b) respectively comprising metal oxides of the same kind; and the first resistance variable layer (104a) having a higher oxygen content than the second resistance variable layer (104b).

    摘要翻译: 提供了一种电阻可变非易失性存储器件,其在低电压下稳定地改变其电阻并且适合于小型化构造及其制造方法。 非易失性存储器件包括:衬底(100); 第一电极(101); 层间绝缘层(102); 形成在所述层间绝缘层中的记忆单元孔(103) 形成在所述存储单元孔的至少底部并连接到所述第一电极的第一电阻变化层(104a) 形成在所述存储单元孔内并位于所述第一电阻变化层上的第二电阻变化层, 和第二电极(105); 分别包含相同种类的金属氧化物的第一电阻变化层(104a)和第二电阻变化层(104b) 和具有比第二电阻变化层(104b)高的氧含量的第一电阻变化层(104a)。

    Lid unit for thin plate supporting container
    55.
    发明申请
    Lid unit for thin plate supporting container 审中-公开
    薄板支撑容器盖单元

    公开(公告)号:US20050218034A1

    公开(公告)日:2005-10-06

    申请号:US11087078

    申请日:2005-03-23

    申请人: Yoshio Kawashima

    发明人: Yoshio Kawashima

    CPC分类号: H01L21/67369

    摘要: A lid unit seals a container main body of a thin-plate supporting container which is conveyed while plural 300 mm-diameter semiconductor wafers are stored in the container. In a wafer retainer which supports the wafers stored in the container main body, the maximum amount of displacement is set in a range of 1.5 to 2.5 mm (ranges from 1/200 to 1/120 of the semiconductor wafer diameter), and proportionality is held between the amount of displacement and external force when the maximum amount of displacement ranges from 1.5 to 2.5 mm. In the states in which the wafer retainer is fitted in the container main body and force is not applied, the wafer retainer is arranged at a position in which the wafer retainer is not in contact with the semiconductor wafers stored in the container main body or at a position in which the wafer retainer is in slight contact with the semiconductor wafers. Therefore, the lid unit can be attached and detached without fixing the container main body, so that vibration-resistant performance and shock-resistant performance are improved by preventing spring resistance force from rapidly increasing, and automatization of the attachment and detachment of the lid unit is easy to realize.

    摘要翻译: 盖单元将多个300mm直径的半导体晶片存储在容器中的薄板支撑容器的容器主体密封,该容器主体被输送。 在支撑存储在容器主体中的晶片的晶片保持器中,最大位移量设定在1.5〜2.5mm(半导体晶片直径的1/200〜1/120的范围)的范围内,比例为 当最大位移量范围为1.5至2.5mm时,位移量与外力之间保持不变。 在晶片保持器装配在容器主体中并且不施加力的状态下,晶片保持器布置在晶片保持器不与存储在容器主体中的半导体晶片接触的位置处或者 晶片保持器与半导体晶片轻微接触的位置。 因此,可以在不固定容器主体的情况下将盖单元安装和拆卸,从而通过防止弹簧阻力急剧增加来提高防振性能和抗冲击性能,并且使盖单元的安装和拆卸自动化 很容易实现。

    Nonvolatile storage element and method for manufacturing same
    57.
    发明授权
    Nonvolatile storage element and method for manufacturing same 有权
    非易失性存储元件及其制造方法

    公开(公告)号:US09184381B2

    公开(公告)日:2015-11-10

    申请号:US13810800

    申请日:2011-10-06

    IPC分类号: H01L47/00 H01L45/00 H01L27/10

    摘要: A variable resistance nonvolatile storage element includes: a first electrode; a second electrode; and a variable resistance layer having a resistance value that reversibly changes based on an electrical signal applied between the electrodes, wherein the variable resistance layer has a structure formed by stacking a first transition metal oxide layer, a second transition metal oxide layer, and a third transition metal oxide layer in this order, the first transition metal oxide layer having a composition expressed as MOx (where M is a transition metal and O is oxygen), the second transition metal oxide layer having a composition expressed as MOy (where x>y), and the third transition metal oxide layer having a composition expressed as MOz (where y>z).

    摘要翻译: 可变电阻非易失性存储元件包括:第一电极; 第二电极; 以及可变电阻层,其具有基于施加在所述电极之间的电信号而可逆地变化的电阻值,其中所述可变电阻层具有通过堆叠第一过渡金属氧化物层,第二过渡金属氧化物层和第三过渡金属氧化物层而形成的结构 过渡金属氧化物层,第一过渡金属氧化物层具有以MOx表示的组成(其中M是过渡金属,O是氧),第二过渡金属氧化物层具有以MOy表示的组成(其中x> y )和具有表示为MOz(其中y> z)的组成的第三过渡金属氧化物层。

    Method for manufacturing nonvolatile semiconductor memory element, and nonvolatile semiconductor memory element
    58.
    发明授权
    Method for manufacturing nonvolatile semiconductor memory element, and nonvolatile semiconductor memory element 有权
    非易失性半导体存储元件的制造方法及非易失性半导体存储元件

    公开(公告)号:US08889478B2

    公开(公告)日:2014-11-18

    申请号:US13637465

    申请日:2011-11-18

    摘要: Provided is a method for manufacturing a variable resistance nonvolatile semiconductor memory element, and a nonvolatile semiconductor memory element which make it possible to operate at a low voltage and high speed when initial breakdown is caused, and exhibit favorable diode element characteristics. The method for manufacturing the nonvolatile semiconductor memory element includes, after forming a top electrode of a variable resistance element and at least before forming a top electrode of an MSM diode element, oxidizing to insulate a portion of a variable resistance film in a region around an end face of a variable resistance layer.

    摘要翻译: 提供一种用于制造可变电阻非易失性半导体存储元件的方法,以及使得可以在初始击穿时以低电压和高速操作的可变电阻非易失性半导体存储元件,并且表现出良好的二极管元件特性。 制造非易失性半导体存储元件的方法包括:在形成可变电阻元件的顶部电极之后,并且至少在形成MSM二极管元件的顶部电极之前,氧化以使可变电阻膜的一部分在一个周围的区域中绝缘 可变电阻层的端面。

    NON-VOLATILE MEMORY DEVICE
    59.
    发明申请
    NON-VOLATILE MEMORY DEVICE 有权
    非易失性存储器件

    公开(公告)号:US20140098595A1

    公开(公告)日:2014-04-10

    申请号:US14122708

    申请日:2013-03-27

    IPC分类号: H01L45/00 G11C13/00

    摘要: A non-volatile memory device includes: a memory cell array including a plurality of memory cells each including a first variable resistance element and a first current steering element and a parameter generation circuit including a reference cell including a second variable resistance element and a second current steering element having the same current density-voltage characteristic as that of the first current steering element, wherein a conductive shorting layer for causing short-circuiting between the electrodes is formed on the side surfaces of the second variable resistance element.

    摘要翻译: 一种非易失性存储器件包括:存储单元阵列,包括多个存储单元,每个存储单元包括第一可变电阻元件和第一电流导引元件;以及参数产生电路,其包括具有第二可变电阻元件和第二电流元件 所述转向元件具有与所述第一电流操舵元件相同的电流密度 - 电压特性,其中在所述第二可变电阻元件的侧表面上形成用于在所述电极之间引起短路的导电短路层。

    NONVOLATILE STORAGE ELEMENT AND METHOD OF MANUFACTURING THEREOF
    60.
    发明申请
    NONVOLATILE STORAGE ELEMENT AND METHOD OF MANUFACTURING THEREOF 有权
    非易失存储元件及其制造方法

    公开(公告)号:US20140024197A1

    公开(公告)日:2014-01-23

    申请号:US14110163

    申请日:2012-04-11

    IPC分类号: H01L45/00

    摘要: A method of manufacturing a variable resistance nonvolatile memory element includes: forming a lower electrode layer above a substrate; forming, on the lower electrode layer, a variable resistance layer including an oxygen-deficient transition metal oxide; forming an upper electrode layer on the variable resistance layer; and forming a patterned mask on the upper electrode layer and etching the upper electrode layer, the variable resistance layer, and the lower electrode layer using the patterned mask, wherein in the etching, at least the variable resistance layer is etched using an etching gas containing bromine.

    摘要翻译: 一种制造可变电阻非易失性存储元件的方法包括:在衬底上形成下电极层; 在下电极层上形成包含缺氧过渡金属氧化物的可变电阻层; 在所述可变电阻层上形成上电极层; 以及在所述上电极层上形成图案化掩模,并使用所述图案掩模蚀刻所述上电极层,所述可变电阻层和所述下电极层,其中在所述蚀刻中,至少所述可变电阻层使用含有 溴。