Magnetoresistive element
    5.
    发明授权
    Magnetoresistive element 失效
    磁阻元件

    公开(公告)号:US06861940B2

    公开(公告)日:2005-03-01

    申请号:US10732053

    申请日:2003-12-10

    IPC分类号: G01R33/09 H01F10/32 H01C7/04

    摘要: A magnetoresistive element of the present invention includes a multilayer structure that includes a non-magnetic layer (3) and a pair of ferromagnetic layers (1, 2) stacked on both sides of the non-magnetic layer (3). A resistance value differs depending on a relative angle between the magnetization directions of the ferromagnetic layers (1, 2) at the interfaces with the non-magnetic layer (3). The composition of at least one of the ferromagnetic layers (1, 2) in a range of 2 nm from the interface with the non-magnetic layer (3) is expressed by (MxOy)1-zZz, where Z is at least one element selected from the group consisting of Ru, Os, Rh, Ir, Pd, Pt, Cu, Ag, and Au, M is at least one element selected from the group consisting of elements other than Z and O and includes a ferromagnetic metal, and x, y, and z satisfy 0.33

    摘要翻译: 本发明的磁阻元件包括层叠在非磁性层(3)的两侧的非磁性层(3)和一对铁磁体层(1,2)的多层结构体。 电阻值根据与非磁性层(3)的界面处的铁磁层(1,2)的磁化方向之间的相对角度而不同。 从与非磁性层(3)的界面在2nm范围内的铁磁层(1,2)中的至少一个的组成由(M×Oy)1-zZz表示,其中Z是至少一个元素 选自由Ru,Os,Rh,Ir,Pd,Pt,Cu,Ag和Au组成的组中的至少一种元素,M是选自Z和O以外的元素中的至少一种元素,并且包括铁磁性金属,以及 x,y和z满足0.33

    Magnetoresistive element and method for producing the same, as well as magnetic head, magnetic memory and magnetic recording device using the same
    6.
    发明授权
    Magnetoresistive element and method for producing the same, as well as magnetic head, magnetic memory and magnetic recording device using the same 失效
    磁阻元件及其制造方法以及使用该磁阻元件的磁头,磁存储器和磁记录装置

    公开(公告)号:US06943041B2

    公开(公告)日:2005-09-13

    申请号:US10719412

    申请日:2003-11-21

    摘要: The present invention provides a method for producing a magnetoresistive element including a tunnel insulating layer, and a first magnetic layer and a second magnetic layer that are laminated so as to sandwich the tunnel insulating layer, wherein a resistance value varies depending on a relative angle between magnetization directions of the first magnetic layer and the second magnetic layer. The method includes the steps of: (i) laminating a first magnetic layer, a third magnetic layer and an Al layer successively on a substrate; (ii) forming a tunnel insulating layer containing at least one compound selected from the group consisting of an oxide, nitride and oxynitride of Al by performing at least one reaction selected from the group consisting of oxidation, nitriding and oxynitriding of the Al layer; and (iii) forming a laminate including the first magnetic layer, the tunnel insulating layer and a second magnetic layer by laminating the second magnetic layer in such a manner that the tunnel insulating layer is sandwiched by the first magnetic layer and the second magnetic layer. The third magnetic layer has at least one crystal structure selected from the group consisting of a face-centered cubic crystal structure and a face-centered tetragonal crystal structure and is (111) oriented parallel to a film plane of the third magnetic layer. According to this production method, it is possible to produce a magnetoresistive element with excellent properties and thermal stability.

    摘要翻译: 本发明提供了一种制造磁阻元件的方法,该磁阻元件包括隧道绝缘层,以及第一磁性层和第二磁性层,其被层压以夹住隧道绝缘层,其中电阻值根据相对角度而变化 第一磁性层和第二磁性层的磁化方向。 该方法包括以下步骤:(i)在衬底上依次层叠第一磁性层,第三磁性层和Al层; (ii)通过进行选自Al层的氧化,氮化和氮氧化的至少一种反应,形成包含至少一种选自Al的氧化物,氮化物和氮氧化物的化合物的隧道绝缘层; 以及(iii)通过层叠所述第二磁性层来形成包括所述第一磁性层,所述隧道绝缘层和第二磁性层的层压体,使得所述隧道绝缘层被所述第一磁性层和所述第二磁性层夹在中间。 第三磁性层具有至少一种选自面心立方晶体结构和面心四边形晶体结构的晶体结构,并且(111)取向为平行于第三磁性层的膜平面。 根据该制造方法,可以制造出具有优异性能和热稳定性的磁阻元件。

    Nonvolatile memory element
    8.
    发明授权
    Nonvolatile memory element 有权
    非易失性存储元件

    公开(公告)号:US08481990B2

    公开(公告)日:2013-07-09

    申请号:US13375027

    申请日:2011-03-07

    IPC分类号: H01L47/00

    摘要: A variable resistance nonvolatile memory element capable of suppressing a variation in resistance values is provided. A nonvolatile memory element according to the present invention includes: a silicon substrate (11); a lower electrode layer (102) formed on the silicon substrate (11); a variable resistance layer formed on the lower electrode layer (102); an upper electrode layer (104) formed on the variable resistance layer; a second interlayer insulating layer (19) formed to directly cover at least side surfaces of the lower electrode layer (102) and the variable resistance layer; a stress buffering region layer (105) for buffering a stress on the upper electrode layer (104), the stress buffering region layer being formed to directly cover at least an upper surface and side surfaces of the upper electrode layer (104) and comprising a material having a stress smaller than a stress of an insulating layer used as the second interlayer insulating layer (19); a second contact (16) extending to the upper electrode layer (104); and a wiring pattern (18) connected to the second contact (16).

    摘要翻译: 提供了能够抑制电阻值变化的可变电阻非易失性存储元件。 根据本发明的非易失性存储元件包括:硅衬底(11); 形成在所述硅衬底(11)上的下电极层(102); 形成在所述下电极层(102)上的可变电阻层; 形成在所述可变电阻层上的上电极层(104) 形成为直接覆盖下电极层(102)和可变电阻层的至少侧面的第二层间绝缘层(19) 用于缓冲上电极层(104)上的应力的应力缓冲区层(105),所述应力缓冲区层形成为直接覆盖上电极层(104)的上表面和侧表面,并包括 具有小于用作第二层间绝缘层(19)的绝缘层的应力的应力的材料; 延伸到上电极层(104)的第二触点(16); 以及连接到第二触点(16)的布线图案(18)。

    NONVOLATILE MEMORY ELEMENT MANUFACTURING METHOD AND NONVOLATILE MEMORY ELEMENT
    9.
    发明申请
    NONVOLATILE MEMORY ELEMENT MANUFACTURING METHOD AND NONVOLATILE MEMORY ELEMENT 审中-公开
    非易失性存储元件制造方法和非易失性存储元件

    公开(公告)号:US20130149815A1

    公开(公告)日:2013-06-13

    申请号:US13810465

    申请日:2012-09-10

    IPC分类号: H01L45/00

    摘要: A method of manufacturing a nonvolatile memory element includes: forming a first conductive film above a substrate; forming, above the first conductive film, a first metal oxide layer and a second metal oxide layer having different degrees of oxygen deficiency and a second conductive film; forming a second electrode by patterning the second conductive film; forming a variable resistance layer by patterning the first metal oxide layer and the second metal oxide layer; removing a side portion of the variable resistance layer in a surface parallel to a main surface of the substrate to a position that is further inward than an edge of the second electrode; and forming a first electrode by patterning the first conductive film after or during the removing.

    摘要翻译: 一种制造非易失性存储元件的方法包括:在衬底上形成第一导电膜; 在第一导电膜上方形成具有不同程度的氧缺陷的第一金属氧化物层和第二金属氧化物层和第二导电膜; 通过图案化第二导电膜形成第二电极; 通过图案化第一金属氧化物层和第二金属氧化物层来形成可变电阻层; 将平行于所述基板的主表面的表面中的所述可变电阻层的侧部移除到比所述第二电极的边缘更靠内侧的位置; 以及通过在去除之后或期间对第一导电膜进行图案化而形成第一电极。

    Resistance variable element and resistance variable memory device
    10.
    发明授权
    Resistance variable element and resistance variable memory device 有权
    电阻可变元件和电阻变量存储器件

    公开(公告)号:US08394669B2

    公开(公告)日:2013-03-12

    申请号:US13128575

    申请日:2010-07-12

    IPC分类号: H01L21/02 H01L45/00

    摘要: A resistance variable element (100) used in a through-hole cross-point structure memory device, according to the present invention, and a resistance variable memory device including the resistance variable element, includes a substrate (7) and an interlayer insulating layer (3) formed on the substrate, and have a configuration in which a through-hole (4) is formed to penetrate the interlayer insulating layer, a first resistance variable layer (2) comprising transition metal oxide is formed outside the through-hole, a second resistance variable layer (5) comprising transition metal oxide is formed inside the through-hole, the first resistance variable layer is different in resistivity from the second resistance variable layer, and the first resistance variable layer and the second resistance variable layer are in contact with each other only in an opening (20) of the through-hole which is closer to the substrate.

    摘要翻译: 在根据本发明的通孔交叉点结构存储装置中使用的电阻可变元件(100)和包括电阻可变元件的电阻变化存储装置包括基板(7)和层间绝缘层( 3),并且具有形成贯通层间绝缘层的通孔(4)的构造,在通孔的外侧形成有包含过渡金属氧化物的第一电阻变化层(2), 在通孔内形成有包含过渡金属氧化物的第二电阻变化层(5),第一电阻变化层的电阻率与第二电阻变化层不同,第一电阻变化层和第二电阻变化层接触 彼此仅在更靠近基板的通孔的开口(20)中。