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    SOLID-STATE IMAGING DEVICE
    51.
    发明申请
    SOLID-STATE IMAGING DEVICE 有权
    固态成像装置

    公开(公告)号：US20120057020A1

    公开(公告)日：2012-03-08

    申请号：US13039508

    申请日：2011-03-03

    Applicant: Mitsuyoshi Kobayashi ,  Hideyuki Funaki ,  Risako Ueno

    Inventor： Mitsuyoshi Kobayashi ,  Hideyuki Funaki ,  Risako Ueno

    IPC: H04N7/18

    CPC classification number: H04N5/2254 ,  G01C3/08 ,  G01C3/10

    Abstract: According to an embodiment, a solid-state imaging device includes: an imaging device including an imaging area including a plurality of pixel blocks each of which includes a plurality of pixels; an image formation lens forming an image on an image formation plane by using light from a subject; an aperture unit including a plurality of aperture elements provided to associate with the plurality of pixel blocks, each of the aperture elements having an aperture portion and a shield portion, light from the image formation lens being filtered by each aperture element; a microlens array including a plurality of microlenses provided to associate with the plurality of aperture elements, each of the microlenses forming an image in the imaging area by using light filtered by an associated aperture element; and a signal processing circuit configured to process a signal of an image taken in the imaging area and estimates a distance to the subject.

    Abstract translation: 根据实施例，固态成像装置包括：成像装置，其包括具有包括多个像素的多个像素块的成像区域; 图像形成透镜，通过使用来自被摄体的光在图像形成平面上形成图像; 一个光圈单元，包括多个孔眼元件，设置成与多个像素块相关联，每个孔元件具有孔部分和屏蔽部分，来自图像形成透镜的光被每个孔元件过滤; 微透镜阵列，包括设置成与所述多个孔元件相关联的多个微透镜，所述微透镜中的每一个通过使用由相关孔径元件过滤的光在所述成像区域中形成图像; 以及信号处理电路，被配置为处理在成像区域中拍摄的图像的信号，并估计到被摄体的距离。

    Image sensor and manufacturing method thereof
    52.
    发明授权
    Image sensor and manufacturing method thereof 有权
    图像传感器及其制造方法

    公开(公告)号：US08067740B2

    公开(公告)日：2011-11-29

    申请号：US12508846

    申请日：2009-07-24

    Applicant: Keita Sasaki ,  Hideyuki Funaki ,  Hiroto Honda ,  Ikuo Fujiwara ,  Koichi Ishii ,  Hitoshi Yagi

    Inventor： Keita Sasaki ,  Hideyuki Funaki ,  Hiroto Honda ,  Ikuo Fujiwara ,  Koichi Ishii ,  Hitoshi Yagi

    IPC: H01L31/02

    CPC classification number: H01L27/14669 ,  H01L27/1203 ,  H01L27/14683

    Abstract: An image sensor includes a semiconductor substrate; first pixels laid out above cavities provided within the semiconductor substrate, the first pixels converting thermal energy generated by incident light into an electric signal; supporting parts connected between the first pixels and the semiconductor substrate, the supporting parts supporting the first pixels above the cavities; and second pixels fixedly provided on the semiconductor substrate without via the cavities, wherein a plurality of the first pixels and a plurality of the second pixels are laid out two-dimensionally to form a pixel region, and each of the second pixels is adjacent to the first pixels.

    Abstract translation: 图像传感器包括半导体衬底; 第一像素被布置在设置在半导体衬底内的腔上方，第一像素将由入射光产生的热能转换为电信号; 连接在第一像素和半导体衬底之间的支撑部件，支撑部件支撑空腔上方的第一像素; 以及固定地设置在半导体衬底上的第二像素，而不经由空腔，其中多个第一像素和多个第二像素被二维布置以形成像素区域，并且每个第二像素与 第一个像素。

    Sensor device, and portable communication terminal and electronic device using the sensor device
    55.
    发明授权
    Sensor device, and portable communication terminal and electronic device using the sensor device 失效
    传感器装置，以及使用传感器装置的便携式通信终端和电子装置

    公开(公告)号：US07705611B2

    公开(公告)日：2010-04-27

    申请号：US11858822

    申请日：2007-09-20

    Applicant: Masako Ogata ,  Kazuhiro Suzuki ,  Hideyuki Funaki ,  Kazuhiko Itaya

    Inventor： Masako Ogata ,  Kazuhiro Suzuki ,  Hideyuki Funaki ,  Kazuhiko Itaya

    IPC: G01R27/26

    CPC classification number: H03K17/955 ,  G01D5/2417 ,  H03K2217/960755

    Abstract: A sensor device for detecting a positional relationship between a first member and a second member, includes a first charge-holding electrode provided on a surface of the first member and holding a charge, a second charge-holding electrode provided on the surface of the first member and holding a charge differing from the charge held by the first charge-holding electrode, a first charge-induced electrode provided on a surface of the second member, the first charge-induced electrode having a charge induced therein in accordance with the charge held by the first charge-holding electrode, when the first charge-holding electrode approaches the first charge-induced electrode, a second charge-induced electrode provided on the surface of the second member, the second charge-induced electrode having a charge induced therein in accordance with the charge held by the second charge-holding electrode, when the second charge-holding electrode approaches the second charge-induced electrode.

    Abstract translation: 一种用于检测第一构件和第二构件之间的位置关系的传感器装置，包括设置在第一构件的表面上并保持电荷的第一电荷保持电极，设置在第一构件和第二构件的表面上的第二电荷保持电极 并且保持与第一电荷保持电极所保持的电荷不同的电荷，设置在第二部件的表面上的第一电荷感应电极，第一电荷感应电极根据电荷保持在其中诱导电荷 通过第一电荷保持电极，当第一电荷保持电极接近第一电荷感应电极时，设置在第二元件的表面上的第二电荷感应电极，其中在其中引入电荷的第二电荷感应电极 根据第二电荷保持电极保持的电荷，当第二电荷保持电极接近第二电荷感应电极时。

    SOLID-STATE IMAGE PICKUP DEVICE
    56.
    发明申请
    SOLID-STATE IMAGE PICKUP DEVICE 失效
    固态图像拾取器件

    公开(公告)号：US20090242951A1

    公开(公告)日：2009-10-01

    申请号：US12211427

    申请日：2008-09-16

    Applicant: Risako UENO ,  Hideyuki Funaki ,  Yoshinori Ilda ,  Hiroto Honda

    Inventor： Risako UENO ,  Hideyuki Funaki ,  Yoshinori Ilda ,  Hiroto Honda

    IPC: H01L31/00

    CPC classification number: H01L27/1462 ,  H01L27/14605 ,  H01L27/1464

    Abstract: A solid-state image pickup device has a photoelectric conversion element that converts light incident from a first surface of a substrate into a signal charge and accumulates the signal charge, a transistor that is formed on a second surface side opposite to the first surface of the substrate and reads out the signal charge accumulated by the photoelectric conversion element, a supporting substrate stuck to the second surface of the substrate, and an antireflection coating formed on the first surface of the substrate, wherein the first surface of the substrate includes a curved surface or an inclined surface forming a prescribed angle to the second surface.

    Abstract translation: 固体摄像装置具有将从基板的第一面入射的光转换成信号电荷并积累信号电荷的光电转换元件，形成在与第一表面相反的第二表面侧的晶体管 读取由光电转换元件积累的信号电荷，粘贴到基板的第二表面的支撑基板和形成在基板的第一表面上的抗反射涂层，其中基板的第一表面包括弯曲表面 或与第二表面形成规定角度的倾斜表面。

    Thermal infrared detector and infrared image sensor using the same
    60.
    发明授权
    Thermal infrared detector and infrared image sensor using the same 失效
    热红外探测器和红外图像传感器使用相同

    公开(公告)号：US07026617B2

    公开(公告)日：2006-04-11

    申请号：US10647345

    申请日：2003-08-26

    Applicant: Naoya Mashio ,  Keitaro Shigenaka ,  Hideyuki Funaki ,  Yoshinori Iida ,  Ikuo Fujiwara

    Inventor： Naoya Mashio ,  Keitaro Shigenaka ,  Hideyuki Funaki ,  Yoshinori Iida ,  Ikuo Fujiwara

    IPC: G01J5/00

    CPC classification number: G01J5/08 ,  G01J5/02 ,  G01J5/023 ,  G01J5/024 ,  G01J5/0245 ,  G01J5/0853 ,  G01J5/14 ,  G01J5/22 ,  G01J2005/123 ,  H04N5/33

    Abstract: An infrared image sensor encompasses (a) a base body, (b) a plurality of signal lines disposed on the base body, (c) a plurality of address lines intersecting the signal lines, (d) a plurality of detector portions provided in the cross region of the signal lines and the address lines, each of the detector portions being connected between the corresponding signal line and the address line, each of the detector portions is configured to detect infrared-ray, (e) a plurality of supporting beams supporting each of the detector portions above the base body, and (f) a plurality of contactors configured to contact each of the detector portions with the base body thermally so as to transport thermal energy to be accumulated in each of the detector portions toward the base body.

    Abstract translation: 红外图像传感器包括（a）基体，（b）设置在基体上的多条信号线，（c）与信号线交叉的多个地址线，（d）多个检测器部分， 信号线的交叉区域和地址线，每个检测器部分连接在对应的信号线和地址线之间，每个检测器部分被配置为检测红外线，（e）多个支撑梁 每个检测器部分在基体上方，以及（f）多个接触器，其构造成使得每个检测器部分与基体热接触，以便将热能积聚在每个检测器部分中朝向基体 。

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