公开(公告)号：US09687943B2

公开(公告)日：2017-06-27

申请号：US15183104

申请日：2016-06-15

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

IPC: B23P15/26 ,  H05K7/20 ,  G06F1/20 ,  F28F3/00 ,  F28F3/12 ,  F28F13/00 ,  F28D15/02

CPC classification number: B23P15/26 ,  F28D15/0266 ,  F28F3/00 ,  F28F3/12 ,  F28F13/00 ,  G06F1/20 ,  H05K7/20254 ,  H05K7/20272 ,  H05K7/2029 ,  H05K7/20772 ,  Y10T29/4935

Abstract: A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s).

公开(公告)号：US09474186B2

公开(公告)日：2016-10-18

申请号：US13706568

申请日：2012-12-06

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

IPC: H05K7/20 ,  F24F11/00 ,  F25D17/02 ,  F25D31/00 ,  F24F3/14

CPC classification number: H05K7/20281 ,  F24F3/14 ,  F24F11/30 ,  F24F2110/20 ,  F25B2600/13 ,  F25D17/02 ,  F25D31/002 ,  F25D2317/04131 ,  H05K7/20781 ,  H05K7/20836

Abstract: A method is provided for dissipating heat from a rack. The method includes: disposing a coolant-cooled heat exchanger within the rack, and providing a coolant control apparatus. The coolant control apparatus includes at least one coolant recirculation conduit coupled in fluid communication between a facility coolant supply and return, wherein the facility coolant supply and return facilitate providing facility coolant to the heat exchanger. The control apparatus further includes a coolant pump(s) associated with the recirculation conduit(s) and a controller which monitors a temperature of facility coolant supplied to the heat exchanger, and redirects facility coolant, via the coolant recirculation conduit(s) and coolant pump(s), from the facility coolant return to the facility coolant supply to, at least in part, ensure that facility coolant supplied to the heat exchanger remains above a dew point temperature.

Abstract translation: 提供了用于从机架散热的方法。 该方法包括：将冷却剂冷却的热交换器设置在机架内，并提供冷却剂控制装置。 冷却剂控制装置包括在设备冷却剂供应和返回之间流体连通地联接的至少一个冷却剂再循环管道，其中设备冷却剂供应和返回便于向热交换器提供设备冷却剂。 控制装置还包括与再循环管道相关联的冷却剂泵和控制器，其控制供应给热交换器的设备冷却剂的温度，并且经由冷却剂再循环管道和冷却剂重新定向设备冷却剂 泵从设备冷却剂返回到设备冷却剂供应，至少部分地确保供应到热交换器的设备冷却剂保持高于露点温度。

公开(公告)号：US09470439B2

公开(公告)日：2016-10-18

申请号：US14066769

申请日：2013-10-30

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Levi A. Campbell ,  Richard C. Chu ,  Evan G. Colgan ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

IPC: F25D23/12 ,  F25B21/02 ,  F25B43/00 ,  H05K7/20 ,  B23P15/26

CPC classification number: F25B21/02 ,  B23P15/26 ,  F25B43/00 ,  F25B43/003 ,  F25B2400/01 ,  H05K7/20809 ,  H05K7/20836 ,  Y10T29/49359

Abstract: Apparatuses and methods are provided for facilitating cooling of an electronic component. The apparatus includes a vapor-compression refrigeration system, which includes an expansion component, an evaporator, a compressor and a condenser coupled in fluid communication. The evaporator is coupled to and cools the electronic component. The apparatus further includes a contaminant separator coupled in fluid communication with the refrigerant flow path. The separator includes a refrigerant cold filter and a thermoelectric array. At least a portion of refrigerant passing through the refrigerant flow path passes through the cold filter, and the thermoelectric array provides cooling to the cold filter to cool refrigerant passing through the filter. By cooling refrigerant passing through the filter, contaminants solidify from the refrigerant, and are deposited in the cold filter. The separator may further include a refrigerant hot filter coupled to a hot side of the thermoelectric array for further filtering the refrigerant.

公开(公告)号：US09446487B2

公开(公告)日：2016-09-20

申请号：US14105716

申请日：2013-12-13

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons

IPC: B23P15/26 ,  H05K7/20 ,  G06F1/20 ,  F28F3/00 ,  F28F3/12 ,  F28F13/00 ,  F28D15/02

CPC classification number: B23P15/26 ,  F28D15/0266 ,  F28F3/00 ,  F28F3/12 ,  F28F13/00 ,  G06F1/20 ,  H05K7/20254 ,  H05K7/20272 ,  H05K7/2029 ,  H05K7/20772 ,  Y10T29/4935

Abstract: A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s).

公开(公告)号：US09288932B2

公开(公告)日：2016-03-15

申请号：US13671829

申请日：2012-11-08

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC: F24J3/08 ,  H05K7/20 ,  F28D15/02

CPC classification number: H05K7/2039 ,  F24T10/30 ,  F28D15/0266 ,  F28D15/0275 ,  H05K7/20827 ,  Y02E10/10 ,  Y02E10/16

Abstract: Cooling systems and methods are provided which include a heat sink having a housing with a compartment, a coolant inlet, and a coolant outlet. The housing is configured for a coolant to flow from the coolant inlet through the compartment to the coolant outlet, wherein the coolant is transferring heat extracted from one or more electronic components. The heat sink further includes one or more heat pipes having a first portion disposed within the compartment of the housing and a second portion disposed outside the housing. The heat pipe(s) is configured to extract heat from the coolant flowing through the compartment, and to transfer the extracted heat to the second portion disposed outside the housing. The second portion outside the housing is disposed to facilitate conducting the extracted heat into the ground.

Abstract translation: 提供了冷却系统和方法，其包括散热器，该散热器具有带隔室的壳体，冷却剂入口和冷却剂出口。 壳体构造成用于使冷却剂从冷却剂入口通过隔室流到冷却剂出口，其中冷却剂传送从一个或多个电子部件提取的热量。 散热器还包括一个或多个热管，其具有设置在壳体的隔室内的第一部分和设置在壳体外部的第二部分。 热管被配置为从流过隔室的冷却剂中提取热量，并且将提取的热量传送到设置在壳体外部的第二部分。 壳体外部的第二部分设置成便于将提取的热量导入地面。

公开(公告)号：US09282678B2

公开(公告)日：2016-03-08

申请号：US14058592

申请日：2013-10-21

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC: H05K7/20 ,  G06F1/20

CPC classification number: H05K7/203 ,  H05K7/20772 ,  H05K7/20781 ,  H05K7/20809

Abstract: Cooled electronic systems and cooling methods are provided, wherein a field-replaceable bank of electronic components is cooled by an apparatus which includes an enclosure at least partially surrounding and forming a compartment about the electronic components, a fluid disposed within the compartment, and a heat sink associated with the electronic system. The field-replaceable bank extends, in part, through the enclosure to facilitate operative docking of the electronic components into, for instance, one or more respective receiving sockets of the electronic system. The electronic components of the field-replaceable bank are, at least partially, immersed within the fluid to facilitate immersion-cooling of the components, and the heat sink is configured and disposed to physically couple to the enclosure and facilitates rejection of heat from the fluid disposed within the compartment when the field-replaceable bank of electronic components is operatively inserted into the electronic system.

Abstract translation: 提供冷却的电子系统和冷却方法，其中现场可替换的电子部件组由包括至少部分围绕电子部件周围并形成隔室的外壳的设备冷却，设置在隔间内的流体和热量 水槽与电子系统相关联。 现场可更换组件部分地延伸穿过外壳，以便于将电子部件的操作对接到例如电子系统的一个或多个相应的接收插座。 现场可更换组的电子部件至少部分地浸没在流体内以便于部件的浸入冷却，并且散热器被配置和设置成物理耦合到外壳并有利于排除来自流体的热量 当现场可更换的电子组件组可操作地插入到电子系统中时，设置在隔间内。

公开(公告)号：US09282675B2

公开(公告)日：2016-03-08

申请号：US14063162

申请日：2013-10-25

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Robert E. Simons ,  Prabjit Singh

IPC: G06F1/20 ,  H05K5/00 ,  H05K7/20 ,  F28F7/00 ,  F28D15/00 ,  H01L23/40 ,  H01L23/427 ,  H01L23/473 ,  H01L23/367

CPC classification number: H05K7/20 ,  H01L23/367 ,  H01L23/373 ,  H01L23/3736 ,  H01L23/4006 ,  H01L23/427 ,  H01L23/473 ,  H01L2023/4087 ,  H01L2224/16 ,  Y10T29/49002 ,  Y10T29/4935 ,  Y10T29/49353

Abstract: A heat sink and method of fabrication are provided for removing heat from an electronic component(s). The heat sink includes a heat sink base and frame. The base has a first coefficient of thermal expansion (CTE), and includes a base surface configured to couple to the electronic component to facilitate removal of heat. The frame has a second CTE, and is configured to constrain the base surface in opposing relation to the electronic component, wherein the first CTE is greater than the second CTE. At least one of the heat sink base or frame is configured so that heating of the heat sink base results in a compressive force at the base surface of the heat sink base towards the electronic component that facilitates heat transfer from the electronic component. A thermal interface material is disposed between the base surface and the electronic component.

Abstract translation: 散热器和制造方法被提供用于从电子部件去除热量。 散热器包括散热器底座和框架。 基座具有第一热膨胀系数（CTE），并且包括配置成耦合到电子部件以便于去除热量的基面。 框架具有第二CTE，并且被配置为以与电子部件相对的关系约束基面，其中第一CTE大于第二CTE。 散热器基座或框架中的至少一个被构造成使得散热器基座的加热导致散热器基座的基面朝向电子部件的压缩力，其有助于从电子部件的热传递。 热界面材料设置在基底表面和电子部件之间。

公开(公告)号：US09210830B2

公开(公告)日：2015-12-08

申请号：US13758166

申请日：2013-02-04

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC: G06F1/16 ,  H05K5/00 ,  H05K7/00 ,  H05K7/20 ,  G06F1/20

CPC classification number: H05K7/20236 ,  G06F1/20 ,  H05K7/203 ,  H05K7/20318 ,  H05K7/20336 ,  H05K7/2079 ,  H05K7/20809

Abstract: A method of facilitating cooling of an electronics board having a plurality of electronic components mounted to the board by providing an apparatus which includes an immersion-cooled electronic component section and a conduction-cooled electronic component section. The immersion-cooled section includes an enclosure at least partially surrounding and forming a compartment about multiple electronic components of the electronic components mounted to the electronics board, and a fluid disposed within the compartment. The multiple electronic components are, at least in part, immersed within the fluid to facilitate immersion-cooling of those components. The conduction-cooled electronic component section includes at least one electronic component of the electronic components mounted to the electronics board, and the at least one electronic component is indirectly liquid-cooled, at least in part, via conduction of heat from the at least one electronic component.

Abstract translation: 一种通过提供一种包括浸没冷却电子部件部分和传导冷却电子部件部分的装置，有助于冷却具有安装到板上的多个电子部件的电子板的方法。 浸没冷却部分包括至少部分地围绕和形成围绕安装到电子板的电子部件的多个电子部件的隔室以及设置在隔间内的流体的外壳。 多个电子部件至少部分地浸入流体中以便于这些部件的浸入冷却。 传导冷却的电子部件部分包括安装到电子板的电子部件的至少一个电子部件，并且至少一个电子部件至少部分地通过从至少一个 电子元件

公开(公告)号：US09148983B2

公开(公告)日：2015-09-29

申请号：US13781993

申请日：2013-03-01

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC: G06F19/00 ,  H05K7/20 ,  G05D23/19 ,  G06F1/20

CPC classification number: H05K7/2079 ,  G05D23/1934 ,  G06F1/206 ,  H05K7/20836

Abstract: Methods are provided for automated coolant flow control for, for instance, facilitating cooling of multiple different electronic systems. The methods include, for instance, automatically controlling coolant flow to a plurality of coolant circuits, and for a coolant circuit i of the coolant circuits: automatically determining the heat load transferred to coolant flowing through coolant circuit i, and automatically controlling coolant flow through coolant circuit i based on the determined heat load transferred to the coolant. The different coolant circuits may have the same or different coolant flow impedances, and flow through the different coolant circuits may be controlled using different heat load-to-coolant ranges for the different circuits.

Abstract translation: 提供了用于自动冷却剂流控制的方法，例如，促进多个不同电子系统的冷却。 这些方法包括例如自动控制冷却剂流到多个冷却剂回路，以及冷却剂回路的冷却剂回路i：自动确定传递到冷却剂回路i中的冷却剂的热负荷，并自动控制冷却剂流过冷却剂 电路i基于传输到冷却剂的确定的热负荷。 不同的冷却剂回路可以具有相同或不同的冷却剂流动阻抗，并且可以使用用于不同回路的不同热负荷 - 冷却剂范围来控制通过不同冷却剂回路的流量。

公开(公告)号：US09095942B2

公开(公告)日：2015-08-04

申请号：US13627256

申请日：2012-09-26

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Levi A. Campbell ,  Richard C. Chu ,  Milnes P. David ,  Michael J. Ellsworth, Jr. ,  Madhusudan K. Iyengar ,  Roger R. Schmidt ,  Robert E. Simons

IPC: H05K7/20 ,  B23P15/26

CPC classification number: B23P15/26 ,  H05K7/203 ,  H05K7/20336 ,  H05K7/20809 ,  Y10T29/4935 ,  Y10T29/49396

Abstract: Cooling apparatus and methods are provided for facilitating cooling of electronic components of an electronic system. The cooling apparatus includes a housing at least partially surrounding and forming a compartment about the components, and an immersion-cooling fluid is disposed within the compartment. At least one component of the electronic system is at least partially non-immersed within the fluid in the compartment. A wicking film element is physically coupled to a main surface of the at least one component and partially disposed within the fluid within the compartment. A coupling element physically couples the wicking film element to the main surface of the at least one component without the coupling element overlying the main surface of the component(s). As an enhancement, the wicking film element wraps over the component to physically couple to two opposite main sides of the component.

Abstract translation: 提供冷却装置和方法以便于电子系统的电子部件的冷却。 冷却装置包括至少部分地围绕和形成围绕部件的隔室的壳体，并且浸入冷却流体设置在隔间内。 电子系统的至少一个部件至少部分地非浸没在隔室中的流体内。 芯吸膜元件物理耦合到至少一个部件的主表面并且部分地设置在隔室内的流体内。 耦合元件将芯吸膜元件物理地耦合到至少一个部件的主表面，而没有覆盖部件主表面的耦合元件。 作为增强，芯吸膜元件包裹在部件上以物理耦合到部件的两个相对的主侧。