-
公开(公告)号：US11211551B2
公开(公告)日：2021-12-28
申请号：US16441304
申请日：2019-06-14
Applicant: Infineon Technologies AG
Inventor： Rainer Markus Schaller , Volker Strutz
IPC: H01L21/76 , H01L43/04 , H01L23/31 , H01L23/00 , H01L43/12 , H01L43/02 , H01L43/14 , H01L43/06 , G01R15/20 , G01R19/00 , H01L23/495
Abstract: A current sensor package, comprises a current path and a sensing device. The sensing device is spaced from the current path, and the sensing device is configured for sensing a magnetic field generated by a current flowing through the current path. Further, the sensing device comprises a sensor element. The sensing device is electrically connected to a conductive trace. An encapsulant extends continuously between the current path and the sensing device.
-
公开(公告)号：US10649010B2
公开(公告)日：2020-05-12
申请号：US15385694
申请日：2016-12-20
Applicant: Infineon Technologies AG
Inventor： Wolfgang Raberg , Goran Keser , Matthias Rose , Rainer Markus Schaller
Abstract: Methods and devices related to current sensing are provided. Magnetoresistive sensor elements are provided on opposite sides of a conductor.
-
公开(公告)号：US20200057031A1
公开(公告)日：2020-02-20
申请号：US16534143
申请日：2019-08-07
Applicant: Infineon Technologies AG
Inventor： Horst Theuss , Rainer Markus Schaller
Abstract: A detector module is disclosed. In one example, the detector module is for a photo-acoustic gas sensor and comprises a first substrate made of a semiconductor material and comprising a first surface and a second surface opposite to the first surface, a second substrate comprising a third surface, a fourth surface opposite to the third surface, and a first recess formed in the fourth surface. The second substrate is connected with its fourth surface to the first substrate so that the first recess forms an airtight-closed first cell which is filled with a reference gas and a pressure sensitive element comprising a membrane disposed in contact with the reference gas. The detector module is further configured such that a beam of light pulses passes through the first substrate and thereby enters the first cell.
-
Patent Agency Ranking
公开(公告)号：US20170288130A1
公开(公告)日：2017-10-05
申请号：US15089984
申请日：2016-04-04
Applicant: Infineon Technologies AG
Inventor： Volker Strutz , Klaus Elian , Cyrus Ghahremani , Rainer Markus Schaller
CPC classification number: H01L43/02 , G01R33/0047 , G01R33/07 , H01L43/065 , H01L43/08 , H01L43/12 , H01L2224/48091 , H01L2224/48247 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
Abstract: A semiconductor device includes a substrate, a semiconductor die attached to the substrate, and an encapsulation material. The semiconductor die includes a sensing element. The encapsulation material encapsulates the semiconductor die and a portion of the substrate. The encapsulation material defines a through-hole to receive a conductive element. The sensing element may include a magnetic field sensor to sense a magnetic field generated by the conductive element.
-
公开(公告)号：US09741677B1
公开(公告)日：2017-08-22
申请号：US15057481
申请日：2016-03-01
Applicant: Infineon Technologies AG
Inventor： Volker Strutz , Rainer Markus Schaller , Franz-Peter Kalz
CPC classification number: H01L24/29 , G01R33/0052 , H01L23/49503 , H01L23/49506 , H01L23/4951 , H01L23/49513 , H01L23/49548 , H01L23/60 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/92 , H01L27/22 , H01L2224/2929 , H01L2224/29393 , H01L2224/29499 , H01L2224/29561 , H01L2224/2957 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/83192 , H01L2224/83855 , H01L2224/85986 , H01L2224/92247 , H01L2924/00014 , H01L2924/15724 , H01L2924/15747 , H01L2924/30101 , H01L2224/45099 , H01L2924/00012 , H01L2924/0665
Abstract: A semiconductor device includes a substrate, a semiconductor die, and an antistatic die attach material between the substrate and the semiconductor die. The antistatic die attach material includes a mixture of a nonconductive adhesive material and carbon black or graphite. In one example, the antistatic die attach material has a resistivity between 101 Ω·cm and 1010 Ω·cm.
-
公开(公告)号：US09564578B2
公开(公告)日：2017-02-07
申请号：US14947649
申请日：2015-11-20
Applicant: Infineon Technologies AG
Inventor： Thorsten Meyer , Martin Gruber , Rainer Markus Schaller , Franz Jost , Stefan Mieslinger , Liu Chen , Toni Salminen , Giuliano Angelo Babulano , Jens Oetjen , Markus Dinkel
CPC classification number: H01L43/02 , G01R33/07 , G01R33/09 , H01L27/22 , H01L43/065 , H01L43/08 , H01L2224/0603 , H01L2224/37147 , H01L2224/37599 , H01L2224/40 , H01L2224/48137 , H01L2224/4903 , H01L2224/49171 , H01L2224/49175 , H01L2924/00014
Abstract: A semiconductor package includes a semiconductor die attached to a substrate and a magnetic field sensor included as part of the same semiconductor package as the semiconductor die and positioned in close proximity to a current pathway of the semiconductor die so that the magnetic field sensor can sense a magnetic field produced by current flowing in the current pathway. The magnetic field sensor includes a first magnetic field sensing component galvanically isolated from the current pathway and positioned so that a magnetic field produced by current flowing in the current pathway impinges on the first magnetic field sensing component in a first direction. The magnetic field sensor also includes a second magnetic field sensing component galvanically isolated from the current pathway and positioned so that the magnetic field impinges on the second magnetic field sensing component in a second direction different than the first direction.
Abstract translation: 半导体封装包括附接到衬底的半导体管芯和作为与半导体管芯相同的半导体封装的一部分的磁场传感器，并且位于靠近半导体管芯的电流通路的位置，使得磁场传感器可感测 电流在电流通路中流动产生的磁场。 磁场传感器包括与电流通路电隔离的第一磁场感测部件，并被定位成使得在电流通路中流动的电流产生的磁场沿第一方向冲击第一磁场感测部件。 磁场传感器还包括与电流路径电隔离并定位成使得磁场在不同于第一方向的第二方向上撞击在第二磁场感测部件上的第二磁场感测部件。
-
公开(公告)号：US20160380181A1
公开(公告)日：2016-12-29
申请号：US14947649
申请日：2015-11-20
Applicant: Infineon Technologies AG
Inventor： Thorsten Meyer , Martin Gruber , Rainer Markus Schaller , Franz Jost , Stefan Mieslinger , Liu Chen , Toni Salminen , Giuliano Angelo Babulano , Jens Oetjen , Markus Dinkel
CPC classification number: H01L43/02 , G01R33/07 , G01R33/09 , H01L27/22 , H01L43/065 , H01L43/08 , H01L2224/0603 , H01L2224/37147 , H01L2224/37599 , H01L2224/40 , H01L2224/48137 , H01L2224/4903 , H01L2224/49171 , H01L2224/49175 , H01L2924/00014
Abstract: A semiconductor package includes a semiconductor die attached to a substrate and a magnetic field sensor included as part of the same semiconductor package as the semiconductor die and positioned in close proximity to a current pathway of the semiconductor die so that the magnetic field sensor can sense a magnetic field produced by current flowing in the current pathway. The magnetic field sensor includes a first magnetic field sensing component galvanically isolated from the current pathway and positioned so that a magnetic field produced by current flowing in the current pathway impinges on the first magnetic field sensing component in a first direction. The magnetic field sensor also includes a second magnetic field sensing component galvanically isolated from the current pathway and positioned so that the magnetic field impinges on the second magnetic field sensing component in a second direction different than the first direction.
Abstract translation: 半导体封装包括附接到衬底的半导体管芯和作为与半导体管芯相同的半导体封装的一部分的磁场传感器，并且位于靠近半导体管芯的电流通路的位置，使得磁场传感器可感测 电流在电流通路中流动产生的磁场。 磁场传感器包括与电流通路电隔离的第一磁场感测部件，并被定位成使得在电流通路中流动的电流产生的磁场沿第一方向冲击第一磁场感测部件。 磁场传感器还包括与电流路径电隔离并定位成使得磁场在不同于第一方向的第二方向上撞击在第二磁场感测部件上的第二磁场感测部件。
-
58.发明申请Photo-Acoustic Gas Sensor Module Having Light Emitter and Detector Units 审中-公开具有光发射器和检测器单元的光声气体传感器模块公开(公告)号：US20160313288A1
公开(公告)日：2016-10-27
申请号：US15136469
申请日：2016-04-22
Applicant: Infineon Technologies AG
Inventor： Horst Theuss , Gottfried Beer , Sebastian Beer , Alfons Dehe , Franz Jost , Stefan Kolb , Guenther Ruhl , Rainer Markus Schaller
CPC classification number: G01N29/2425 , G01N29/032 , G01N2291/021
Abstract: A photo-acoustic gas sensor includes a light emitter unit having a light emitter configured to emit a beam of light pulses with a predetermined repetition frequency and a wavelength corresponding to an absorption band of a gas to be sensed, and a detector unit having a microphone. The light emitter unit is arranged so that the beam of light pulses traverses an area configured to accommodate the gas. The detector unit is arranged so that the microphone can receive a signal oscillating with the repetition frequency.
Abstract translation: 光声气体传感器包括光发射器单元，其具有光发射器，其被配置为发射具有预定重复频率和对应于待感测气体的吸收带的波长的光脉冲束，以及具有麦克风的检测器单元 。 光发射器单元布置成使得光束脉冲穿过配置成容纳气体的区域。 检测器单元布置成使得麦克风可以接收以重复频率振荡的信号。
-
-
-
-
-
-
-
Search Results
58
records
(took 0.019 seconds)
