公开(公告)号：US08981790B2

公开(公告)日：2015-03-17

申请号：US13375742

申请日：2010-05-26

申请人： Satoshi Nakamura ,  Takashi Suga ,  Yutaka Uematsu

发明人： Satoshi Nakamura ,  Takashi Suga ,  Yutaka Uematsu

IPC分类号： G01R29/26 ,  G01R31/08 ,  G01R31/00 ,  G01R31/28 ,  H05K9/00 ,  H05K1/02 ,  H05K1/14 ,  H05K3/32

CPC分类号： G01R31/001 ,  G01R29/26 ,  G01R31/281 ,  H05K1/0215 ,  H05K1/0234 ,  H05K1/141 ,  H05K3/325 ,  H05K9/0039 ,  H05K9/0069 ,  H05K2201/10022 ,  H05K2201/10409 ,  H05K2201/2036

摘要： A noise current passing through a substrate on which an electronic component is mounted is suppressed in a housing, to provide a malfunction of an electronic device. A substrate (103) on which an electronic component is mounted is secured to a housing (102) by a metal spacer (108) and a screw (104). A noise control member (100) mainly composed of an insulation substance is disposed between the metal spacer (108) and the substrate (103). A first conductive film is formed on the metal spacer-side of the noise control member (100), and a second conductive film is formed on the substrate-side of the noise control member (100). A resistance member (101) is disposed between the first conductive film and the second conductive film. A noise current introduced from the housing to the substrate can be suppressed by the resistance member.

摘要翻译： 通过其中安装有电子部件的基板的噪声电流被抑制在壳体中，以提供电子设备的故障。 其上安装有电子部件的基板（103）通过金属间隔件（108）和螺钉（104）固定到壳体（102）。 主要由绝缘物质组成的噪声控制构件（100）设置在金属间隔件（108）和基板（103）之间。 第一导电膜形成在噪声控制部件（100）的金属间隔件侧上，第二导电膜形成在噪声控制部件（100）的基板侧。 电阻构件（101）设置在第一导电膜和第二导电膜之间。 可以通过电阻元件来抑制从外壳引入基板的噪声电流。

公开(公告)号：US20140132255A1

公开(公告)日：2014-05-15

申请号：US14125754

申请日：2012-06-22

申请人： Hiroki Funato ,  Takashi Suga

发明人： Hiroki Funato ,  Takashi Suga

IPC分类号： G01R15/14

CPC分类号： G01R15/148 ,  G01R15/185

摘要： A surface current probe includes two current detection coils disposed so as to detect a magnetic field in a direction vertical to an current detection target plane; two disturbance-control coils, each thereof being disposed at a position farther away from each of the two current detection coils, against the current detection target plane, so as to be disposed for detection of a magnetic field in a direction parallel to the current detection target plane; and a terminal resistor coupled to each of the two disturbance-control coils. The two disturbance-control coils are disposed such that induced voltages generated against the current detection target plane at the time of detection of a magnetic field on the outer side of the two current detection coils are opposed in polarity to each other.

摘要翻译： 表面电流探针包括两个电流检测线圈，其设置成在垂直于电流检测目标平面的方向上检测磁场; 两个干扰控制线圈，其中的每一个被布置在距离电流检测对象平面更远离两个电流检测线圈中的每一个的位置处，以便被设置用于在平行于电流检测的方向上检测磁场 目标飞机; 以及耦合到两个扰动控制线圈中的每一个的端子电阻器。 两个扰动控制线圈被布置成使得在检测到两个电流检测线圈的外侧上的磁场时相对于当前检测目标平面产生的感应电压彼此极性相对。

公开(公告)号：US20120119757A1

公开(公告)日：2012-05-17

申请号：US13375742

申请日：2010-05-26

申请人： Satoshi Nakamura ,  Takashi Suga ,  Yutaka Uetmatsu

发明人： Satoshi Nakamura ,  Takashi Suga ,  Yutaka Uetmatsu

IPC分类号： G01R29/26 ,  H05K7/06

CPC分类号： G01R31/001 ,  G01R29/26 ,  G01R31/281 ,  H05K1/0215 ,  H05K1/0234 ,  H05K1/141 ,  H05K3/325 ,  H05K9/0039 ,  H05K9/0069 ,  H05K2201/10022 ,  H05K2201/10409 ,  H05K2201/2036

摘要： A noise current passing through a substrate on which an electronic component is mounted is suppressed in a housing, to provide a malfunction of an electronic device. A substrate (103) on which an electronic component is mounted is secured to a housing (102) by a metal spacer (108) and a screw (104). A noise control member (100) mainly composed of an insulation substance is disposed between the metal spacer (108) and the substrate (103). A first conductive film is formed on the metal spacer-side of the noise control member (100), and a second conductive film is formed on the substrate-side of the noise control member (100). A resistance member (101) is disposed between the first conductive film and the second conductive film. A noise current introduced from the housing to the substrate can be suppressed by the resistance member.

摘要翻译： 通过其中安装有电子部件的基板的噪声电流被抑制在壳体中，以提供电子设备的故障。 其上安装有电子部件的基板（103）通过金属间隔件（108）和螺钉（104）固定到壳体（102）。 主要由绝缘物质组成的噪声控制构件（100）设置在金属间隔件（108）和基板（103）之间。 第一导电膜形成在噪声控制部件（100）的金属间隔件侧上，第二导电膜形成在噪声控制部件（100）的基板侧。 电阻构件（101）设置在第一导电膜和第二导电膜之间。 可以通过电阻元件来抑制从外壳引入基板的噪声电流。

公开(公告)号：US07969735B2

公开(公告)日：2011-06-28

申请号：US12161151

申请日：2007-01-17

申请人： Kinya Nakatsu ,  Takayoshi Nakamura ,  Ryuichi Saito ,  Takashi Suga ,  Hiroki Funato

发明人： Kinya Nakatsu ,  Takayoshi Nakamura ,  Ryuichi Saito ,  Takashi Suga ,  Hiroki Funato

IPC分类号： H05K7/20

CPC分类号： H05K7/2089 ,  B60L3/003 ,  B60L11/123 ,  B60L11/14 ,  B60L11/1861 ,  B60L15/007 ,  B60L15/20 ,  B60L2210/10 ,  B60L2210/30 ,  B60L2210/40 ,  B60L2220/14 ,  B60L2220/42 ,  B60L2240/12 ,  B60L2240/36 ,  B60L2240/421 ,  B60L2240/441 ,  B60L2240/525 ,  B60L2260/26 ,  B60L2260/28 ,  H02M7/003 ,  H05K7/20927 ,  Y02T10/6217 ,  Y02T10/645 ,  Y02T10/646 ,  Y02T10/7005 ,  Y02T10/7022 ,  Y02T10/7044 ,  Y02T10/705 ,  Y02T10/7077 ,  Y02T10/7216 ,  Y02T10/7241 ,  Y02T10/7275 ,  Y02T90/16

摘要： The object is to provide a power converter which is capable of minimizing an extent to which the power converter components other than the semiconductor module are thermally affected by the heat originating from the semiconductor module.A casing houses: semiconductor modules 20, 30 constituting a main circuit for power conversion; a capacitor 50 electrically connected to the main circuit; drive circuits 70, 71 that provide the main circuit with a drive signal used in power conversion operation; a control circuit 74 that provides the drive circuit with a control signal used to prompt the drive circuit to provide the drive signal. Within the casing, a cooling chamber including a coolant passage 28 is formed, and a chamber wall of the cooling chamber is formed with a thermally conductive material. At least the semiconductor modules 20, 30 are housed inside the cooling chamber, and at least the capacitor 50 and the control circuit 74 are disposed outside the cooling chamber.

摘要翻译： 本发明的目的是提供一种功率转换器，该功率转换器能够最小化半导体模块以外的功率转换器部件受来自半导体模块的热的热影响的程度。 壳体容纳：构成用于电力转换的主电路的半导体模块20,30; 电连接到主电路的电容器50; 驱动电路70,71，其向主电路提供用于电力转换操作的驱动信号; 为驱动电路提供用于提示驱动电路提供驱动信号的控制信号的控制电路74。 在壳体内形成有包括冷却剂通道28的冷却室，并且冷却室的室壁形成有导热材料。 至少半导体模块20,30容纳在冷却室内，并且至少电容器50和控制电路74设置在冷却室的外部。

公开(公告)号：US07830689B2

公开(公告)日：2010-11-09

申请号：US11933690

申请日：2007-11-01

申请人： Takayoshi Nakamura ,  Kinya Nakatsu ,  Ryuichi Saito ,  Takashi Suga ,  Hiroki Funato

发明人： Takayoshi Nakamura ,  Kinya Nakatsu ,  Ryuichi Saito ,  Takashi Suga ,  Hiroki Funato

IPC分类号： H02M1/00

CPC分类号： H05K7/20927 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48472 ,  H01L2224/49111 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H02M7/003 ,  H01L2924/00

摘要： First and second bases and composing a coolant path structure are arranged at the middle stage of the power converter, and semiconductor modules and a capacitor are arranged on both surfaces of the coolant path structure. Furthermore, through-holes are formed in the first and second bases, and cables of DC and AC circuits are laid via the through-holes.

摘要翻译： 在功率转换器的中间部分设置有第一和第二基座并构成冷却剂路径结构，并且在冷却剂路径结构的两个表面上设置半导体模块和电容器。 此外，在第一和第二基座中形成通孔，并且通过通孔布置直流和交流电路的电缆。

公开(公告)号：US20100188814A1

公开(公告)日：2010-07-29

申请号：US12715786

申请日：2010-03-02

申请人： Kinya NAKATSU ,  Takayoshi Nakamura ,  Ryuichi Saito ,  Takashi Suga ,  Hiroki Funato

发明人： Kinya NAKATSU ,  Takayoshi Nakamura ,  Ryuichi Saito ,  Takashi Suga ,  Hiroki Funato

IPC分类号： H05K7/20

CPC分类号： H05K7/2089 ,  B60L3/003 ,  B60L11/123 ,  B60L11/14 ,  B60L11/1861 ,  B60L15/007 ,  B60L15/20 ,  B60L2210/10 ,  B60L2210/30 ,  B60L2210/40 ,  B60L2220/14 ,  B60L2220/42 ,  B60L2240/12 ,  B60L2240/36 ,  B60L2240/421 ,  B60L2240/441 ,  B60L2240/525 ,  B60L2260/26 ,  B60L2260/28 ,  H02M7/003 ,  H05K7/20927 ,  Y02T10/6217 ,  Y02T10/645 ,  Y02T10/646 ,  Y02T10/7005 ,  Y02T10/7022 ,  Y02T10/7044 ,  Y02T10/705 ,  Y02T10/7077 ,  Y02T10/7216 ,  Y02T10/7241 ,  Y02T10/7275 ,  Y02T90/16

摘要： The object is to provide a power converter which is capable of minimizing an extent to which the power converter components other than the semiconductor module are thermally affected by the heat originating from the semiconductor module.A casing houses: semiconductor modules 20, 30 constituting a main circuit for power conversion; a capacitor 50 electrically connected to the main circuit; drive circuits 70, 71 that provide the main circuit with a drive signal used in power conversion operation; a control circuit 74 that provides the drive circuit with a control signal used to prompt the drive circuit to provide the drive signal. Within the casing, a cooling chamber including a coolant passage 28 is formed, and a chamber wall of the cooling chamber is formed with a thermally conductive material. At least the semiconductor modules 20, 30 are housed inside the cooling chamber, and at least the capacitor 50 and the control circuit 74 are disposed outside the cooling chamber.

公开(公告)号：US20100188813A1

公开(公告)日：2010-07-29

申请号：US12161151

申请日：2007-01-17

申请人： Kinya Nakatsu ,  Takayoshi Nakamura ,  Ryuichi Saito ,  Takashi Suga ,  Hiroki Funato

发明人： Kinya Nakatsu ,  Takayoshi Nakamura ,  Ryuichi Saito ,  Takashi Suga ,  Hiroki Funato

IPC分类号： H05K7/20

CPC分类号： H05K7/2089 ,  B60L3/003 ,  B60L11/123 ,  B60L11/14 ,  B60L11/1861 ,  B60L15/007 ,  B60L15/20 ,  B60L2210/10 ,  B60L2210/30 ,  B60L2210/40 ,  B60L2220/14 ,  B60L2220/42 ,  B60L2240/12 ,  B60L2240/36 ,  B60L2240/421 ,  B60L2240/441 ,  B60L2240/525 ,  B60L2260/26 ,  B60L2260/28 ,  H02M7/003 ,  H05K7/20927 ,  Y02T10/6217 ,  Y02T10/645 ,  Y02T10/646 ,  Y02T10/7005 ,  Y02T10/7022 ,  Y02T10/7044 ,  Y02T10/705 ,  Y02T10/7077 ,  Y02T10/7216 ,  Y02T10/7241 ,  Y02T10/7275 ,  Y02T90/16

摘要： The object is to provide a power converter which is capable of minimizing an extent to which the power converter components other than the semiconductor module are thermally affected by the heat originating from the semiconductor module.A casing houses: semiconductor modules 20, 30 constituting a main circuit for power conversion; a capacitor 50 electrically connected to the main circuit; drive circuits 70, 71 that provide the main circuit with a drive signal used in power conversion operation; a control circuit 74 that provides the drive circuit with a control signal used to prompt the drive circuit to provide the drive signal. Within the casing, a cooling chamber including a coolant passage 28 is formed, and a chamber wall of the cooling chamber is formed with a thermally conductive material. At least the semiconductor modules 20, 30 are housed inside the cooling chamber, and at least the capacitor 50 and the control circuit 74 are disposed outside the cooling chamber.

摘要翻译： 本发明的目的是提供一种功率转换器，该功率转换器能够最小化半导体模块以外的功率转换器部件受来自半导体模块的热的热影响的程度。 壳体容纳：构成用于电力转换的主电路的半导体模块20,30; 电连接到主电路的电容器50; 驱动电路70,71，其向主电路提供用于电力转换操作的驱动信号; 为驱动电路提供用于提示驱动电路提供驱动信号的控制信号的控制电路74。 在壳体内形成有包括冷却剂通道28的冷却室，并且冷却室的室壁形成有导热材料。 至少半导体模块20,30容纳在冷却室内，并且至少电容器50和控制电路74设置在冷却室的外部。

公开(公告)号：US07604484B2

公开(公告)日：2009-10-20

申请号：US11670559

申请日：2007-02-02

申请人： Hiroki Funato ,  Takashi Suga ,  Tsutomu Hara

发明人： Hiroki Funato ,  Takashi Suga ,  Tsutomu Hara

IPC分类号： H01R12/00

CPC分类号： G01R31/001 ,  H05K1/0268 ,  H05K1/165 ,  H05K3/429 ,  H05K2201/09809 ,  H05K2201/10969

摘要： A circuit board having: a through hole to mount the circuit board to a casing or an electronic apparatus; and a coil-shaped conductive pattern provided on a plane perpendicular to the through hole so as to intersect a circumference around the through hole as a center.

摘要翻译： 一种电路板，具有：用于将电路板安装到壳体或电子设备的通孔; 以及设置在垂直于通孔的平面上的线圈状导电图案，以与通孔周围相交的圆周为中心。

公开(公告)号：US20070204251A1

公开(公告)日：2007-08-30

申请号：US11710965

申请日：2007-02-27

申请人： Mitsuaki Katagiri ,  Satoshi Nakamura ,  Takashi Suga ,  Yoji Nishio ,  Satoshi Isa ,  Satoshi Itaya

发明人： Mitsuaki Katagiri ,  Satoshi Nakamura ,  Takashi Suga ,  Yoji Nishio ,  Satoshi Isa ,  Satoshi Itaya

IPC分类号： G06F17/50

CPC分类号： G06F17/5068 ,  H01L23/50 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A method for designing a semiconductor package is disclosed, wherein the semiconductor package comprises a semiconductor chip and an adjustment target. A first target variable is calculated in consideration of a first transition state where an output level of the semiconductor chip changes from a low level to a high level. A second target variable is calculated in consideration of a second transition state where an output level of the semiconductor chip changes from the high level to the low level. Inferior one of the first and the second target variables is selected as a main target variable. The main target variable and a predetermined constraint represented in frequency domain are compared to decide design guidelines for the adjustment target.

摘要翻译： 公开了一种用于设计半导体封装的方法，其中半导体封装包括半导体芯片和调整对象。 考虑到半导体芯片的输出电平从低电平变为高电平的第一转变状态来计算第一目标变量。 考虑到半导体芯片的输出电平从高电平变为低电平的第二过渡状态来计算第二目标变量。 选择第一和第二目标变量之一作为主要目标变量。 比较主要目标变量和在频域中表示的预定约束，以决定调整目标的设计指南。

公开(公告)号：US06625554B2

公开(公告)日：2003-09-23

申请号：US09888112

申请日：2001-06-22

申请人： Takashi Suga ,  Kouichi Uesaka ,  Satoshi Nakamura ,  Yoshihiko Hayashi

发明人： Takashi Suga ,  Kouichi Uesaka ,  Satoshi Nakamura ,  Yoshihiko Hayashi

IPC分类号： G01R1900

CPC分类号： G01R31/315

摘要： The present invention provides a magnetic field measuring method and system for determining the magnetic field of an integrated circuit (IC) inside the IC package, including the pre-packaged IC. In one embodiment, induced voltages due only to the magnetic field are determined at measurement heights on the order of the line spacings in an integrated circuit. A magnetic probe is used; the probe has a loop of wire parallel to the current, for measuring the induced voltage of the horizontal component of the magnetic field. The induced voltage due to the electric field is removed by using a calculation including the difference of two measurements. The magnetic field distribution for the integrated circuit may be determined by using the above procedure on a grid like pattern above the IC.