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169 条记录 (耗时 0.032 秒)

    Wireless IC device and electronic device
    51.
    发明授权
    Wireless IC device and electronic device 有权
    无线IC器件和电子设备

    公开(公告)号：US07830311B2

    公开(公告)日：2010-11-09

    申请号：US11851661

    申请日：2007-09-07

    申请人： Takeshi Kataya ,  Noboru Kato ,  Satoshi Ishino ,  Nobuo Ikemoto ,  Ikuhei Kimura

    发明人： Takeshi Kataya ,  Noboru Kato ,  Satoshi Ishino ,  Nobuo Ikemoto ,  Ikuhei Kimura

    IPC分类号： H01Q1/38

    CPC分类号： H01Q7/00 ,  G06K19/07749 ,  G06K19/0775 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01Q1/2225 ,  H01Q1/38 ,  H05K1/0239 ,  H05K1/0243 ,  H05K1/141 ,  H05K1/16 ,  H05K2201/10098

    摘要： A wireless IC device includes a wireless IC chip for processing a transmission/reception signal, a printed wiring circuit board on which the wireless IC chip is mounted, a ground electrode disposed on the circuit board, and a substantially loop-shaped electrode that is electrically conducted to the wireless IC chip and disposed on the circuit board so as to be coupled to the ground electrode by an electromagnetic field. The ground electrode is coupled to the wireless IC chip via the substantially loop-shaped electrode to transmit/receive a radio frequency signal. A feeder circuit board including a resonant circuit and/or a matching circuit may be interposed between the wireless IC chip and the substantially loop-shaped electrode.

    摘要翻译： 无线IC器件包括用于处理发送/接收信号的无线IC芯片，安装无线IC芯片的印刷布线电路板，布置在电路板上的接地电极和电气基本上环形的电极 传导到无线IC芯片并且设置在电路板上，以便通过电磁场耦合到接地电极。 接地电极通过大致环形的电极耦合到无线IC芯片，以发射/接收射频信号。 包括谐振电路和/或匹配电路的馈电电路板可以插在无线IC芯片和基本上环形的电极之间。

    Wireless communication device and metal article
    52.
    发明授权
    Wireless communication device and metal article 有权
    无线通信设备和金属制品

    公开(公告)号：US08336786B2

    公开(公告)日：2012-12-25

    申请号：US13429465

    申请日：2012-03-26

    申请人： Noboru Kato ,  Koji Shiroki

    发明人： Noboru Kato ,  Koji Shiroki

    IPC分类号： G06K19/06

    CPC分类号： G06K19/07786 ,  G06K19/07771 ,  G06K19/07773 ,  G06K19/07775 ,  H01Q1/2208 ,  H01Q1/38 ,  H01Q1/48 ,  H01Q7/00 ,  H01Q9/0407

    摘要： A wireless communication device includes a wireless IC device, a dielectric substrate, and a metal plate. A radiation conductor coupled to the wireless IC device is provided on the front surface of the dielectric substrate, and a ground conductor connected to the radiation conductor through an interlayer connection conductor is provided on a back surface. The dielectric substrate is fixed to the metal plate via an insulating adhesive, and is crimped by a conductive member. The front and back surfaces of the metal plate are electrically connected to each other by the conductive member, and when a high-frequency signal is supplied from the wireless IC device, a high-frequency signal current on the front surface side of the metal plate is conducted to the back surface side of the metal plate through a surface boundary portion between the conductive member and the metal plate, and radiated as a high-frequency signal.

    摘要翻译： 无线通信装置包括无线IC器件，电介质基板和金属板。 耦合到无线IC器件的辐射导体设置在电介质基板的前表面上，并且在后表面上设置通过层间连接导体连接到辐射导体的接地导体。 电介质基板通过绝缘粘合剂固定在金属板上，并被导电部件卷曲。 金属板的前表面和背面通过导电构件彼此电连接，并且当从无线IC器件提供高频信号时，在金属板的前表面侧的高频信号电流 通过导电部件和金属板之间的表面边界部分向金属板的背面侧进行放电，作为高频信号照射。

    Electronic component
    54.
    发明授权
    Electronic component 失效
    电子元器件

    公开(公告)号：US5401910A

    公开(公告)日：1995-03-28

    申请号：US162444

    申请日：1993-12-03

    申请人： Harufumi Mandai ,  Noboru Kato ,  Koji Shiroki

    发明人： Harufumi Mandai ,  Noboru Kato ,  Koji Shiroki

    IPC分类号： C25D7/00 ,  H01G4/228 ,  H01G4/232 ,  H01L23/538 ,  H05K1/00

    CPC分类号： H01G4/2325 ,  H01L23/5383 ,  H01L2924/0002

    摘要： A ceramic substrate has a single plating film formed on both wiring electrodes formed on an upper surface of a ceramic body and external electrodes formed on side surfaces and a lower surface of the ceramic body. The plating film on the wiring electrodes and the external electrodes has a first plating layer made of Ni and a second plating layer made of Sn.

    摘要翻译： 陶瓷基板具有形成在陶瓷体的上表面上形成的两个布线电极上的单个电镀膜和形成在陶瓷体的侧面和下表面的外部电极。 布线电极和外部电极上的镀膜具有由Ni制成的第一镀层和由Sn制成的第二镀层。

    Transceiver and radio frequency identification tag reader
    55.
    发明授权
    Transceiver and radio frequency identification tag reader 有权
    收发器和射频识别标签读卡器

    公开(公告)号：US09460320B2

    公开(公告)日：2016-10-04

    申请号：US13437978

    申请日：2012-04-03

    申请人： Tsutomu Ieki ,  Ken Sakai ,  Noboru Kato ,  Koji Shiroki

    发明人： Tsutomu Ieki ,  Ken Sakai ,  Noboru Kato ,  Koji Shiroki

    IPC分类号： H04B1/38 ,  G06K7/00 ,  G06K7/10 ,  H01Q1/22 ,  H01Q25/00

    CPC分类号： G06K7/0008 ,  G06K7/10316 ,  H01Q1/2283 ,  H01Q25/001

    摘要： In a transceiver, on a top surface of a rectangular plate-shaped substrate, transmission radiating elements and receiving radiating elements are provided. The transmission radiating elements extend in the horizontal or lateral direction from the center of the substrate. The receiving radiating elements extend in the vertical or longitudinal direction from the center of the substrate. Inductors included in a matching feeding element are individually electromagnetically coupled to transmission-side feeding points that are inner end portions of the transmission radiating elements and receiving-side feeding points that are inner end portions of the receiving radiating elements. A transmission signal is transmitted with a wave polarized in the horizontal or lateral direction, and a signal having a vertical or longitudinal polarization direction is received.

    摘要翻译： 在收发器中，在矩形板状基板的顶表面上，设置有传输辐射元件和接收辐射元件。 透射辐射元件从基板的中心沿水平或横向方向延伸。 接收辐射元件从基板的中心在垂直或纵向方向上延伸。 包含在匹配馈送元件中的电感器单独地电磁耦合到作为接收辐射元件的内端部的发送辐射元件和接收侧馈电点的内端部的发送侧馈电点。 发送信号以水平方向或横向偏振的波发送，并且接收具有垂直或纵向偏振方向的信号。

    Antenna module
    56.
    发明授权
    Antenna module 有权

    公开(公告)号：US09705194B2

    公开(公告)日：2017-07-11

    申请号：US13368358

    申请日：2012-02-08

    申请人： Noboru Kato ,  Jun Sasaki ,  Satoshi Ishino ,  Katsumi Taniguchi

    发明人： Noboru Kato ,  Jun Sasaki ,  Satoshi Ishino ,  Katsumi Taniguchi

    IPC分类号： H01Q9/04

    CPC分类号： H01Q9/0407

    摘要： In an antenna module, a main portion includes a plurality of insulating sheets made of a flexible material and laminated on each other. An antenna configured to transmit/receive a high-frequency signal is disposed in the main portion. A connection portion is disposed in the main portion and is connected to an electronic device that inputs/outputs the high-frequency signal. A signal transmission line is disposed in the main portion and has a strip line structure or a microstrip line structure to transmit the high-frequency signal. An impedance matching circuit is disposed in the main portion and between the antenna and end of a signal transmission line facing in a negative x direction. An impedance matching circuit is disposed in the main portion and between the connection portion and an end of the signal transmission line facing in a positive x direction.

    Wireless IC device
    58.
    发明授权
    Wireless IC device 有权
    无线IC设备

    公开(公告)号：US08668151B2

    公开(公告)日：2014-03-11

    申请号：US12859880

    申请日：2010-08-20

    申请人： Noboru Kato ,  Satoshi Ishino

    发明人： Noboru Kato ,  Satoshi Ishino

    IPC分类号： G06K19/06

    CPC分类号： H01Q1/2225 ,  H01F17/0013 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15174 ,  H01L2924/181 ,  H01Q1/2283 ,  H01Q1/50 ,  H01Q7/00 ,  H01Q21/29 ,  H05K1/0239 ,  H05K1/0243 ,  H05K3/305 ,  H05K2201/10098 ,  H05K2201/10727 ,  H01L2924/00012 ,  H01L2224/0401

    摘要： A wireless IC device improves radiation characteristics or directivity of signals and reliably communicates with a reader/writer. The wireless IC device includes an electromagnetically coupled module includes a wireless IC device and a feed circuit substrate, a protective layer, a first radiation plate, and a second radiation plate. The feed circuit substrate includes a feed circuit including inductance elements. The feed circuit is electrically connected to the wireless IC chip and coupled to the radiation plates. Signals received by the radiation plates are provided to the wireless IC chip via the feed circuit. Signals from the wireless IC chip are provided to the radiation plates via the feed circuit and then radiated to the outside.

    摘要翻译： 无线IC器件提高信号的辐射特性或方向性，并可靠地与读/写器通信。 无线IC器件包括电磁耦合模块，其包括无线IC器件和馈电电路衬底，保护层，第一辐射板和第二辐射板。 馈电电路基板包括包括电感元件的馈电电路。 馈电电路电连接到无线IC芯片并耦合到辐射板。 由辐射板接收的信号通过馈电电路提供给无线IC芯片。 来自无线IC芯片的信号通过馈电电路提供给辐射板，然后辐射到外部。

    Signal line and circuit substrate
    59.
    发明授权
    Signal line and circuit substrate 有权

    公开(公告)号：US08592687B2

    公开(公告)日：2013-11-26

    申请号：US13343740

    申请日：2012-01-05

    申请人： Noboru Kato ,  Jun Sasaki ,  Satoshi Ishino

    发明人： Noboru Kato ,  Jun Sasaki ,  Satoshi Ishino

    IPC分类号： H05K1/02

    CPC分类号： H05K1/0298 ,  H01P3/081 ,  H01P3/088 ,  H05K1/0219 ,  H05K1/0225 ,  H05K1/028 ,  H05K2201/0715 ,  H05K2201/09618

    摘要： A signal line is a linear conductor provided within a laminated body. A first ground conductor is provided on a positive direction side in a z axis direction within the laminated body, compared with the signal line, and overlaps with the signal line in a planar view seen from the z axis direction. A second ground conductor is provided on a negative direction side in the z axis direction within the laminated body, compared with the signal line, and overlaps with the signal line in the planar view seen from the z axis direction. Via hole conductors connect the ground conductors to each other. In the first ground conductor, a plurality of opening portions are arranged along the signal line in the planar view seen from the z axis direction. The via hole conductors are provided between the opening portions adjacent to one another, in an x axis direction.