公开(公告)号：US07640651B2

公开(公告)日：2010-01-05

申请号：US11028945

申请日：2005-01-03

申请人： Adam L. Cohen ,  Vacit Arat ,  Michael S. Lockard ,  Christopher A. Bang ,  Pavel B. Lembrikov

发明人： Adam L. Cohen ,  Vacit Arat ,  Michael S. Lockard ,  Christopher A. Bang ,  Pavel B. Lembrikov

IPC分类号： H01F3/04 ,  H01F7/06

CPC分类号： G01R3/00 ,  B33Y10/00 ,  C23C18/1605 ,  C23C18/1651 ,  C25D1/003 ,  G01R1/06716 ,  G01R1/07378 ,  Y10T29/49002 ,  Y10T29/4902 ,  Y10T29/49078 ,  Y10T29/49204 ,  Y10T29/49222

摘要： Embodiments of the invention provide fabrication processes for the co-fabrication of microprobe arrays along with one or more space transformers wherein the fabrication processes include the forming and adhering of a plurality of layers to previously formed layers and wherein at least a portion of the plurality of layers are formed from at least one structural material and at least one sacrificial material that is at least in part released from the plurality of layers after formation and wherein the space transformer includes a plurality of interconnect elements that connect one side to the array of probes that has a first spacing to another side that has a second spacing where the second spacing is greater than the first spacing. In some embodiments, the fabrication process includes a plurality of electrodeposition operations.

摘要翻译： 本发明的实施例提供了用于与一个或多个空间变压器共同制造微探针阵列的制造工艺，其中制造工艺包括将多个层形成和粘附到先前形成的层，并且其中多个 层由至少一种结构材料和至少一种牺牲材料形成，所述至少一种牺牲材料在形成之后至少部分地从所述多个层释放，并且其中所述空间变换器包括将一侧连接到所述探针阵列的多个互连元件， 具有第二间隔，第二间隔具有第二间隔，其中第二间隔大于第一间隔。 在一些实施例中，制造工艺包括多个电沉积操作。

公开(公告)号：US07623935B2

公开(公告)日：2009-11-24

申请号：US11029173

申请日：2005-01-03

申请人： Adam L. Cohen ,  Jeffrey A. Thompson

发明人： Adam L. Cohen ,  Jeffrey A. Thompson

IPC分类号： G06F17/50 ,  G06F19/00

CPC分类号： C25D5/022 ,  B33Y10/00 ,  B33Y50/02 ,  C25D1/10 ,  C25D5/10

摘要： Some embodiments of the invention are directed to techniques for electrochemically fabricating multi-layer three-dimensional structures where selective patterning of at least one or more layers occurs via a mask which is formed using data representing cross-sections of the three-dimensional structure which has been modified to place it in a polygonal form which defines only regions of positive area. The regions of positive area are regions where structural material is to be located or regions where structural material is not to be located depending on whether the mask will be used, for example, in selectively depositing a structural material or a sacrificial material. The modified data may take the form of adjacent or slightly overlapped relative narrow rectangular structures where the width of the structures is related to a desired formation resolution. The spacing between centers of adjacent rectangles may be uniform or may be a variable. The data modification may also include the formation of duplicate copies of an original structure, scaled copies, mirrored copies, rotated copies, complementary copies, and the like.

摘要翻译： 本发明的一些实施例涉及用于电化学制造多层三维结构的技术，其中至少一个或多个层的选择性图案化通过掩模发生，该掩模使用表示具有三维结构的横截面的数据形成，该三维结构具有 被修改为将其定义为仅限定正面积区域的多边形形式。 根据是否使用掩模，例如选择性地沉积结构材料或牺牲材料，正面积的区域是结构材料要被定位的区域或者结构材料不被定位的区域。 修改的数据可以采取相邻或稍微重叠的相对窄的矩形结构的形式，其中结构的宽度与期望的地层分辨率相关。 相邻矩形的中心之间的间距可以是均匀的或可以是变量。 数据修改还可以包括形成原始结构，缩放副本，镜像副本，旋转副本，补充副本等的重复副本。

公开(公告)号：US20090197371A1

公开(公告)日：2009-08-06

申请号：US12349768

申请日：2009-01-07

申请人： Adam L. Cohen ,  Vacit Arat ,  Michael S. Lockard ,  Christopher R. Folk ,  Marvin M. Kilgo, III

发明人： Adam L. Cohen ,  Vacit Arat ,  Michael S. Lockard ,  Christopher R. Folk ,  Marvin M. Kilgo, III

IPC分类号： H01L21/50

CPC分类号： H01L21/4857 ,  C23C18/1605 ,  C23C18/1651 ,  C25D1/003 ,  G01R1/07378 ,  G01R3/00 ,  H01L23/13 ,  H01L23/427 ,  H01L23/473 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/1461 ,  H01L2924/15174 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2224/0401

摘要： Embodiments of the invention provide methods for packaging integrated circuits and/or other electronic components with electrochemically fabricated structures which include conductive interconnection elements. In some embodiments the electrochemically produced structures are fabricated on substrates that include conductive vias while in other embodiments, the substrates are solid blocks of conductive material, or conductive material containing passages that allow the flow of fluid to maintain desired thermal properties of the packaged electronic components.

摘要翻译： 本发明的实施例提供了用于封装集成电路和/或具有包括导电互连元件的电化学制造的结构的其它电子部件的方法。 在一些实施例中，电化学产生的结构被制造在包括导电通孔的衬底上，而在其他实施例中，衬底是导电材料的固体块，或者包含允许流体流动保持封装的电子部件的期望热性能的导电材料 。

公开(公告)号：US07567089B2

公开(公告)日：2009-07-28

申请号：US11636147

申请日：2006-12-07

申请人： Richard T. Chen ,  Vacit Arat ,  Chris Folk ,  Adam L. Cohen

发明人： Richard T. Chen ,  Vacit Arat ,  Chris Folk ,  Adam L. Cohen

IPC分类号： G01R31/02

CPC分类号： G01R1/0483 ,  G01R1/06727 ,  G01R1/06733 ,  G01R1/07342 ,  G01R1/07357 ,  G01R3/00 ,  G01R31/2886

摘要： Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of two-part probe elements, socket-able probes and their mounts. Some embodiments are directed to methods for fabricating such probes and mounts. In some embodiments, for example, probes have slide in mounting structures, twist in mounting structures, mounting structures that include compliant elements, and the like.

摘要翻译： 本文公开的实施例涉及用于与电子电路等进行临时或永久接触的柔性探针结构。 具体地，实施例涉及两部分探针元件，可插座探针及其安装件的各种设计。 一些实施例涉及制造这种探针和支架的方法。 在一些实施例中，例如，探针在安装结构中具有滑动，在安装结构中扭转，包括柔顺元件的安装结构等。

公开(公告)号：US20090176042A1

公开(公告)日：2009-07-09

申请号：US12404843

申请日：2009-03-16

申请人： Adam L. Cohen

发明人： Adam L. Cohen

IPC分类号： A61F2/06 ,  B05D3/00

CPC分类号： A61F2/91 ,  A61F2002/065 ,  A61F2210/0076 ,  A61F2230/0058 ,  A61F2230/006 ,  Y10T428/13

摘要： Various embodiments of the invention present miniature medical devices that may be formed totally or in part using electrochemical fabrication techniques. Sample medical devices include micro-tweezers or forceps, internally expandable stents, bifurcated or side branch stents, drug eluting stents, micro-valves and pumps, rotary ablation devices, electrical ablation devices (e.g. RF devices), micro-staplers, ultrasound catheters, and fluid filters. In some embodiments devices may be made out of a metal material while in other embodiments they may be made from a material (e.g. a polymer) that is molded from an electrochemically fabricated mold. Structural materials may include gold, platinum, silver, stainless steel, titanium or pyrolytic carbon-coated materials such as nickel, copper, and the like.

摘要翻译： 本发明的各种实施例提供可以使用电化学制造技术全部或部分地形成的微型医疗装置。 样品医疗设备包括微型镊子或镊子，内部可扩张支架，分叉或侧支支架，药物洗脱支架，微型阀和泵，旋转消融装置，电消融装置（例如RF装置），微型吻合器，超声导管， 和流体过滤器。 在一些实施例中，装置可以由金属材料制成，而在其它实施例中，它们可以由从电化学制造的模具模制的材料（例如聚合物）制成。 结构材料可以包括金，铂，银，不锈钢，钛或热解碳涂层材料如镍，铜等。

公开(公告)号：US20090142493A1

公开(公告)日：2009-06-04

申请号：US11927671

申请日：2007-10-29

申请人： Gang Zhang ,  Adam L. Cohen

发明人： Gang Zhang ,  Adam L. Cohen

IPC分类号： B05D3/00 ,  C25D5/02 ,  B05D1/32

CPC分类号： C25D1/003 ,  C25D5/022 ,  C25D5/10 ,  C25D5/12 ,  C25D5/14 ,  C25D5/18 ,  C25D5/34 ,  C25D5/40 ,  C25D5/48 ,  C25D5/50 ,  H01L21/2885 ,  H01L21/76879 ,  H05K3/241 ,  H05K3/243

摘要： Multi-layer microscale or mesoscale structures are fabricated with adhered layers (e.g. layers that are bonded together upon deposition of successive layers to previous layers) and are then subjected to a heat treatment operation that enhances the interlayer adhesion significantly. The heat treatment operation is believed to result in diffusion of material across the layer boundaries and associated enhancement in adhesion (i.e. diffusion bonding). Interlayer adhesion and maybe intra-layer cohesion may be enhanced by heat treating in the presence of a reducing atmosphere that may help remove weaker oxides from surfaces or even from internal portions of layers.

公开(公告)号：US20090068460A1

公开(公告)日：2009-03-12

申请号：US12203094

申请日：2008-09-02

申请人： Michael S. Lockard ,  Adam L. Cohen ,  Vacit Arat ,  Dennis R. Smalley

发明人： Michael S. Lockard ,  Adam L. Cohen ,  Vacit Arat ,  Dennis R. Smalley

IPC分类号： B32B5/00

CPC分类号： C25D1/08 ,  B33Y70/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/10 ,  Y10T137/86759 ,  Y10T428/12361 ,  Y10T428/12479 ,  Y10T428/19 ,  Y10T428/24975 ,  Y10T428/249981 ,  Y10T428/29

摘要： Embodiments of multi-layer three-dimensional structures and formation methods provide structures with effective feature (e.g. opening) sizes (e.g. virtual gaps) that are smaller than a minimum feature size (MFS) that exists on each layer as a result of the formation method used in forming the structures. In some embodiments, multi-layer structures include a first element (e.g. first patterned layer with a gap) and a second element (e.g. second patterned layer with a gap) positioned adjacent the first element to define a third element (e.g. a net gap or opening resulting from the combined gaps of the first and second elements) where the first and second elements have features that are sized at least as large as the minimum feature size and the third element, at least in part, has dimensions or defines dimensions smaller than the minimum feature size.

摘要翻译： 多层三维结构和形成方法的实施例提供结构，其具有小于作为形成方法的结果存在于每个层上的最小特征尺寸（MFS）的有效特征（例如开口）尺寸（例如，虚拟间隙） 用于形成结构。 在一些实施例中，多层结构包括第一元件（例如具有间隙的第一图案化层）和邻近第一元件定位的第二元件（例如具有间隙的第二图案化层），以限定第三元件（例如，净间隙或 第一和第二元件的组合间隙产生的开口），其中第一和第二元件具有尺寸至少与最小特征尺寸一样大的特征，并且第三元件至少部分具有尺寸或尺寸小于 最小特征尺寸。

公开(公告)号：US20090065142A1

公开(公告)日：2009-03-12

申请号：US12206621

申请日：2008-09-08

申请人： Gang Zhang ,  Adam L. Cohen ,  Michael S. Lockard ,  Ananda H. Kumar ,  Ezekiel J. J. Kruglick ,  Kieun Kim

发明人： Gang Zhang ,  Adam L. Cohen ,  Michael S. Lockard ,  Ananda H. Kumar ,  Ezekiel J. J. Kruglick ,  Kieun Kim

IPC分类号： B32B37/06

CPC分类号： C25D5/50 ,  C25D1/003 ,  C25D5/022 ,  C25D5/10 ,  C25D5/12 ,  C25D5/14 ,  C25D5/18 ,  C25D5/34 ,  C25D5/40 ,  C25D5/48 ,  H01L21/2885 ,  H01L21/76879 ,  H05K3/241 ,  H05K3/243

摘要： Multi-layer microscale or mesoscale structures are fabricated with adhered layers (e.g. layers that are bonded together upon deposition of successive layers to previous layers) and are then subjected to a heat treatment operation that enhances the interlayer adhesion significantly. The heat treatment operation is believed to result in diffusion of material across the layer boundaries and associated enhancement in adhesion (i.e. diffusion bonding). Interlayer adhesion and maybe intra-layer cohesion may be enhanced by heat treating in the presence of a reducing atmosphere that may help remove weaker oxides from surfaces or even from internal portions of layers.

摘要翻译： 多层微尺度或中尺度结构用粘附层（例如在连续层沉积到先前层上时结合在一起的层）制造，然后进行显着增强层间粘合的热处理操作。 认为热处理操作导致材料在层边界上的扩散，并且附着力增强（即扩散粘合）。 可以通过在有助于从表面甚至从内部部分去除较弱的氧化物的还原气氛的热处理来增强层间粘附和可能的层内内聚力。

公开(公告)号：US07498714B2

公开(公告)日：2009-03-03

申请号：US10949744

申请日：2004-09-24

申请人： Michael S. Lockard ,  Adam L. Cohen ,  Vacit Arat ,  Dennis R. Smalley

发明人： Michael S. Lockard ,  Adam L. Cohen ,  Vacit Arat ,  Dennis R. Smalley

IPC分类号： H02N1/00 ,  F16K31/02

CPC分类号： C25D1/08 ,  B33Y70/00 ,  C25D1/003 ,  C25D5/022 ,  C25D5/10 ,  Y10T137/86759 ,  Y10T428/12361 ,  Y10T428/12479 ,  Y10T428/19 ,  Y10T428/24975 ,  Y10T428/249981 ,  Y10T428/29

摘要： Embodiments of multi-layer three-dimensional structures and formation methods provide structures with effective feature (e.g. opening) sizes (e.g. virtual gaps) that are smaller than a minimum feature size (MFS) that exists on each layer as a result of the formation method used in forming the structures. In some embodiments, multi-layer structures include a first element (e.g. first patterned layer with a gap) and a second element (e.g. second patterned layer with a gap) positioned adjacent the first element to define a third element (e.g. a net gap or opening resulting from the combined gaps of the first and second elements) where the first and second elements have features that are sized at least as large as the minimum feature size and the third element, at least in part, has dimensions or defines dimensions smaller than the minimum feature size.

摘要翻译： 多层三维结构和形成方法的实施例提供结构，其具有小于作为形成方法的结果存在于每个层上的最小特征尺寸（MFS）的有效特征（例如开口）尺寸（例如，虚拟间隙） 用于形成结构。 在一些实施例中，多层结构包括第一元件（例如具有间隙的第一图案化层）和邻近第一元件定位的第二元件（例如具有间隙的第二图案化层），以限定第三元件（例如，净间隙或 第一和第二元件的组合间隙产生的开口），其中第一和第二元件具有尺寸至少与最小特征尺寸一样大的特征，并且第三元件至少部分具有尺寸或尺寸小于 最小特征尺寸。

公开(公告)号：US07488686B2

公开(公告)日：2009-02-10

申请号：US11523206

申请日：2006-09-19

申请人： Adam L. Cohen ,  Dennis R. Smalley ,  Michael S. Lockard ,  Qui T. Le

发明人： Adam L. Cohen ,  Dennis R. Smalley ,  Michael S. Lockard ,  Qui T. Le

IPC分类号： H01L21/311

CPC分类号： H01L21/288 ,  B33Y10/00 ,  C23C18/1605 ,  C25D5/022 ,  C25D5/10 ,  H01L21/311 ,  H01L21/7682 ,  H01L21/76879

摘要： A method of fabricating three-dimensional structures from a plurality of adhered layers of at least a first and a second material wherein the first material is a conductive material and wherein each of a plurality of layers includes treating a surface of a first material prior to deposition of the second material. The treatment of the surface of the first material either (1) decreases the susceptibility of deposition of the second material onto the surface of the first material or (2) eases or quickens the removal of any second material deposited on the treated surface of the first material. In some embodiments the treatment of the first surface includes forming a dielectric coating over the surface and the second material is electrodeposited (e.g. using an electroplating or electrophoretic process). In other embodiments the first material is coated with a conductive material that doesn't readily accept deposits of electroplated or electroless deposited materials.

摘要翻译： 从至少第一和第二材料的多个粘附层制造三维结构的方法，其中所述第一材料是导电材料，并且其中多个层中的每一个包括在沉积之前处理第一材料的表面 的第二种材料。 第一材料的表面的处理（1）降低了将第二材料沉积到第一材料的表面上的敏感性，或（2）减轻或加快了沉积在第一材料的处理表面上的任何第二材料的去除 材料。 在一些实施例中，第一表面的处理包括在表面上形成电介质涂层，并且第二材料被电沉积（例如使用电镀或电泳工艺）。 在其它实施例中，第一材料涂覆有不容易接受电镀或无电沉积材料沉积物的导电材料。