利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

57 条记录 (耗时 0.042 秒)

    Coaxial interconnect devices and methods of making the same
    51.
    发明授权
    Coaxial interconnect devices and methods of making the same 失效
    同轴互连设备及其制作方法

    公开(公告)号：US6086383A

    公开(公告)日：2000-07-11

    申请号：US103971

    申请日：1998-06-24

    申请人： Benjamin V. Fasano ,  Kevin M. Prettyman

    发明人： Benjamin V. Fasano ,  Kevin M. Prettyman

    IPC分类号： H01R12/57 ,  H01R24/50 ,  H01R43/00 ,  H05K1/02 ,  H05K1/14 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H01R12/00

    CPC分类号： H01R24/50 ,  H01R12/57 ,  H05K1/0243 ,  H01L2924/0002 ,  H01R2103/00 ,  H05K1/0237 ,  H05K2201/09809 ,  H05K2201/10325 ,  H05K2201/10333 ,  H05K2201/10378 ,  H05K2201/10962 ,  H05K3/325 ,  H05K3/341 ,  H05K3/4015 ,  Y10T29/49123 ,  Y10T29/49147

    摘要： A surface mounted electronic interconnect device. The device includes a coaxial electrical pad comprising a plurality of conductive surfaces on a substrate corresponding to the conductor arrangement of a coaxial connector; and, a coaxial connector comprising a dielectric material having a center opening and isolated electrically conductive interior and exterior surfaces that are planar with the ends of the connector. The dielectric separates the inner conductive surface from the outer conductive surface and is tubularly shaped having an inner wall for the electrically conductive interior surface. The coaxial connector inner and outer conductors may alternatively be comprised of microsprings. The coaxial connector has first and second ends, the first end for attachment to an electronic package and the second end for pluggable attachment to a PC board. A socket for mating with the coaxial connector second end is demonstrated, comprising a body and inner and outer conductors and configured so as to contact the interior and exterior surfaces of the coaxial connector at different times. The inner conductor of the socket is adapted to be received within the electrically conductive interior surface of the coaxial connector.

    摘要翻译： 表面安装的电子互连器件。 该装置包括：同轴电焊盘，其包括在与同轴连接器的导体布置相对应的衬底上的多个导电表面; 以及包括电介质材料的同轴连接器，所述电介质材料具有与所述连接器的端部平坦的中心开口和隔离的导电内部和外部表面。 电介质将内部导电表面与外部导电表面分离，并且管状地形成有用于导电内表面的内壁。 同轴连接器内外导体也可以由微弹簧构成。 同轴连接器具有第一端和第二端，用于附接到电子封装的第一端和用于可插拔连接到PC板的第二端。 示出了用于与同轴连接器第二端配合的插座，包括主体和内部和外部导体，并且构造成在不同时间接触同轴连接器的内部和外部表面。 插座的内导体适于被容纳在同轴连接器的导电内表面内。

    Solid oxide fuel cell having vias and a composite interconnect
    52.
    发明授权
    Solid oxide fuel cell having vias and a composite interconnect 失效
    具有通孔和复合互连的固体氧化物燃料电池

    公开(公告)号：US6051330A

    公开(公告)日：2000-04-18

    申请号：US7891

    申请日：1998-01-15

    申请人： Benjamin V. Fasano ,  Kevin M. Prettyman

    发明人： Benjamin V. Fasano ,  Kevin M. Prettyman

    IPC分类号： H01M8/02 ,  H01M4/86

    CPC分类号： H01M8/0226 ,  H01M8/006 ,  H01M8/0208 ,  H01M8/0215 ,  H01M8/0243 ,  H01M8/12 ,  H01M8/2425 ,  H01M8/2485 ,  H01M2300/0074 ,  Y10T29/49114

    摘要： One aspect of the invention relates to an interconnect for an SOFC wherein the interconnect is made from a cermet including partially stabilized tetragonal zirconia and a superalloy that is resistant to oxidizing and reducing conditions. Another aspect of the invention relates to an SOFC having vias for carrying fuel and an oxidant and at least one patterned feature in the anode, electrolyte, cathode and/or interconnect for laterally distributing the fuel or oxidant.

    摘要翻译： 本发明的一个方面涉及一种用于SOFC的互连，其中所述互连由金属陶瓷制成，所述金属陶瓷包括部分稳定的四方晶氧化锆和耐氧化和还原条件的超合金。 本发明的另一方面涉及一种具有用于承载燃料和氧化剂的通孔的SOFC，以及用于横向分配燃料或氧化剂的阳极，电解质，阴极和/或互连中的至少一个图案化特征。

    Solid oxide fuel cell having a catalytic anode
    53.
    发明授权
    Solid oxide fuel cell having a catalytic anode 失效
    具有催化阳极的固体氧化物燃料电池

    公开(公告)号：US6051329A

    公开(公告)日：2000-04-18

    申请号：US7890

    申请日：1998-01-15

    申请人： Benjamin V. Fasano ,  Kevin M. Prettyman

    发明人： Benjamin V. Fasano ,  Kevin M. Prettyman

    IPC分类号： H01M8/12 ,  H01M8/24 ,  H01M4/88

    CPC分类号： H01M4/9066 ,  H01M8/1231 ,  H01M2008/1293 ,  H01M2300/0074 ,  H01M4/905 ,  H01M8/2425 ,  Y02P70/56 ,  Y10T29/49114 ,  Y10T29/49115

    摘要： Disclosed is an SOFC having a catalytic anode including a porous, ceramic anode including a catalyst, wherein the catalyst is selected from the group consisting of platinum, rhodium, ruthenium and mixtures thereof; a dense, solid electrolyte adjacent to the porous, ceramic anode; a porous, ceramic cathode adjacent to the dense, solid electrolyte; and a dense, ceramic interconnect adjacent to the porous, ceramic cathode, wherein the dense, ceramic interconnect has nonintersecting passages for the flow of a fuel and an oxidant. Also disclosed is a method to make the SOFC having a catalytic anode.

    摘要翻译： 公开了具有催化阳极的SOFC，其包括包含催化剂的多孔陶瓷阳极，其中所述催化剂选自铂，铑，钌及其混合物; 邻近多孔陶瓷阳极的致密固体电解质; 与致密的​​固体电解质相邻的多孔陶瓷阴极; 以及与所述多孔陶瓷阴极相邻的致密的陶瓷互连，其中所述致密陶瓷互连件具有用于燃料和氧化剂流动的非接触通道。 还公开了使SOFC具有催化剂阳极的方法。

    Vias and method for making the same in organic board and chip carriers
    55.
    发明授权
    Vias and method for making the same in organic board and chip carriers 失效
    在有机板和芯片载体上制作相同的通孔和方法

    公开(公告)号：US5949030A

    公开(公告)日：1999-09-07

    申请号：US971064

    申请日：1997-11-14

    申请人： Benjamin V. Fasano ,  Kevin M. Prettyman

    发明人： Benjamin V. Fasano ,  Kevin M. Prettyman

    IPC分类号： H01L21/48 ,  H05K1/11 ,  H05K3/42 ,  H05K3/46 ,  H05K1/02

    CPC分类号： H05K3/429 ,  H01L21/486 ,  H05K1/115 ,  H01L2223/6616 ,  H01L2223/6622 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09809 ,  H05K3/4602 ,  Y10T29/49165

    摘要： Multiple vias are produced coaxially or in axis parallel alignment in a first or primary through-hole in a printed circuit board, chip carrier or like electrical device by producing a primary metallized through hole or via which is then filled or coated with a dielectric material which is also placed on both surfaces of the device at the ends of the via. The dielectric material inside the via can then be provided with at least one coaxial through-hole or multiple axis parallel through holes which can be metallized to form conductive paths between the surfaces of the device. Portions of the dielectric surface layer can be removed to expose contacts to the inner metallized via. Successive coaxial vias can be made in any number by the method of the invention. In addition electrical signal paths can be isolated within voltage or ground co-axial conductors.

    摘要翻译： 在印刷电路板，芯片载体或类似电气装置中的第一或主要通孔中同轴地或以轴线平行对准地制造多个通孔，通过产生初级金属化通孔或通孔，然后填充或涂覆电介质材料， 也放置在通孔两端的设备的两个表面上。 通孔内部的电介质材料可以设置有至少一个同轴的通孔或多个平行的通孔，其可以被金属化以在器件的表面之间形成导电路径。 电介质表面层的一部分可以被去除以暴露与内部金属化通孔的触点。 可以通过本发明的方法以任意数量形成连续的同轴通孔。 此外，电信号路径可以在电压或地面同轴导体内隔离。