摘要:
A system and method for an improved magnetic head arm assembly (HAA) is disclosed. The HAA includes three principal components, a head gimbal assembly (HGA), a flexible printed circuit (FPC) assembly, and an actuator coil assembly. The design allows for HAA rigidity, yet each of the components is designable and manufacturable independent of one another, in addition to other advantages over current methods.
摘要:
A battery pack configured for lithium ion battery cells includes an inner bonding layer, an intermediate stainless steel layer and an outer protective layer. Due to the arrangement of the intermediate stainless steel layer, the lithium ion battery cell having the battery pack in accordance with the present invention has desirable strength and energy density.
摘要:
Embodiments of the invention provide an improved process for depositing tungsten-containing materials. The process utilizes soak processes and vapor deposition processes, such as atomic layer deposition (ALD) to provide tungsten films having significantly improved surface uniformity and production level throughput. In one embodiment, a method for forming a tungsten-containing material on a substrate is provided which includes positioning a substrate within a process chamber, wherein the substrate contains an underlayer disposed thereon, exposing the substrate sequentially to a tungsten precursor and a reducing gas to deposit a tungsten nucleation layer on the underlayer during an ALD process, wherein the reducing gas contains a hydrogen/hydride flow rate ratio of about 40:1, 100:1, 500:1, 800:1, 1,000:1, or greater, and depositing a tungsten bulk layer on the tungsten nucleation layer. The reducing gas contains a hydride compound, such as diborane, silane, or disilane.
摘要:
A process for producing a class of polyarylenes having p-bis-(chlorodifluoromethyl)benzene or p-bis(bromodifluoromethyl)benzene as a comonomer. The p-bis-(chlorodifluoromethyl)benzene or the p-bis(bromodifluoromethyl)benzene act as precursors in a polycondensation reaction with a difunctional monomer.
摘要:
A system and method for an improved magnetic head arm assembly (HAA) is disclosed. The HAA includes three principal components, a head gimbal assembly (HGA), a flexible printed circuit (FPC) assembly, and an actuator coil assembly. The design allows for HAA rigidity, yet each of the components is designable and manufacturable independent of one another, in addition to other advantages over current methods.
摘要:
A method of surface modification in fabricating High Temperature Superconducting devices, characterized in that bombarding the preformed material surface with a particle beam having energy, to improve the smoothness of the material surface and change the microstructure or internal defects of the processed material, wherein the energy of the particle beam is in the range of 5 ev to 50000 ev, and the incidence angle is in the range of 5 degree to 85 degree. In some cases, in order to achieve the desired superconductivity, the bombarded sample is annealed, and the annealing temperature is in the range of 100° C. to 1500° C. The present invention can improve the surface smoothness of the processed material, reduce the surface defect, change the microstructure of the material, and thereby improve the superconductivity of the whole device. The bombarded material comprises a substrate, a transition layer, superconducting layer or any combination of them during the process of the fabrication of the superconducting devices.
摘要:
A head arm assembly (HAA) includes a head slider having at least one head element, an arm member for supporting the head slider at one end section, an actuator, mounted to the other end section of the arm member, for rotationally moving the arm member in a direction substantially parallel with a recording medium surface around an axis for horizontal rotation of the arm member, and a load generation unit for generating a load for energizing the head slider in a direction to the recording medium surface by rotationally moving the arm member in a direction substantially orthogonal to the recording medium surface around an axis for vertical rotation. The position of the center of gravity of the HAA is located at a different position from the axis for vertical rotation on a center axis of the arm member.
摘要:
Methods for sequencing nucleic acids are presented. Sequencing is accomplished through the chemical amplification of the products of DNA synthesis and the detection of the chemically amplified products. In embodiments of the invention, a substrate is provided having a plurality of molecules of DNA to be sequenced attached and a plurality of molecules capable of chelating pyrophosphate ions attached, the DNA molecules to be sequenced are primed, and a next complementary nucleotide is incorporated and excised a plurality of times leading to the buildup of pyrophosphate ions locally around the DNA molecule to be sequenced. Pyrophosphate ions are captured by the substrate-attached chelators and optically detected to determine the identity of the next complementary nucleic acid in the DNA molecule to be sequenced.
摘要:
Various embodiments provide devices, methods, and systems for high throughput biomolecule detection using transducer arrays. In one embodiment, a transducer array made up of transducer elements may be used to detect byproducts from chemical reactions that involve redox genic tags. Each transducer element may include at least a reaction chamber and a fingerprinting region, configured to flow a fluid from the reaction chamber through the fingerprinting region. The reaction chamber can include a molecule attachment region and the fingerprinting region can include at least one set of electrodes separated by a nanogap for conducting redox cycling reactions. In embodiments, by flowing the chamber content obtained from a reaction of a latent redox tagged probe molecule, a catalyst, and a target molecule in the reaction chamber through the fingerprinting region, the redox cycling reactions can be detected to identify redox-tagged biomolecules.
摘要:
A method of molding a substrate containing a plurality of electronic devices by providing a carrier comprising a frame which includes an adhesive film. The substrate is mounted onto the adhesive film of the carrier such that the frame surrounds the substrate. The carrier is placed in a mold such that the frame is located at a clamping area of the mold and the substrate is located at a molding area of the mold where molding cavities are located. The frame is clamped at the clamping area while the electronic devices are located in the molding cavities for molding with an encapsulant.