摘要:
A set of logic elements can be configured as a cascadable shift register. In one embodiment, a logic element for an FPGA can be configured as any one of a random access memory, a cascadable shift register and a lookup table. The data-in path to the shift register includes a cascade multiplexer for optionally forming large shift registers using multiple logic elements. Each logic element includes a plurality of memory cells which are interconnected such that the data output of each memory cell can serve as the input to the next memory cell, causing the logic element to function as a shift register. The cascade multiplexer allows the last bit of one logic element to be connected to the first bit of the next logic element, bypassing any decode logic of the lookup table. Variable tap shift registers of arbitrary length can be created by cascading lookup tables of plural logic elements in series. The lookup table decode logic plus additional multiplexers can be used to select any memory cell (not necessarily the last memory cell) of the shift register.
摘要:
A field programmable gate array (FPGA) is provided that includes a plurality of pads and a plurality of delay locked loops (DLLs). Programmable connections enable any one of the DLLs to have multiple pads as inputs. Programmable connections also enable the DLLs to be selectively connected to one another. Programmable connections further enable the pads to be selectively connected to general interconnect circuitry or global clock drivers of the FPGA. Programmable connections are also provided for selectively connecting the DLLs to the global clock drivers. This FPGA structure enables the pads to be configured to receive either clock or non-clock signals. This structure also enables the FPGA to operate as a clock mirror, and to generate one clock signal from another clock signal on the FPGA.
摘要:
An integrated circuit thermal conduction module comprises a substrate having a chip-carrying surface and at least one integrated circuit chip on the substrate. A deformable, liquid-impermeable, thermally conductive film or foil extends over an upper surface of the chip. A piston has a lower surface which urges and conforms the film against the chip upper surface and which contains at least one open channel permitting coolant passage and contact with the film for conveying heat from the chip without direct contact between the coolant and chip. Preferably, the piston has a central passageway extending along the longitudinal axis for channeling the coolant through the piston, and has a plurality of channels extending radially outwardly from the central passageway along the lower face for directing coolant beneath the piston.
摘要:
A method for co-sintering ceramic/metal multi-layered ceramic substrates wherein X-Y shrinkage is controlled and X-Y distortion and Z-direction chamber are substantially eliminated. Binder-burnoff is substantially not aggravated during this process as well. The process is accomplished by applying selective forces to the surfaces of the ceramic substrates to control lateral movement while allowing Z direction shrinkage movement. Frictional force means, pneumatic forced means and weights are among the means used to supply forces. Cerium oxide is used in certain embodiments to enhance binder-burnoff.
摘要:
A method and apparatus to test the inter-die interface between two or more semiconductor die in die stacking applications, where a mismatch exists between the number of input and output pads on a base die and the number of input and output pads on a stacked die. In a first embodiment, a number of through-die vias (TDVs) may be used to implement inter-die signal paths using standard or flexible design rules to maintain statistical TDV yield despite the lack of continuity verification of the inter-die signals paths. In alternate embodiments, programmable multiplexers may be utilized to share one or more inter-die connections between the base die and the one or more stacked die so as to facilitate testing and normal operation of each inter-die connection. In other embodiments, spare TDVs are utilized only during test operations, so as to accommodate the mismatch. In yet other embodiments, built-in-test (BIT) circuits are configured to perform logic operations using a plurality of inter-die input/output (I/O) signals to eliminate the need to implement an identical number of input and output ports between the base die and the one or more stacked die to facilitate inter-die testing.
摘要:
In a multiplier architecture, all stages of a multiplication function are implemented using a uniform array of logic blocks. An exemplary multiplier circuit includes a two-dimensional array of substantially similar logic blocks. Each logic block includes a multiply block and a logic circuit driven by the multiply block. The logic circuit is coupled to implement an add function. A first portion of the array is coupled to receive the first and second multiplicand inputs, to provide a partial product bus, and to provide lower bits of the product output. A second portion is coupled to receive the partial product bus from the first portion of the array, and to provide from the partial product bus upper bits of the product output. The multiply blocks may be non-uniform arrays, e.g., logical AND gates and full adders in all but one column, with only logical AND gates in the remaining column.
摘要:
An embodiment of a method to form a hybrid integrated circuit device is described. This embodiment of the method comprises: forming a first die using a first lithography, where the first die is on a substrate; and forming a second die using a second lithography, where the second die is on the first die. The first lithography used to form the first die is a larger lithography than the second lithography used to form the second die. The first die is an IO die.
摘要:
A columnar programmable device (PD) design converted to a columnar application specific integrated circuit-like (ASIC-like) design is described. A user design is instantiated in a PD having a columnar architecture associated with the columnar PD design. The columnar architecture has adjacent columns of circuitry, and one or more of the columns of circuitry as associated with instantiation of the user design in the PD are identified. At least a portion of one or more of the identified columns are swapped with application specific circuitry for implementing all or part of the user design for converting the columnar PD design to the columnar ASIC-like design.
摘要:
Formation of a hybrid integrated circuit device is described. A design for the integrated circuit is obtained and separated into at least two portions responsive to component sizes. A first die is formed for a first portion of the hybrid integrated circuit device using at least in part a first minimum dimension lithography. A second die is formed for a second portion of the device using at least in part a second minimum dimension lithography, where the second die has the second minimum dimension lithography as a smallest lithography used for the forming of the second die. The first die and the second die are attached to one another via coupling interconnects respectively thereof to provide the hybrid integrated circuit device.
摘要:
A cascading output structure for logic blocks in an integrated circuit. An exemplary integrated circuit includes an array of interconnected logic blocks, each including a logic circuit, an output multiplexer, and a select multiplexer. The logic circuit has an input coupled to a logic block input. The output multiplexer has first and second data inputs respectively coupled to first and second outputs of the logic circuit, a select input, and an output coupled to a logic block output. The select multiplexer has a first data input coupled to a cascade select input of the logic block, a second data input, and an output coupled to the select input of the output multiplexer. The output of the select multiplexer is also coupled to a cascade select output of the logic block. The cascade select input of the logic block is coupled to the cascade select output of an adjacent logic block.