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102 条记录 (耗时 0.045 秒)

    Different-kind-of-object detector employing plane spectrometer
    53.
    发明授权
    Different-kind-of-object detector employing plane spectrometer 有权
    采用平面光谱仪的不同种类的物体探测器

    公开(公告)号：US07812948B2

    公开(公告)日：2010-10-12

    申请号：US10576255

    申请日：2004-10-15

    申请人： Takayoshi Honda ,  Taichirou Nishiyama ,  Yasuyuki Suga

    发明人： Takayoshi Honda ,  Taichirou Nishiyama ,  Yasuyuki Suga

    IPC分类号： G01J3/28

    CPC分类号： G01N21/9508 ,  G01N21/359 ,  G01N21/85 ,  G01N2021/845 ,  G01N2201/1293

    摘要： A detector for detecting a different kind of object among objects being carried with high resolution using a plane spectrometer irradiates near-infrared ray and performs plane spectroscopy for a reflected light. The detector also detects spectral data of the reflected light and performs preprocessing for averaging and standardizing the spectral data. Then wavelength axis averaging, Lagrangian interpolation and spatial axis averaging are performed. Conversion of first-order/second-order differentiation, smoothing and calculation of the main component score on the basis of previously obtained loading vector data is also performed. Then performing judgment of a different kind of object is performed.

    摘要翻译： 用于使用平面光谱仪检测以高分辨率携带的物体中的不同种类的物体的检测器照射近红外线并对反射光进行平面光谱分析。 检测器还检测反射光的光谱数据，并进行平均化和标准化光谱数据的预处理。 然后进行波长轴平均，进行拉格朗日内插和空间轴平均。 还执行基于先前获得的加载矢量数据的一阶/二阶微分，平滑和主分量分数的计算的转换。 然后执行不同种类的对象的判断。

    Electronic device and manufacturing method of the same
    54.
    发明授权
    Electronic device and manufacturing method of the same 有权
    电子器件及其制造方法相同

    公开(公告)号：US07677905B2

    公开(公告)日：2010-03-16

    申请号：US11979968

    申请日：2007-11-13

    申请人： Takayoshi Honda

    发明人： Takayoshi Honda

    IPC分类号： H01R12/00

    CPC分类号： H05K1/116 ,  H01R12/707 ,  H01R43/0256 ,  H05K1/023 ,  H05K3/3405 ,  H05K3/3447 ,  H05K3/3484 ,  H05K2201/09381 ,  H05K2201/094 ,  H05K2201/09709 ,  H05K2201/09727 ,  H05K2201/0979 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/10757 ,  H05K2201/10787 ,  H05K2201/10803 ,  H05K2201/10871 ,  H05K2201/10901 ,  H05K2203/1178 ,  H05K2203/1394

    摘要： An electronic device includes a printed circuit board with multiple lands and through holes and an electronic element with multiple terminals on the board. Each terminal is coupled with the land through a solder. The lands include a surface land on the board and an insertion land on a sidewall of the through hole. The terminals include a branch terminal having an insertion member and a surface member. The insertion member is coupled with the insertion land through the solder. The surface member is coupled with the surface land through the solder. The surface member is parallel to the printed circuit board. The insertion member is perpendicular to the printed circuit board. The insertion member extends from a part of the surface member, which faces the surface land and disposed above the through hole.

    摘要翻译： 电子设备包括具有多个焊盘和通孔的印刷电路板以及具有多个端子的电子元件。 每个端子通过焊料与焊盘连接。 焊盘包括板上的表面焊盘和通孔的侧壁上的插入焊盘。 端子包括具有插入部件和表面部件的分支端子。 插入构件通过焊料与插入平台耦合。 表面构件通过焊料与表面焊盘连接。 表面构件平行于印刷电路板。 插入构件垂直于印刷电路板。 所述插入部件从所述表面部件的面向所述表面焊盘并设置在所述通孔的上方的一部分延伸。

    Ball grid array
    55.
    发明授权
    Ball grid array 有权
    球栅阵列

    公开(公告)号：US07586186B2

    公开(公告)日：2009-09-08

    申请号：US11656431

    申请日：2007-01-23

    申请人： Takayoshi Honda

    发明人： Takayoshi Honda

    IPC分类号： H01L23/52

    CPC分类号： H01L23/49816 ,  H01L23/49838 ,  H01L23/50 ,  H01L2224/48227 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00

    摘要： A ball grid array includes: a semiconductor chip having multiple pads; and an interposer for mounting the semiconductor chip on a first surface. The interposer includes multiple wirings on the first surface and multiple ball terminals on a second surface opposite to the first surface. Each wiring is connected to a corresponding pad of the semiconductor chip, and is electrically connected to a corresponding ball terminal. At least one of ball terminals providing a power supply terminal or a ground terminal provides a common ball terminal for connecting to at least two of the pads of the semiconductor chip through two wirings.

    摘要翻译： 球栅阵列包括：具有多个焊盘的半导体芯片; 以及用于将半导体芯片安装在第一表面上的插入器。 插入器包括第一表面上的多个布线和与第一表面相对的第二表面上的多个球形端子。 每个布线连接到半导体芯片的相应的焊盘，并且电连接到相应的球端子。 提供电源端子或接地端子的球端子中的至少一个提供了通过两条布线连接到半导体芯片的至少两个焊盘的公共球形端子。

    Electronic device
    57.
    发明授权
    Electronic device 有权
    电子设备

    公开(公告)号：US07563112B2

    公开(公告)日：2009-07-21

    申请号：US11979972

    申请日：2007-11-13

    申请人： Takayoshi Honda

    发明人： Takayoshi Honda

    IPC分类号： H01R12/00

    CPC分类号： H05K1/116 ,  H01R12/707 ,  H01R43/0256 ,  H05K1/023 ,  H05K3/3405 ,  H05K3/3447 ,  H05K3/3484 ,  H05K2201/09381 ,  H05K2201/094 ,  H05K2201/09709 ,  H05K2201/09727 ,  H05K2201/0979 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/10757 ,  H05K2201/10787 ,  H05K2201/10803 ,  H05K2201/10871 ,  H05K2201/10901 ,  H05K2203/1178 ,  H05K2203/1394

    摘要： An electronic device includes a printed circuit board having lands and an electronic element having a body and terminals. First and second lands provide a zigzag pattern. Each first land is coupled with the first terminal, and each second land is coupled with the second terminal. The second terminal includes a first parallel member, a first connection member, a second parallel member and a first mounting member. The first parallel member is completely embedded in the body, or another part of the first parallel member exposed from the body is shorter than the second parallel member. A second height between the second parallel member and the printed circuit board is smaller than a first height between the first parallel member and the printed circuit board.

    摘要翻译： 电子设备包括具有平台的印刷电路板和具有主体和端子的电子元件。 第一和第二土地提供锯齿形图案。 每个第一焊盘与第一端子耦合，并且每个第二焊盘与第二端子耦合。 第二端子包括第一平行构件，第一连接构件，第二平行构件和第一安装构件。 第一平行构件完全嵌入主体中，或者从主体露出的第一平行构件的另一部分比第二平行构件短。 第二平行构件和印刷电路板之间的第二高度小于第一平行构件和印刷电路板之间的第一高度。

    Linear solenoid control apparatus and method having increased responsiveness features
    59.
    发明授权
    Linear solenoid control apparatus and method having increased responsiveness features 失效

    公开(公告)号：US06687555B1

    公开(公告)日：2004-02-03

    申请号：US09293149

    申请日：1999-04-16

    申请人： Takayoshi Honda ,  Takamichi Kamiya

    发明人： Takayoshi Honda ,  Takamichi Kamiya

    IPC分类号： G05B2102

    CPC分类号： G05B11/28 ,  G05B19/33 ,  G05B2219/41333

    摘要： A control system and method for controlling operation of a group of linear solenoids, which in turn control operation of an electrical load such as a solenoid or actuator, that exhibits increased responsiveness to a change in the target linear solenoid load current. A microcomputer cyclically generates and outputs pulse-width-modulated drive signals based on acquired drive data to establish clock periods. A switch connected between the microcomputer and the target load switchably connects the target load to a power source based on the drive data to selectively drive the target load. A feedback loop between the target load and the microcomputer provides actual target load drive data to the microcomputer, and the microcomputer adjusts the drive signals at a rate of not more than two times per cycle based on the actual drive data to converge the actual drive data to a calculated target load drive value. The present invention also provides an apparatus that prevents a drop in controller current control responsiveness due to signal response delay produced by feedback or the drive system. A converter converts input signals to digital values at a conversion cycle shorter than a cycle of the input signals. A data storage device sequentially stores digital values obtained from the converter, and a processor calculates a mean value to fetch the stored digital values for a cycle time of the input signals, and computes an arithmetic mean of the fetched digital values for target control purposes.

    Oxygen concentration sensor element impedance detecting apparatus and method
    60.
    发明授权
    Oxygen concentration sensor element impedance detecting apparatus and method 有权
    氧浓度传感器元件阻抗检测装置及方法

    公开(公告)号：US06468478B1

    公开(公告)日：2002-10-22

    申请号：US09348254

    申请日：1999-07-07

    申请人： Takayoshi Honda

    发明人： Takayoshi Honda

    IPC分类号： G01N2704

    CPC分类号： G01N27/4175 ,  Y10T436/21

    摘要： An oxygen concentration sensor element impedance detecting apparatus and method that maintains sensor detection accuracy by shortening the sweeping time period of an element impedance detecting voltage. A sub-microcomputer performs at least two sweeping actions for switching an element application voltage Vo from a reference voltage to a sweeping voltage when it once detects the element impedance of the oxygen concentration sensor AFS, and A/D converts only one of the element application voltage Vo and an element current detecting voltage Vi during the sweep, to shorten the sweeping time period. A sensor drive circuit prevents the element application voltage Vo from being changed by the element current. Even if element application voltage Vo detection and element current detecting voltage Vi detection are performed by separate sweeps, detection results substantially identical to those of the case in which detection of those two voltages are performed during one sweep are obtained.

    摘要翻译： 一种氧浓度传感器元件阻抗检测装置和方法，其通过缩短元件阻抗检测电压的扫描时间段来保持传感器检测精度。 当一次检测到氧浓度传感器AFS的元件阻抗时，子微计算机执行用于将元件施加电压Vo从参考电压切换到扫描电压的至少两次扫描动作，并且A / D仅转换元件应用中的一个 电压Vo和扫描期间的元件电流检测电压Vi，以缩短扫描时间段。 传感器驱动电路防止元件施加电压Vo被元件电流改变。 即使通过单独的扫描执行元件施加电压Vo检测和元件电流检测电压Vi检测，也可以获得与在一次扫描期间进行这两个电压的检测的情况基本相同的检测结果。