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公开(公告)号：US06545354B1
公开(公告)日：2003-04-08
申请号：US09499599
申请日：2000-02-07
IPC分类号： H01L2940
CPC分类号： H01L23/3114 , H01L23/5223 , H01L23/5225 , H01L23/5227 , H01L23/5228 , H01L23/525 , H01L2924/0002 , H01L2924/1423 , H01L2924/19041 , H01L2924/00
摘要： In a semiconductor device such as a CSP, re-wiring is provided on a circuit element formation region of a semiconductor substrate and a columnar electrode for connection with a circuit board is provided on the re-wiring. A first insulating film is provided over the semiconductor substrate excluding a connection pad, and a ground potential layer connected to a ground potential is provided on an upper surface of the first insulating film on the circuit element formation region. A re-wiring is provided over the ground potential layer with a second insulating film interposed. Since the ground potential layer serves as a barrier layer for preventing crosstalk between the re-wiring and circuit element formation region, it is possible to eliminate crosstalk between the re-wiring and a circuit within the circuit element formation region and to freely position the re-wiring without restrictions.
摘要翻译： 在诸如CSP的半导体器件中，在半导体衬底的电路元件形成区域上设置再布线，并且在重新布线上设置用于与电路板连接的柱状电极。 在除了连接焊盘之外的半导体衬底上设置第一绝缘膜，并且在电路元件形成区域上的第一绝缘膜的上表面上设置连接到接地电位的接地电位层。 在地电位层上提供再布线，其中插入有第二绝缘膜。 由于接地电位层用作防止再布线和电路元件形成区域之间的串扰的阻挡层，因此可以消除电路元件形成区域内的再布线与电路之间的串扰，并且可以自由地定位re 接线无限制
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公开(公告)号：USD464369S1
公开(公告)日：2002-10-15
申请号：US29150151
申请日：2001-11-09
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公开(公告)号：US6014152A
公开(公告)日：2000-01-11
申请号：US859260
申请日：1997-05-20
CPC分类号： G04G15/00 , G05B19/108 , H01H9/167 , H05K5/0017 , G05B2219/23185 , G05B2219/25119 , H01H1/5805 , H01H2239/03 , Y10S345/905
摘要： A control device with improved connection between display device and printed circuit board assembly, and improved key switches having beveled keytops. Further, the control device is configured to display the mode of internal manual switches without directly accessing the internal manual switches.
摘要翻译： 具有改进的显示装置和印刷电路板组件之间的连接的控制装置，以及具有斜面键盘的改进的键开关。 此外，控制装置被配置为在不直接访问内部手动开关的情况下显示内部手动开关的模式。
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公开(公告)号：US5705856A
公开(公告)日：1998-01-06
申请号：US623990
申请日：1996-03-29
申请人： Takeshi Wakabayashi
发明人： Takeshi Wakabayashi
CPC分类号： H01L23/3171 , H01L23/293 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/50 , H01L2224/1147 , H01L2224/13099 , H01L2224/131 , H01L2224/13144 , H01L2924/0001 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01018 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/12044 , H01L2924/14
摘要： A semiconductor device has a connection electrode and protective film formed of organic material and covering the connection electrode. An opening is formed in the protective film to expose the connection electrode. A natural oxide layer is etched by argon-based dry etching. The surface layer of the protective film is altered to reduce the insulativity in the dry etching process. After a projection electrode is formed on the connection electrode later, the altered surface layer of the protective film is removed by oxygen-based dry etching. As no altered surface layer remain on the protective film, an adverse affect such as inadequate insulation does not occur.
摘要翻译： 半导体器件具有连接电极和由有机材料形成并覆盖连接电极的保护膜。 在保护膜中形成开口以露出连接电极。 通过氩基干蚀刻蚀刻天然氧化物层。 改变保护膜的表面层以降低干蚀刻工艺中的绝缘性。 在稍后在连接电极上形成突起电极之后，通过氧基干蚀刻去除保护膜的改变的表面层。 由于保护膜上没有保留改变的表面层，不会发生绝缘不良等不良影响。
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公开(公告)号：US5631673A
公开(公告)日：1997-05-20
申请号：US169137
申请日：1993-12-20
CPC分类号： G04G15/00 , G05B19/108 , H01H9/167 , H05K5/0017 , G05B2219/23185 , G05B2219/25119 , H01H1/5805 , H01H2239/03 , Y10S345/905
摘要： A control device with improved connection between display device and printed circuit board assembly, and improved key switches having beveled keytops. Further, the control device is configured to display the mode of internal manual switches without directly accessing the internal manual switches.
摘要翻译： 具有改进的显示装置和印刷电路板组件之间的连接的控制装置，以及具有斜面键盘的改进的键开关。 此外，控制装置被配置为在不直接访问内部手动开关的情况下显示内部手动开关的模式。
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公开(公告)号：US5108950A
公开(公告)日：1992-04-28
申请号：US617399
申请日：1990-11-20
IPC分类号： H01L21/60 , H01L23/485
CPC分类号： H01L24/12 , H01L24/11 , H01L2224/03912 , H01L2224/0401 , H01L2224/1147 , H01L2224/13019 , H01L2224/13099 , H01L24/16 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/19041 , Y10S148/131
摘要： A bump electrode structure of a semiconductor device comprises an electrode pad formed of an aluminum alloy, an insulating oxide layer covering only the peripheral edge portion of the electrode pad, an under-bump layer formed of an alloy of titanium and tungsten, and a bump electrode formed of gold. The titanium-tungsten alloy functions both as a barrier metal and as a bonding metal. The bump electrode rises substantially straight from the bonding surface of the under-bump layer, and its top portion has an area only substantially equal to that of the electrode pad. Fine V-shaped grooves are formed on the top surface of the bump electrode by anisotropic etching. Thus, the semiconductor device with fine electrode pad pitches is provided with a high-reliability bump electrode structure which ensures sufficient bonding strength between internal and external electrodes.
摘要翻译： 半导体器件的突起电极结构包括由铝合金形成的电极焊盘（13），仅覆盖电极焊盘（13）的周缘部分的绝缘氧化物层（14），凸块下部（15） 由钛和钨的合金形成，以及由金形成的凸块电极（16）。 钛钨合金既用作阻挡金属又用作接合金属。 突起电极（16）从下凸块层（15）的接合表面基本上直线上升，并且其顶部部分具有仅与电极焊盘（13）的面积大致相等的面积。 通过各向异性蚀刻在凸块电极（16）的顶表面上形成细的V形槽（17）。 因此，具有精细电极焊盘间距的半导体器件设置有高可靠性的凸起电极结构，其确保内部和外部电极之间的充分的接合强度。
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57.发明授权
公开(公告)号：US4395334A
公开(公告)日：1983-07-26
申请号：US362605
申请日：1982-03-29
申请人： Yasuyuki Nakabayashi , Yoshio Matsuura , Michio Kurihara , Takao Kamei , Akira Nakamura , Keiichi Komai , Akira Shimotamari , Takeshi Wakabayashi
发明人： Yasuyuki Nakabayashi , Yoshio Matsuura , Michio Kurihara , Takao Kamei , Akira Nakamura , Keiichi Komai , Akira Shimotamari , Takeshi Wakabayashi
摘要： In a non-evaporating dehydration of brown coal, the coal is crushed and classified into lumps and fine particles. The lumps of coal are subjected to a non-evaporating dehydration in which waste water is produced. The waste water is contacted with the fine particles of coal so that components which affect the COD value of the water are absorbed by the coal particles. The coal particles are then burnt to produce saturated steam which is used in the non-evaporating dehydration.
摘要翻译： 在褐煤的非蒸发脱水中，煤被粉碎并分成块状和细颗粒。 煤块经受非蒸发脱水，其中产生废水。 废水与煤的细颗粒接触，使得影响水的COD值的组分被煤颗粒吸收。 然后将煤颗粒燃烧以产生用于非蒸发脱水的饱和蒸汽。
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公开(公告)号：US08525335B2
公开(公告)日：2013-09-03
申请号：US12828492
申请日：2010-07-01
IPC分类号： H01L23/48 , H01L23/485
CPC分类号： H01L24/49 , H01L21/561 , H01L21/6835 , H01L23/28 , H01L23/3114 , H01L23/3128 , H01L23/49838 , H01L23/50 , H01L23/525 , H01L23/5389 , H01L24/09 , H01L24/14 , H01L24/19 , H01L24/27 , H01L24/28 , H01L24/29 , H01L24/48 , H01L24/83 , H01L24/97 , H01L2224/04042 , H01L2224/04105 , H01L2224/05599 , H01L2224/12105 , H01L2224/20 , H01L2224/274 , H01L2224/2919 , H01L2224/48151 , H01L2224/48491 , H01L2224/49 , H01L2224/73267 , H01L2224/83191 , H01L2224/83855 , H01L2224/83856 , H01L2224/85399 , H01L2224/92244 , H01L2224/94 , H01L2224/97 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/12042 , H01L2924/14 , H01L2924/15173 , H01L2924/15311 , H01L2924/19043 , H01L2224/82 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2224/45099 , H01L2224/214
摘要： A semiconductor construct includes a semiconductor substrate and connection pads provided on the semiconductor substrate. Some of the connection pads are connected to a common wiring and at least one of the remaining of the connection pads are connected to a wiring. The construct also includes a first columnar electrode provided to be connected to the common wiring and a second columnar electrode provided to be connected to a connection pad portion of the wiring.
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公开(公告)号：US20120230052A1
公开(公告)日：2012-09-13
申请号：US13381010
申请日：2011-03-23
申请人： Takeshi Wakabayashi , Kazuto Ishida
发明人： Takeshi Wakabayashi , Kazuto Ishida
IPC分类号： G09F13/04
CPC分类号： G09F23/0058 , G02B6/0036 , G02B6/0061 , G02B6/0081 , G02F1/133308 , G02F1/133603 , G02F1/133615 , G09F9/35 , G09F2013/222
摘要： An LCD indicator unit contains an LCD indicator with a display portion that includes set temperature and current temperature display portions, a diffusion sheet disposed on the rear surface side of the LCD indicator, a reflective frame body disposed on the rear surface side of the diffusion sheet, a light guide plate disposed on the rear surface side of the reflective frame body such that an outer peripheral portion thereof is covered with the reflective frame body, and an LCD indicator control substrate disposed on the rear surface side of the light guide plate, with LEDs serving as light sources for the LCD indicator mounted on a right-side outer peripheral portion on the front surface side of the LCD indicator control substrate. Light emitted from the LEDs is caused to enter a side wall surface portion of the light guide plate to irradiate the display portion of the LCD indicator.
摘要翻译： LCD指示器单元包括具有显示部分的LCD指示器，该显示部分包括设定温度和当前温度显示部分，设置在LCD指示器的后表面侧的漫射片，设置在漫射片的背面侧的反射框架体 导光板，设置在反射框体的后表面侧，使得其外周部分被反射框体覆盖;以及LCD指示器控制基板，设置在导光板的后表面侧， 用作LCD指示器的光源的LED，其安装在LCD指示器控制基板的前表面侧的右侧外周部分上。 使从LED发射的光进入导光板的侧壁表面部分，以照射LCD指示器的显示部分。
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公开(公告)号：US20120046277A1
公开(公告)日：2012-02-23
申请号：US13255366
申请日：2010-03-09
IPC分类号： A61K31/496 , C07D405/14 , C07D413/10 , A61P25/00 , C07D493/10 , A61K31/551 , A61K31/506 , A61P25/28 , C07D405/10 , A61K31/5377
CPC分类号： C07D307/79 , C07D307/80 , C07D307/81 , C07D405/04 , C07D405/12 , C07D405/14 , C07D407/04 , C07D407/12 , C07D413/04 , C07D413/12 , C07D417/12 , C07D493/10
摘要： The present invention provides a compound represented by the following formula (I): wherein: Ring A represents an optionally substituted piperazine ring, an optionally substituted morpholine ring, or an optionally substituted bromopiperazine ring; R1 and R2 are the same or different from each other, and represent a hydrogen atom or optionally substituted lower alkyl; R3 and R4 are the same or different from each other, and represent a hydrogen atom or halogenated or non-halogenated lower alkyl; R3 to R7 are the same or different from each other, and represent a hydrogen atom, hydroxy, optionally substituted lower alkyl, optionally substituted lower alkenyl, optionally substituted lower alkoxy, optionally substituted cycloakyl, optionally substituted aryl, an optionally substituted aromatic heterocyclic ring, optionally substituted amino, or acyl; and represents a single bond or double bond, wherein R2 and R3 do not exist when carbon atoms respectively adjacent to R2: and R3 form a double bond, and there is no case where all of R1 to R7 are hydrogen atoms, and R1 and R2; may form a ring together with an adjacent carbon atom; or a salt thereof.
摘要翻译： 本发明提供由下式（I）表示的化合物：其中：环A表示任选取代的哌嗪环，任选取代的吗啉环或任选取代的溴代哌嗪环; R1和R2彼此相同或不同，表示氢原子或任选取代的低级烷基; R3和R4彼此相同或不同，表示氢原子或卤代或非卤代低级烷基; R 3至R 7彼此相同或不同，并且表示氢原子，羟基，任选取代的低级烷基，任选取代的低级烯基，任选取代的低级烷氧基，任选取代的环烷基，任选取代的芳基，任选取代的芳族杂环， 任选取代的氨基或酰基; 并且表示单键或双键，其中当分别相邻于R2：和R3的碳原子形成双键时，R2和R3不存在，并且不存在所有R 1至R 7都是氢原子的情况，并且R 1和R 2 ; 可与邻近的碳原子一起形成环; 或其盐。
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