摘要:
A production method of a multi-layer printed wiring board containing the following steps (1)-(5): (1) a temporary fitting preparatory step including conveying an adhesive sheet from an adhesive sheet roll wherein an adhesive sheet having a prepreg formed on a support film is wound in a roll and placing the adhesive sheet such that a prepreg surface contacts one or both of the surfaces of a circuit board, (2) a temporary fitting step for temporarily fitting the adhesive sheet to the circuit board, including partially adhering the adhesive sheet to the circuit board by heating and pressing a part of the adhesive sheet from the support film side, and cutting the adhesive sheet according to the size of the circuit board with a cutter, (3) a laminating step including heating and pressing the temporarily fitted adhesive sheet under reduced pressure to laminate the adhesive sheet on the circuit board, (4) a thermal curing step including forming an insulating layer by thermally curing the prepreg, and (5) a detaching step including detaching the support film after the thermal curing step, enables continuous production of an insulating layer of a multi-layer printed wiring board with a prepreg and without using a single wafer.
摘要:
Any one of the reversing portions of the flat cables is positioned in the sighting window when the inner case is in the neutral state. A prescribed mark is attached to the reversing portion which is positioned in the sighting window when the inner case is in the neutral state. Thus, it can be determined that the inner case is in the neutral state when the prescribed mark is attached to the reversing portion sighted through the sighting window.
摘要:
Embodiments of the present invention include A head suspension assembly for a data storage device comprising a load beam and a Femto flexure coupled to the load beam, wherein the Femto flexure is a laminate structure comprising a support layer, the flexure comprising a plurality of symmetrical flexure legs, each of the flexure legs substantially hourglass shaped.
摘要:
Resin compositions which comprise the following components (A) to (E) are useful for interlayer insulation of a multilayer printed wiring board: (A) an epoxy resin having 2 or more epoxy group in one molecule and which exists in a liquid state at a temperature of 20° C.; (B) an aromatic epoxy resin having 3 or more epoxy groups in one molecule and an epoxy equivalent of 200 or less; (C) a phenol type curing agent; (D) one or more resins selected from the group consisting of a phenoxy resin, a polyvinyl acetal resin, a polyamide resin, a polyamideimide resin, and mixtures thereof, and having a glass transition temperature of 100° C. or more; and (E) an inorganic filler.
摘要:
A head assembly for a data storage device. The head assembly has a suspension. The head assembly also includes a contact pad coupled to the suspension. The head assembly also includes a slider. The slider is coupled to the suspension at the slider mounting point. The slider mounting point is at least partially bounded by polyimide standoffs. The polyimide standoffs are positioned and sized to provide an adhesive pocket with an increased area.
摘要:
A fixing structure of a rod and a synthetic resin component in which an inserting part (6) of a rod (2) having widened rear side is formed in a synthetic resin component (3) and a stopper (7) projecting obliquely rearward from the inner surface of the inserting part (6) is provided in the rear side thereof in order to solve the problem of a prior art that the rod is not integral with the synthetic resin component fixed to the forward end of the rod. On the other hand, a recess (8) for stopping the forward end of the stopper (7) is formed in the side face at the forward end of the rod (2) and a part (10) for regulating the forward end position of the rod (2) is provided in the rear of the inserting part (6). The position regulating part (10) prevents or extremely minimizes upward fine movement of the synthetic resin component (3) with respect to the rod (2) and the stopper (7) prevents downward fine movement of the synthetic resin component (3) with respect to the rod (2).
摘要:
The present invention is directed to an inter-laminar adhesive composition containing a liquid epoxy resin, a polyfunctional epoxy resin having a softening point higher than a lamination temperature of the adhesive and with two or more epoxy groups within the molecule; and a latent epoxy curing agent initiating a reaction at a temperature higher than the lamination temperature. The adhesive composition optionally contains a liquid resin other than the liquid epoxy resin and/or an organic solvent and the liquid resin includes the liquid epoxy resin, the organic solvent or both constituting from 10 to 55% by weight of the composition.This inter-laminar adhesive composition allows for the preparation of a multi-layer printed wiring board. The process for preparing the multi-layer printed wiring board is provided. The resulting multi-layer printed wiring board of the invention possesses excellent embedding properties in the internal-layer circuit, excellent surface smoothness and can be provided at high productivity levels in a building up process using the present adhesive.
摘要:
When a front fog lamp and a rear fog lamp are turned on by swinging an operating knob 4, a holder 18 climbs up to the crest portion 13b of a cam 13 and brings the tip of an engaging piece 22 into contact with the edge face of a coupling member 41. When an operating knob 5 is swung from an OFF position to an AUTO position in this state, the engaging piece 22 is urged by a coil spring 21 to resiliently stick into an arcuate engaging hole 45. When the operating knob 5 is swung back to the OFF position, an operating knob 4 is swung back by the engaging piece 22 in an interlocking mode. Then the holder 18 climbs down from the crest 13b of the cam 13 and causes the rear fog lamp to be turned off and only the front fog lamp is held ON.
摘要:
An alkali soluble resin and a resin composition thereof useful as a solder resist, having good adhesive properties, solder heat resistance, and plating resistance are provided. Particular resistance to plating under alkaline conditions is provided by the invention.