公开(公告)号：US07034343B1

公开(公告)日：2006-04-25

申请号：US11085534

申请日：2005-03-21

申请人： Jin Ha Kim ,  Hun Joo Hahm ,  Hyung Suk Kim ,  Jin Jong Kim ,  Joo Hee Jun ,  Sang Hyuck Lee ,  Chon Su Kyong ,  Ho Seop Jeong

发明人： Jin Ha Kim ,  Hun Joo Hahm ,  Hyung Suk Kim ,  Jin Jong Kim ,  Joo Hee Jun ,  Sang Hyuck Lee ,  Chon Su Kyong ,  Ho Seop Jeong

IPC分类号： H01L31/12

CPC分类号： H01L33/54 ,  H01L33/60

摘要： The present invention relates to a dipolar LED and a dipolar LED module incorporating the same, in which an upper hemisphere-shaped base houses an LED chip therein and adapted to radiate light from the LED chip to the outside, and a pair of reflecting surfaces placed at opposed top portions of the base in a configuration symmetric about an imaginary vertical plane. The vertical plane passes through the center of the LED chip perpendicularly to a light-emitting surface of the LED chip. The reflecting surfaces are extended upward away from the top portions of the base to reflect light from the LED chip away from the imaginary vertical plane. A pair of radiating surfaces are placed outside the reflecting surfaces, respectively, to radiate light from the reflecting surfaces to the outside. In this way, light emission from the LED chip can be concentrated in both lateral directions.

摘要翻译： 本发明涉及一种双极性LED和包括其的双极LED模块，其中上半球形基座容纳LED芯片并适于将来自LED芯片的光辐射到外部，并且一对反射表面被放置 在基部的相对的顶部部分处于关于假想垂直平面对称的构造中。 垂直平面通过LED芯片的中心垂直于LED芯片的发光表面。 反射面向上延伸离开基座的顶部，以将来自LED芯片的光反射离开虚拟垂直平面。 一对辐射表面分别放置在反射表面的外侧，以将来自反射表面的光辐射到外部。 以这种方式，来自LED芯片的光发射可以集中在两个横向上。

公开(公告)号：US20110127558A1

公开(公告)日：2011-06-02

申请号：US12944401

申请日：2010-11-11

申请人： Young Sam PARK ,  Hun Joo Hahm

发明人： Young Sam PARK ,  Hun Joo Hahm

IPC分类号： H01L33/58 ,  H01L33/48

CPC分类号： H01L33/54 ,  H01L24/97 ,  H01L33/505 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/8592 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00

摘要： There is provided a light emitting diode package and a method of manufacturing the same. A light emitting diode package according to an aspect of the invention may include: an LED chip; a body part having the LED chip mounted thereon; a pair of reflective parts extending from the body part to face each other while interposing the LED chip therebetween, and reflecting light emitted from the LED chip; and a molding part provided between the pair of reflective parts to encapsulate the LED chip and having a top surface whose central region is curved inwards.

摘要翻译： 提供一种发光二极管封装及其制造方法。 根据本发明的一个方面的发光二极管封装可以包括：LED芯片; 具有安装在其上的LED芯片的主体部分; 一对反射部件，其从身体部分延伸到彼此面对，同时插入LED芯片，并且反射从LED芯片发射的光; 以及设置在所述一对反射部件之间的模制部件，以封装所述LED芯片并具有其中心区域向内弯曲的顶表面。

公开(公告)号：US07914194B2

公开(公告)日：2011-03-29

申请号：US12071836

申请日：2008-02-27

申请人： Jung Kyu Park ,  Hun Joo Hahm ,  Chul Hee Yoo ,  Young June Jeong ,  Young Sam Park ,  Seong Yeon Han

发明人： Jung Kyu Park ,  Hun Joo Hahm ,  Chul Hee Yoo ,  Young June Jeong ,  Young Sam Park ,  Seong Yeon Han

IPC分类号： F21V7/04

CPC分类号： H05K1/053 ,  G02F1/133603 ,  G02F2001/133612 ,  H05K1/092 ,  H05K3/1216 ,  H05K3/125 ,  H05K2201/10106 ,  H05K2203/013

摘要： There is provided a backlight unit including: a chassis having an insulating layer formed on a top thereof; a circuit pattern formed on the insulating layer; a plurality of light emitting diodes formed on the insulating layer to electrically connect to the circuit pattern.

摘要翻译： 提供了一种背光单元，包括：具有形成在其顶部上的绝缘层的底架; 形成在绝缘层上的电路图案; 多个发光二极管形成在绝缘层上以电连接到电路图案。

公开(公告)号：US20080061458A1

公开(公告)日：2008-03-13

申请号：US11896975

申请日：2007-09-07

申请人： Young Sam Park ,  Hun Joo Hahm ,  Seong Yeon Han ,  Chul Hee Yoo

发明人： Young Sam Park ,  Hun Joo Hahm ,  Seong Yeon Han ,  Chul Hee Yoo

IPC分类号： B29D11/00 ,  B28B7/36

CPC分类号： B29D11/00278 ,  B29C33/62 ,  G02B3/0031 ,  G02B3/0037

摘要： There is provided a mold formed of fluorocarbon resin to prevent a resin, which is a material of a lens of a LED package, from adhering to the mold even without using a separate release film, and a method of manufacturing the light emitting package using the mold. The mold includes a plurality of cavities formed in an upper surface thereof to hold a resin for forming lenses of the light emitting diode package. The mold and the method using the mold prevents adherence of the resin without using a separate release film, allowing formation of a lens with a smooth surface and formation of a protrusion or an indentation on the surface of the lens.

摘要翻译： 提供一种由碳氟树脂形成的模具，以防止作为LED封装的透镜的材料的树脂即使不使用单独的脱模膜也粘附到模具上，以及使用该方法制造发光封装 模子。 模具包括形成在其上表面中的多个空腔，以容纳用于形成发光二极管封装的透镜的树脂。 使用模具的模具和方法防止树脂粘附，而不使用单独的脱模膜，允许形成具有光滑表面的透镜并在透镜表面上形成突起或凹陷。

公开(公告)号：US20080007939A1

公开(公告)日：2008-01-10

申请号：US11822331

申请日：2007-07-05

申请人： Won Joon Lee ,  In Tae Yeo ,  Hun Joo Hahm ,  Young Sam Park ,  Kyung Taeg Han ,  Ho Sik Ahn ,  Chang Ho Song

发明人： Won Joon Lee ,  In Tae Yeo ,  Hun Joo Hahm ,  Young Sam Park ,  Kyung Taeg Han ,  Ho Sik Ahn ,  Chang Ho Song

IPC分类号： G09F13/04

CPC分类号： G02F1/133603 ,  H01L33/52 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2933/005 ,  H01L2224/0401

摘要： In a direct-type backlight unit, a board has upper and lower surfaces defining a thickness therebetween. A plurality of unit light sources are disposed on the board. Here, in each of the unit light sources, a wiring pattern is formed on the board. A light emitting device is disposed on the wiring pattern to electrically connect thereto. A non-conductive side wall surrounds, without interruption, the light emitting device at a predetermined interval therefrom, the non-conductive side wall having a height lower than that of the light emitting device. Also, an encapsulant is formed in a dome shape inside the side wall. In this fashion, the light emitting devices are mounted on the board by a chip-on-board technique.

摘要翻译： 在直接型背光单元中，板具有限定其间厚度的上表面和下表面。 多个单元光源设置在板上。 这里，在各单位光源中，在基板上形成配线图案。 发光器件设置在布线图案上以与其电连接。 非导电侧壁以不间断的方式围绕发光器件以预定的间隔包围，非导电侧壁的高度低于发光器件的高度。 此外，密封剂在侧壁内形成为圆顶形状。 以这种方式，发光器件通过板上芯片技术安装在板上。

公开(公告)号：US08680585B2

公开(公告)日：2014-03-25

申请号：US12944401

申请日：2010-11-11

申请人： Young Sam Park ,  Hun Joo Hahm

发明人： Young Sam Park ,  Hun Joo Hahm

IPC分类号： H01L27/148

CPC分类号： H01L33/54 ,  H01L24/97 ,  H01L33/505 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/8592 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2924/00

摘要： There is provided a light emitting diode package and a method of manufacturing the same. A light emitting diode package according to an aspect of the invention may include: an LED chip; a body part having the LED chip mounted thereon; a pair of reflective parts extending from the body part to face each other while interposing the LED chip therebetween, and reflecting light emitted from the LED chip; and a molding part provided between the pair of reflective parts to encapsulate the LED chip and having a top surface whose central region is curved inwards.

摘要翻译： 提供一种发光二极管封装及其制造方法。 根据本发明的一个方面的发光二极管封装可以包括：LED芯片; 具有安装在其上的LED芯片的主体部分; 一对反射部件，其从身体部分延伸到彼此面对，同时插入LED芯片，并且反射从LED芯片发射的光; 以及设置在所述一对反射部件之间的模制部件，以封装所述LED芯片并具有其中心区域向内弯曲的顶表面。

公开(公告)号：US07875476B2

公开(公告)日：2011-01-25

申请号：US12612268

申请日：2009-11-04

申请人： Seon Goo Lee ,  Hun Joo Hahm ,  Jung Kyu Park ,  Kyung Taeg Han ,  Seong Yeon Han ,  Dae Yeon Kim ,  Young Sam Park

发明人： Seon Goo Lee ,  Hun Joo Hahm ,  Jung Kyu Park ,  Kyung Taeg Han ,  Seong Yeon Han ,  Dae Yeon Kim ,  Young Sam Park

IPC分类号： H01L21/00

CPC分类号： H01L33/642 ,  H01L33/486 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2924/00014

摘要： An LED diode package includes a heat connecting part for mounting a light emitting part on an upper surface thereof, frames electrically connected to the light emitting part while holding the heat connecting part and a molded part fixing the heat connecting part and the frames together. The light emitting part generates light in response to current applied thereto, and the upper surface of the heat connecting part is protruded beyond an upper surface of the molded part to a predetermined height. This can optimize the unique beam angle of the light source thereby to maximize lighting efficiency as well as prevent overflow of the encapsulating material in the assembling process of the lens, which may otherwise soil adjacent components.

摘要翻译： LED二极管封装包括用于在其上表面上安装发光部分的热连接部分，同时保持热连接部分电连接到发光部分的框架和将热连接部分和框架固定在一起的模制部件。 发光部分响应于施加到其上的电流产生光，并且热连接部分的上表面超过模制部件的上表面突出到预定高度。 这可以优化光源的唯一光束角度，从而使照明效率最大化，并且防止在透镜的组装过程中封装材料的溢出，否则可能会污染相邻的部件。

公开(公告)号：US20050263785A1

公开(公告)日：2005-12-01

申请号：US10916525

申请日：2004-08-12

申请人： Hyung Kim ,  Young Sam Park ,  Hun Joo Hahm ,  Jung Park ,  Young Jeong

发明人： Hyung Kim ,  Young Sam Park ,  Hun Joo Hahm ,  Jung Park ,  Young Jeong

IPC分类号： G02F1/13357 ,  H01L29/22 ,  H01L33/54 ,  H01L33/60 ,  H01L33/00

CPC分类号： H01L33/54 ,  H01L33/60

摘要： Disclosed herein is a light emitting diode (LED) device. The light emitting diode device comprises a package formed with a terminal for applying an electrical signal, one or more LED chips mounted on the package such that the LED chips are electrically connected to the terminal, a lens formed to surround the LED chips on the package for changing path of light emitted from the LED chips to the horizontal direction with the difference of the refraction rates of the media, and a reflector formed on the lens for reflecting the light, emitted above the lens without being refracted in the horizontal direction at the lens, to the horizontal direction. The LED device reflects the light, which is deviated from the optical design range of the lens and emitted above the lens, back to the lens, thereby preventing the hot spot from being generated, and enhancing horizontal emission efficiency of the light.

摘要翻译： 这里公开了一种发光二极管（LED）装置。 发光二极管装置包括形成有用于施加电信号的端子的封装，安装在封装上的一个或多个LED芯片，使得LED芯片电连接到端子，形成为围绕封装上的LED芯片的透镜 用于随着介质的折射率的差异而将从LED芯片发射的光的路径改变到水平方向，以及形成在透镜上的用于反射透镜的反射器的反射器，而不是在透镜的上方沿水平方向折射 镜头，水平方向。 LED装置将从透镜的光学设计范围偏离的光反射回透镜，从而防止产生热点，提高光的水平发光效率。

公开(公告)号：US20110031526A1

公开(公告)日：2011-02-10

申请号：US12907348

申请日：2010-10-19

申请人： Kyung Taeg Han ,  In Tae Yeo ,  Hun Joo Hahm ,  Chang Ho Song ,  Seong Yeon Han ,  Yoon Sung Na ,  Dae Yeon Kim ,  Ho Sik Ahn ,  Young Sam Park

发明人： Kyung Taeg Han ,  In Tae Yeo ,  Hun Joo Hahm ,  Chang Ho Song ,  Seong Yeon Han ,  Yoon Sung Na ,  Dae Yeon Kim ,  Ho Sik Ahn ,  Young Sam Park

IPC分类号： H01L33/62

CPC分类号： H01L33/62 ,  H01L33/486 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

摘要： An LED package and a fabrication method therefor. The LED package includes first and second lead frames made of heat and electric conductors, each of the lead frames comprising a planar base and extensions extending in opposed directions and upward directions from the base. The package also includes a package body made of a resin and configured to surround the extensions of the first and second lead frames to fix the first and second lead frames while exposing underside surfaces of the first and second lead frames. The LED package further includes a light emitting diode chip disposed on an upper surface of the base of the first lead frame and electrically connected to the bases of the first and second lead frames, and a transparent encapsulant for encapsulating the light emitting diode chip.

摘要翻译： 一种LED封装及其制造方法。 LED封装包括由热和电导体制成的第一引线框架和第二引线框架，每个引线框架包括平面基座和从基座向相反方向和向上方向延伸的延伸部分。 封装还包括由树脂制成的封装主体，并且被配置为围绕第一引线框架和第二引线框架的延伸部分以固定第一和第二引线框架同时暴露第一引线框架和第二引线框架的下侧表面。 LED封装还包括设置在第一引线框架的基座的上表面上并电连接到第一引线框架和第二引线框架的基座的发光二极管芯片，以及用于封装发光二极管芯片的透明密封剂。

公开(公告)号：US07833811B2

公开(公告)日：2010-11-16

申请号：US12155961

申请日：2008-06-12

申请人： Kyung Taeg Han ,  Myoung Soo Choi ,  Seon Goo Lee ,  Hun Joo Hahm ,  Seong Yeon Han ,  Chang Ho Song ,  Young Sam Park

发明人： Kyung Taeg Han ,  Myoung Soo Choi ,  Seon Goo Lee ,  Hun Joo Hahm ,  Seong Yeon Han ,  Chang Ho Song ,  Young Sam Park

IPC分类号： H01L27/15 ,  H01L29/24

CPC分类号： H01L33/54 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2924/00014

摘要： The invention relates to a side-emitting LED package and a manufacturing method thereof. The side-emitting LED package includes a substrate with an electrode formed thereon, and a light source disposed on the substrate and electrically connected to the electrode. The side-emitting LED package also includes a molded part having an upper surface with a center thereof depressed concavely, covering and protecting the substrate and the light source, and a reflection layer covering an entire upper surface of the molded part to reflect light sideward from the molded part which forms a light transmitting surface. The package is not restricted in the shape of the molded part and is not affected by the LED chip size, enabling a compact structure. The invention can also process a substrate by a PCB process, enabling mass-production.

摘要翻译： 本发明涉及一种侧面发光LED封装及其制造方法。 侧发光LED封装包括其上形成有电极的基板和设置在基板上并与电极电连接的光源。 侧发光LED封装还包括具有上表面的模制部件，其中心凹陷地凹陷，覆盖和保护基板和光源，以及覆盖模制部件的整个上表面的反射层，以将光从侧向反射 模制部件形成透光表面。 封装不限制成型件的形状，不受LED芯片尺寸的影响，从而实现了紧凑的结构。 本发明还可以通过PCB工艺处理衬底，从而实现批量生产。